OL-CBQ17 – 17-Inch Semi-Automatic IC Removal Machine
Precision Thermal Decomposition System for Safe and Efficient COG/ IC Recovery
The OL-CBQ17 by Olian Automatic Equipment Co., Ltd. is a semi-automatic IC removal machine designed for the safe, controlled detachment of COG (Chip-on-Glass) integrated circuits from LCD panels up to 17 inches. It uses localized heating and vacuum-assisted lift-off to recover defective or obsolete ICs—minimizing damage to the underlying glass substrate and enabling cost-effective rework or recycling.
This system is ideal for display module repair centers, R&D labs, and pilot production lines where yield recovery and component reuse are priorities.
The operator places the LCD panel on the worktable and secures it using a Φ24 mm vacuum button. They then position the custom hot press head directly over the target IC. Using a live monitor feed (with optional magnification), they align the head precisely.
After confirming alignment, the operator presses both dual-hand start buttons—a key safety feature that prevents accidental activation. The press head then descends and heats the IC area to a preset temperature (up to 400°C). Once the ACF (Anisotropic Conductive Film) softens, a gentle upward vacuum pulse or mechanical lift detaches the chip cleanly.
The entire cycle takes less than 10 seconds per IC, ensuring high throughput without thermal stress on surrounding components.
The machine supports 1x or 2x optical magnification via interchangeable lenses:
This allows operators to clearly view fine-pitch alignment marks during setup—critical for narrow-gap COG ICs commonly used in modern displays.
The OL-CBQ17 is built with full ESD protection:
These features protect sensitive display components from electrostatic discharge damage.
The machine includes multiple safety layers:
Control is managed via a PLC system and a color touchscreen interface, enabling easy parameter setup and monitoring.
The system supports two user levels:
This ensures process consistency while preventing unauthorized changes.
Olian provides one Chinese-language operation manual. On-site training lasts one day and covers:
Training duration can be adjusted by mutual agreement.
The machine carries a 12-month warranty under normal use. Consumable parts (e.g., heating elements, press heads) are excluded. Damage from misuse or force majeure is not covered. During the warranty period, if remote support fails, an engineer will arrive on-site within 72 hours. Lifetime technical support is available beyond the warranty term.
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OL-CRW017-4 – 17-Inch COF-to-FPC Automatic Bonding Machine (Quad-Camera, A+P+M)
High-Speed Precision Bonder for Multi-Segment Flexible Circuit Assembly
The OL-CRW017-4 by Olian Automatic Equipment Co., Ltd. is a high-performance automatic bonding machine engineered for precise thermal compression of COF (Chip-on-Film) to FPC (Flexible Printed Circuit) modules up to 17 inches. Featuring four high-resolution cameras and full A+P+M (Alignment + Pre-press + Main-press) functionality, it delivers consistent, high-yield bonding for demanding display and electronics manufacturing.
This system is ideal for mass production of driver boards, touch modules, and automotive displays where multi-point COF-to-FPC connections require micron-level accuracy and process repeatability.
Equipped with four independent cameras, the OL-CRW017-4 enables simultaneous alignment at multiple bonding zones. Each camera provides real-time video feed with adjustable magnification and coaxial LED lighting—ensuring clear visibility of alignment marks even on dark or reflective surfaces.
Operators perform initial rough placement manually. Fine alignment is then verified visually via monitors. Once alignment is confirmed as “OK,” the operator initiates the cycle using a dual-hand start mechanism—a critical safety feature that prevents accidental activation during setup.
The machine executes a complete three-stage bonding sequence:
Temperature is adjustable from room temperature to 400°C, with press head surface uniformity held within ±5°C. Bonding time ranges from 0.1 to 99.9 seconds. Force output is precisely regulated to suit delicate flex materials—minimizing risk of damage.
Standard press heads are made of high-wear tungsten steel. Custom dimensions are available for specialized applications.
The OL-CRW017-4 uses a manual loading/unloading approach for maximum flexibility. Operators place the FPC on the worktable and secure it via vacuum. They then position the COF(s) and align them visually. After bonding, they remove the finished module and repeat.
All operations occur from a single front position—enhancing ergonomics and reducing cycle time. The platform includes dense vacuum channels to hold thin FPCs flat during bonding.
The machine includes essential manual controls:
A three-color signal tower (red/yellow/green) provides instant status feedback: ready, running, or fault. These physical controls ensure reliability in industrial environments—even without complex software interfaces.
Olian provides one Chinese-language operation manual. On-site training lasts one day and covers:
Training duration can be adjusted by mutual agreement.
The machine carries a 12-month warranty under normal operating conditions. Consumable parts and damage from misuse or force majeure are excluded. During the warranty period, if remote troubleshooting fails, an engineer will arrive on-site within 72 hours. Lifetime technical support is available beyond the warranty term.
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OL-CRW017-2 – 17-Inch COG/COF Automatic Repair Machine (Dual-Camera, A+P+M)
High-Precision Rework System for Defective COG and COF Bonds on Large LCD Panels
The OL-CRW017-2 by Olian Automatic Equipment Co., Ltd. is an advanced automatic repair machine designed for reworking defective COG (Chip-on-Glass) and COF (Chip-on-Film) bonds on display modules up to 17 inches. Equipped with two high-resolution cameras and supporting A+P+M (Alignment + Pre-press + Main-press) functionality, it enables precise, repeatable thermal re-bonding without damaging surrounding components.
This system is ideal for display module manufacturers, quality control centers, and repair lines where yield recovery and process consistency are critical. It handles both COG ICs and COF flex circuits—making it a versatile solution for modern LCD and touch panel production.
The machine features two independent camera channels, each with adjustable magnification and coaxial LED lighting. Operators use live video feeds to align bonding marks before repair. The dual-view setup allows simultaneous inspection of chip and pad alignment from optimal angles—reducing parallax error and improving rework success rates.
All alignment is performed manually via intuitive controls. Once alignment is confirmed as “OK,” the operator initiates the cycle using a dual-hand start mechanism—a key safety feature that prevents accidental activation.
The OL-CRW017-2 executes a complete three-stage thermal rework sequence:
Temperature is adjustable from room temperature to 400°C, with surface uniformity maintained within ±5°C across the press head. Bonding time ranges from 0.1 to 99.9 seconds. Force output is precisely controlled to match material sensitivity—preventing glass cracking or flex damage.
Standard press heads are made of wear-resistant tungsten steel. Custom sizes are available upon request.
The machine includes multiple safety layers:
These features ensure safe operation in busy production environments.
The system supports panels up to 17 inches with standard thicknesses used in industrial and consumer displays. It requires a clean, static-controlled workspace with stable temperature and humidity. Compressed air must be clean, dry, and supplied at 0.4–0.7 MPa. Power input is single-phase AC 220V ±10%.
The machine frame is robust and finished in industrial-grade coating. All moving parts use precision linear guides and servo-driven actuators for smooth, repeatable motion.
Olian provides one Chinese-language operation manual. On-site training lasts one day and covers:
Training duration can be adjusted by mutual agreement.
The machine comes with a 12-month warranty under normal use. Damage caused by misuse, improper environment, or force majeure is excluded. During the warranty period, if remote support fails, an engineer will arrive on-site within 72 hours. Lifetime technical support is available beyond the warranty term.
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Integrated Thermal Compression Platform for Both FOG and FOB Processes with Sequential Rework Capability
The OL-FF-173 by Olian Automatic Equipment Co., Ltd. is a versatile semi-automatic bonding machine designed for medium-sized display modules up to 17.3 inches. It uniquely supports both FOG (Film-on-Glass) and FOB (Film-on-Board) processes—including pre-bonding, main bonding, and rework functions—all within a single integrated platform. This makes it ideal for pilot lines, small-batch production, or repair stations handling mixed product types.
The system features a single-side, multi-segment architecture that can process up to 6 FPCs or 6 PCBs along one edge of a panel in sequence. Operators can configure the machine to run FOG only, FOB only, or FOG followed immediately by FOB—without changing hardware. If both are enabled, the machine automatically completes all FOG steps first, then proceeds to FOB bonding on the same unit.
For FOG mode, the operator places the LCD panel on the glass worktable and activates vacuum suction. They then position the FPC(s) on the FPC stage and perform rough alignment. Using a live monitor feed, they fine-tune alignment visually. After pressing both start buttons, the pre-press head descends to temporarily bond the first segment. The platform then shifts automatically to the next position. This repeats until all pre-press zones are complete. Finally, the platform moves to the main bonding station. The main press head applies full heat and pressure to cure all segments at once.
If FOB mode is also enabled, the machine returns to the FOG pre-press station—but now treats the bonded module as a “panel” for FOB processing. The operator places a PCB on the worktable, aligns it with the existing FPC leads, and initiates another bonding cycle. This seamless transition eliminates manual transfer between machines and reduces handling damage.
All loading, alignment, and unloading occur from the same front position, improving ergonomics and workflow consistency.
Both pre-press and main-press heads operate within a temperature range of room temperature to 400°C, with surface uniformity held to ±5°C—ensuring reliable ACF curing. Bonding time is adjustable from 0.1 to 99.9 seconds.
Force output is independently controlled:
Standard press head dimensions are:
All heads are made of high-wear-resistant material and can be customized to match specific COF or PCB layouts.
The machine uses physical controls including Φ24 mm start and vacuum buttons, plus a Φ22 mm emergency stop switch. A three-color signal lamp indicates operational status (ready, running, fault). While the document does not specify PLC or touchscreen use, the process is fully automated once started—minimizing operator error.
Safety is reinforced by the dual-hand start requirement, preventing accidental activation during alignment.
Olian includes one Chinese-language operation manual. On-site training lasts one day and covers installation, parameter setup, common troubleshooting, and replacement of wear parts. Duration can be adjusted by mutual agreement.
The machine carries a 12-month warranty under normal operating conditions. Consumable parts and damage from misuse or force majeure are excluded. During the warranty period, if remote support fails, an engineer will arrive on-site within 72 hours. Lifelong technical support is provided beyond the warranty term.
The OL-FF-173 excels in environments requiring flexibility and rework capability—such as:
Its ability to perform FOG → FOB in one continuous flow significantly reduces cycle time and improves yield compared to using two separate machines.
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OL-F017 – 17-Inch Dual-Station In/Out Lower-Alignment FOG Bonding Machine (Touch Panel Customized)
High-Precision Semi-Automatic COF Bonding System for Touch Displays
The OL-F017 by Olian Automatic Equipment Co., Ltd. is a high-performance semi-automatic FOG (Film-on-Glass) bonding machine designed specifically for large-format touch panels up to 17 inches. It features a dual-station platform with in-and-out linear motion and lower-side visual alignment, enabling efficient, precise bonding of COF (Chip-on-Film) circuits onto LCD glass edges. This model is optimized for touch panel (TP) manufacturers requiring custom alignment workflows and stable thermal compression.
Unlike top-view alignment systems, the OL-F017 uses a bottom-mounted camera and monitor setup. Operators view alignment marks from below through the transparent glass substrate. This “lower alignment” method reduces parallax error and improves accuracy—especially critical for narrow-pitch COFs used in modern touch displays.
The machine operates with two independent workstations that move linearly between loading and bonding positions. While one station is under compression, the operator can load or unload the other—doubling throughput without extra labor. Both stations share the same bonding head but operate sequentially, ensuring consistent process control.
A single operator handles all steps from one position. They place the LCD panel on the glass platform and activate vacuum hold-down. Then they position the FPC on its dedicated stage. Using the live monitor feed, they manually adjust X/Y/θ alignment until the mark points match. Once confirmed as “OK,” they press both start buttons to begin the cycle.
The platform then moves automatically into the bonding zone. The heated press head descends, applies preset force and time, and completes the main bond. After bonding, the platform returns to the loading position. If enabled, the buffer tape advances once. The operator removes the finished panel and repeats the process.
The OL-F017 supports panels from 5 inches (112 × 65 mm) to 17 inches (380 × 240 mm) with thicknesses from 0.2 mm to 2.2 mm. FPC dimensions range from 12 × 12 mm to 60 × 60 mm, with a minimum mark-to-mark distance of 11 mm. The COF-to-glass step height must be at least 0.4 mm to ensure proper contact.
Bonding parameters are fully adjustable:
The standard FPC press head measures 60 mm × 1.0 mm but can be customized per customer requirements. Heating is fast and stable, using embedded cartridge heaters with real-time feedback.
The machine includes a 2x optical magnification lens with a 1.9 mm × 1.4 mm field of view. Lighting is provided by a coaxial LED source, eliminating shadows and enhancing mark contrast. The two camera lenses can be spaced from 11 mm to 90 mm apart, accommodating various COF layouts.
This lower-alignment design is ideal for transparent substrates like cover glass or OGS (One-Glass Solution) panels. It avoids interference from upper fixtures and provides a direct view of alignment targets.
The LCD platform measures 550 mm (W) × 320 mm (D). The FPC stage is 120 mm × 60 mm. The entire machine weighs approximately 380 kg and stands 1550 mm tall, with a work height of 860 ± 30 mm. Its footprint is 1550 mm (W) × 960 mm (D).
The frame is finished in industrial beige, while functional parts are chrome-plated or anodized for durability. All surfaces are delivered clean and dust-free. Warning labels are affixed near hot or moving components for safety.
Operation requires a cleanroom environment with temperature between 22°C and 27°C and humidity from 40% to 70% RH. The machine must be used in a dust-controlled, static-safe area to protect sensitive display components.
An integrated buffer tape mechanism manages ACF carrier film. It accepts tape with an inner diameter ≥33 mm and outer diameter ≤80 mm. The feed pitch is adjustable from 1 to 20 mm. If the tape fails to advance during operation, the system triggers an audible and visual alarm—preventing missed bonds.
Control is managed via PLC logic, a color touchscreen interface, and physical manual buttons. Emergency stop and dual-hand start functions ensure operator safety. The system also includes status indicators and fault diagnostics.
Olian provides one Chinese-language operation manual. On-site training lasts one day and covers installation, parameter setup, troubleshooting, and replacement of wear parts. Training duration can be adjusted by mutual agreement.
The machine carries a 12-month warranty under normal use. Consumables and damage from misuse or force majeure are excluded. During the warranty period, if remote support fails, an engineer will arrive on-site within 72 hours. Lifelong technical support is available after warranty expiration.
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High-Efficiency Thermal Compression System for Multi-Segment COF-to-PCB Bonding
The OL-FOB156L by Olian Automatic Equipment Co., Ltd. is a semi-automatic FOB (Film-on-Board) bonding machine engineered for the precise thermal compression of multiple COF (Chip-on-Film) or FPC (Flexible Printed Circuit) leads onto a single edge of rigid PCBs used in display modules up to 15.6 inches. Designed with a long main press head, this system supports multi-segment sequential bonding, enabling high-reliability electrical connections across extended or densely populated PCB bonding zones—common in automotive displays, industrial control panels, and smart appliance interfaces.
Unlike single-point bonders, the OL-FOB156L allows operators to process up to 10 individual FPCs along one side of a PCB in a single workflow, significantly improving throughput while maintaining consistent bond quality.
The machine operates through a well-defined manual-assisted process..
The operator begins by placing the PCB onto the dedicated worktable and activating vacuum suction via a Φ24 mm button to ensure flatness and stability.
Next, the FPCs are positioned on their respective stage and roughly aligned with the PCB pads. Using a live monitor feed, the operator performs fine visual alignment before initiating the cycle with a dual-hand start mechanism—a critical safety feature that prevents accidental activation.
Once started, the machine automatically executes a pre-press step at the first bonding position using a compact 55 mm × 2 mm tungsten carbide press head.
After completion, the platform shifts horizontally to the next segment, repeating the pre-press until all designated positions are processed.
If the system is configured for automatic alignment (e.g., with optional vision), pre-press may be skipped, proceeding directly to main bonding.
Following pre-press, the platform moves to the main bonding station,
where two long (200 mm × 2 mm standard) tungsten carbide press heads descend simultaneously.
These heads deliver a precisely controlled force ranging from 55 N to 1000 N,
with temperature maintained between room temperature and 400°C.
The surface temperature uniformity across the press head is guaranteed within ±8°C, ensuring consistent ACF (Anisotropic Conductive Film) curing. Bonding time is fully adjustable from 0.1 to 99.9 seconds.
Both pre-press and main press units utilize pneumatic cylinders with linear guides for smooth vertical.
motion and precision pressure regulators for repeatable force control.
The press heads are made of tungsten steel, offering exceptional wear resistance and surface flatness within ±5 microns. The main press heads also feature push-pull adjustment screws for fine-tuning parallelism relative to the PCB surface.
The PCB platform is constructed from hard anodized magnesium aluminum alloy, providing excellent rigidity and thermal stability. It incorporates a dense array of 1 mm vacuum holes and channels to secure panels firmly during bonding.
Platform flatness is maintained within ±0.008 mm per 100 mm, and it supports four-axis manual adjustment (X, Y, θ, and Z) via micrometer-style knobs with ±3 mm (X/Y/θ) and ±4 mm (Z) travel—enabling precise registration even with panel tolerances.
The machine is designed for single-operator use, with all loading, alignment. and unloading performed.
from the same front position, enhancing ergonomics and workflow efficiency.
Operation is managed through physical controls: a Φ24 mm start button, a Φ24 mm vacuum switch.
and a Φ22 mm emergency stop.
A three-color signal lamp provides real-time status feedback (ready, running, fault). The system does not include a PLC or touchscreen, prioritizing simplicity and reliability in production environments.
Olian includes a Chinese-language operation manual and provides one-day on-site training covering.
installation, parameter setup, routine maintenance, and replacement of consumable parts.
The machine is covered by a 12-month warranty under normal operating conditions.
During the warranty period, if remote troubleshooting fails, Olian guarantees on-site technical support within 72 hours. Lifelong technical assistance is available beyond the warranty term.
While the standard main press head measures 200 mm × 2 mm, Olian offers customization to match specific PCB layouts. This model is particularly suited for applications requiring long-edge, multi-chip COF bonding, such as driver boards for large-format LCDs where multiple flex circuits must be reliably connected in sequence.
In summary, the OL-FOB156L delivers a robust, efficient, and operator-friendly solution for medium-to-high volume FOB production—combining precision mechanics, thermal stability, and flexible multi-zone capability in a single platform.
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OL-FOG156 Series – 15.6-Inch Single-Side Multi-Zone FOG Bonding Machines
Flexible Thermal Compression Systems for High-Density COF Bonding on LCD Panels
The OL-FOG156 Series by Olian Automatic Equipment Co., Ltd. comprises two variants of semi-automatic single-station FOG (Film-on-Glass) bonding machines, engineered for multi-segment thermal compression of COF (Chip-on-Film) circuits onto one edge of large-format rigid LCD panels up to 15.6 inches.
Both models support sequential pre-bonding and main bonding in a single workflow, with operator-assisted visual alignment via monitor. The key difference lies in the press head length, enabling optimization for either long continuous COF arrays (OL-FOG156L) or shorter, discrete COF segments (OL-FOG156S).
⚠️ Note: These machines assume that ACF has already been applied. They perform thermal compression only, not ACF lamination or automated vision alignment.
| Feature | Specification |
|---|---|
| Panel Size | Max: 350 mm × 250 mm (~15.6″) Min: 150 mm × 80 mm (~7″) Thickness: 0.2–2.2 mm |
| Temperature Range | RT to 400°C (both pre-press & main press) |
| Press Head Uniformity | ≤ ±8°C across surface |
| Bonding Time | 0.1 – 99.9 seconds (programmable) |
| Pre-Press Force | 25 – 400 N |
| Main Press Force | OL-FOG156L: 55 – 1000 N OL-FOG156S: 25 – 400 N |
| Max FPCs per Edge | ≤10 pcs (OL-FOG156L) ≤ Number of main press heads (OL-FOG156S) |
| Operation | Manual loading → Vacuum fixation → Visual alignment → Dual-hand start → Auto sequential bonding |
| Control | Manual buttons + indicator lights (no PLC/touchscreen) |
| Safety | Emergency stop, dual-hand start, three-color status lamp |
| Parameter | OL-FOG156L (Long Head) | OL-FOG156S (Short Head) |
|---|---|---|
| Pre-Press Head Length | 55 mm × 1 mm (standard) | 55 mm × 1 mm (standard) |
| Main Press Head Length | 200 mm × 2 mm (standard) | 220 mm × 1 mm (standard) |
| Typical Use Case | Bonding long, continuous COF ribbons (e.g., single wide driver IC or multi-chip array spanning >150 mm) | Bonding multiple short, discrete COFs (e.g., 2–10 separate flex circuits along one edge) |
| Force Capability | Higher main press force (up to 1000 N) for robust bonding of wide areas | Moderate force (up to 400 N), sufficient for standard COF segments |
| Customization | Both heads customizable per customer layout |
💡 Design Insight: Despite the name “short,” the OL-FOG156S actually has a slightly longer nominal main head (220 mm vs. 200 mm), but it is thinner (1 mm vs. 2 mm) and optimized for modular, segmented pressure application—not continuous wide-area bonding.
This semi-automated multi-zone approach ensures consistent bonding quality across complex edge layouts without full automation cost.
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OL-TAB173 – 15.6-Inch Dual-Station Integrated FOG & FOB Bonding Machine,
All-in-One Thermal Compression System for COF (FOG) and COB (FOB) Bonding in a Single Platform
The OL-TAB173 by Olian Automatic Equipment Co., Ltd. is an innovative dual-station integrated bonding machine that combines FOG (Film-on-Glass) and FOB (Film-on-Board) processes in one compact system—left station for FOG, right station for FOB. Designed for panels up to 15.6 inches, it enables seamless production of display modules requiring both COF-to-LCD and COF-to-PCB connections, such as automotive displays, industrial HMIs, and smart appliances.
This integrated approach eliminates the need for separate machines, reduces footprint, minimizes handling, and ensures process consistency between FOG and FOB steps—critical for yield and reliability in high-end applications.
⚠️ Note: This machine assumes that ACF has already been applied to both the LCD panel and PCB. It performs final main bonding only, not ACF lamination or pre-alignment.
💡 Note: Unlike some FOG-only models (e.g., OL-F0712), this unit does not include vision alignment—it is intended for pre-aligned COF from upstream processes.
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Ultra-High-Precision Thermal Compression System for Front & Rear COF/FOG Bonding on LCD Panels
The OL-F0712 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-station FOG (Film-on-Glass) bonding machine engineered for the final thermal compression of COF (Chip-on-Film) flex circuits onto both front and rear edges of large-format rigid LCD panels up to 15.6 inches. What sets it apart is its dual-camera vision system—featuring simultaneous top-view and bottom-view alignment—enabling unparalleled registration accuracy between COF terminals and ITO pads, even on multi-layer, opaque, or high-density interconnect (HDI) panels.
Combined with dual independent workstations, the OL-F0712 delivers both micron-level precision and continuous production throughput, making it ideal for demanding applications in automotive displays, medical imaging, avionics, and premium consumer electronics.
⚠️ Note: This machine assumes that ACF has already been applied to the panel. It performs final main bonding only, not ACF lamination or pre-bonding.
This stereo alignment capability eliminates parallax and layer-shift errors—critical for panels with black matrix, touch sensors, or embedded layers.
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OL-FP156 – 15.6-Inch Dual-Station FOG Bonding Machine with Bottom Vision Alignment
High-Precision Thermal Compression System for Front & Rear COF/FOG Bonding on LCD Panels
The OL-FP156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-station FOG (Film-on-Glass) bonding machine engineered for the final thermal compression of COF (Chip-on-Film) flex circuits onto both front and rear edges of large-format rigid LCD panels up to 15.6 inches. Featuring bottom-side vision alignment and dual independent workstations, this system delivers exceptional positional accuracy while enabling continuous production—ideal for high-mix, medium-volume manufacturing of automotive displays, industrial HMIs, and premium consumer electronics.
Unlike top-alignment systems, the bottom-view camera design ensures direct imaging of panel bonding pads through the glass substrate, eliminating parallax errors and enabling sub-micron-level registration between COF terminals and ITO traces—even on dark or reflective panels.
⚠️ Note: This machine assumes that ACF has already been applied to the panel. It performs final main bonding only, not ACF lamination or pre-bonding.
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