This document presents a comprehensive automation solution for the production of mid-size display modules (5-17.3 inches), focusing on the integration of various equipment for high-precision and high-efficiency manufacturing. The solution includes panel loading, terminal cleaning, COG (Chip on Glass) and FOG (FPC on Glass) bonding, as well as FPC (Flexible Printed Circuit) feeding. Each component is designed to work seamlessly with others to ensure smooth production flow and superior product quality.
Equipment Overview
1. Panel Loading Machine (LLD3000)
Panel Size Range: 5″ to 17.3″ (MIN: 80×80 mm, MAX: 380×380 mm)
Thickness: 0.15–0.7 mm
Tack Time: ≤4 seconds for 7″ panels (non-stop loading)
Vacuum & Air Supply: Compatible with customer-provided vacuum or standalone pump
Plasma Parameters: Power 120-200W, temperature 60-100°C
Features: Visual correction, ACF detection, and dual-sided cleaning capability
Power: 220V/50Hz, 3KW
Dimensions: 1800(L) × 1200(W) × 1900(H) mm
3. Fully Automatic COG Bonding Machine (CB3000)
Panel Size Range: 5″ to 17.3″
Tack Time:
≤6.5 seconds for single IC (dual-panel mode)
≤9 seconds for dual ICs (single-panel mode)
Precision:
ACF: X±0.15mm/Y±0.1mm (3σ)
Main Press: X/Y±5um (3σ)
IC Supply: Dual feeders for non-stop loading
Power: Three-phase, 380V, 12.5KW
Dimensions: ~4080(L) × 1600(W) × 1900(H) mm
4. Fully Automatic FOG Bonding Machine (FB3000)
Panel Size Range: 5″ to 17.3″
Tack Time:
≤6.5 seconds for single FPC (non-Y type)
≤10 seconds for dual FPCs
Precision:
ACF: X±0.15mm/Y±0.1mm (3σ)
Main Press: Single-segment FPC: X/Y±15um (3σ); U-shaped FPC: X/Y±20um (3σ)
FPC Supply: Single or dual channels for flexible loading
Power: Three-phase, 380V, 10KW
Dimensions: ~4000(L) × 1470(W) × 1900(H) mm
5. Fully Automatic FPC Loading Machine (FLD3000)
FPC Size Range: MIN: 15×10mm, MAX: 100×175mm
Tack Time: ≤4 seconds for same FPC, ≤6 seconds for dual FPCs
Precision: ±0.03mm
Power: Single-phase, 220V, 3.5KW
Dimensions: ~1100(L) × 1450(W) × 1900(H) mm
Process Flow
Panel Loading: Panels are loaded automatically with precise handling.
Terminal Cleaning: Terminals are cleaned using IPA and plasma to ensure contamination-free surfaces.
ACF Application: ACF material is applied precisely onto the glass or FPC.
IC/FPC Bonding: ICs or FPCs are aligned and bonded onto the glass using COG or FOG processes.
AOI Inspection: Products undergo automated optical inspection to ensure quality.
Key Features
High Precision: Ensures accurate alignment and bonding for superior product quality.
Automation: Reduces manual intervention, minimizing errors and improving efficiency.
Versatility: Compatible with various panel sizes and FPC configurations.
Reliability: Robust construction and high-quality components ensure consistent performance.
Conclusion
This automation solution for mid-size display modules offers a comprehensive approach to efficient and precise manufacturing. By integrating advanced technologies and equipment, it ensures high yield, superior quality, and cost-effectiveness, making it ideal for modern display production environments.