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OL-FBM037 Flip-Board Mounting Machine

OL-FBM037 Flip-Board Mounting Machine

OL-FBM037 Flip-Board Mounting Machine

High-Precision Semi-Automatic Mounting for Medium-to-Large Displays

Engineered by Olian Automaic

  • Developed by Olian Automaic, a Shenzhen-based leader in automation equipment.
  • Designed for semi-automatic high-precision mounting of flexible circuits (FPC/COF) onto hard boards or flexible films.
  • Supports display sizes from 7 inches (160×88 mm) to 32 inches (710×400 mm) with material thicknesses of 0.1–1 mm.

Core Functionality

  • Semi-Automatic Operation: Operators place soft boards (FPC) on the lower platform and hard boards/soft films on the flip platform. The system automates alignment and pressing.
  • Single-Sided Mounting: Optimized for pre-mounting applications in medium-to-large display manufacturing.
  • Dual-Platform Design: Flip platform (620×920 mm) and lower platform (620×920 mm) for efficient workflow.

Key Specifications

  • Platform Size:
    • Flip platform: 620×920 mm.
    • Lower platform: 620×920 mm.
  • Display Compatibility:
    • Max: 32″ (710×400 mm).
    • Min: 7″ (160×88 mm).
    • Thickness: 0.1–1 mm.
  • FPC/COF Dimensions:
    • Length/Width: 12–60 mm.
    • Thickness: 0.1–1 mm.
    • Step gap between small glass and IC/COF: ≥0.4 mm.
  • Roller Specifications:
    • Diameter: φ50 mm.
    • Length: 648 mm.
    • Hardness: Standard 60 Shore (customizable).
  • Production Capacity:
    • Cycle time: <40 seconds per unit (excluding loading/unloading and cleaning).
    • Mounting speed: ≥100 mm/s.

Technical Features

  1. Precision Mounting System:
    • Roller Drive: Servo motor + ball screw + linear guide.
    • Pressure Control: 0.2–0.4 MPa (adjustable).
    • Alignment Accuracy: X/Y-axis ≤±0.1 mm (excluding human/material errors).
  2. Adjustable Platforms:
    • Flip Platform:
      • Servo-driven Q-axis rotation.
      • Vacuum fixation (1 mm holes, 1.5 mm grooves).
    • Lower Platform:
      • Servo-driven X/Y-axis movement (left/right) + UVW alignment.
      • Material: Hard-anodized aluminum.
  3. Control System:
    • PLC: Panasonic.
    • HMI: Weintek.
    • Servo Motor: Panasonic.

Performance Metrics

  • Yield Rate: ≥98% (excluding human error and material defects).
  • Failure Rate: ≤2% under normal conditions.
  • Changeover Time:
    • New models: ≤30 minutes.
    • Existing models: ≤10 minutes.

Operational Environment

  • Cleanroom Requirements: Class 100 (ISO 5).
  • Temperature: 22–27°C.
  • Humidity: 40–70%.
  • Power Supply: Single-phase AC 220V, 50/60 Hz, 2000W.
  • Air Supply: 0.4–0.7 MPa, 150 L/min (φ8 mm transparent tubing).
  • Vacuum System:
    • Self-generated vacuum.
    • Consumption: 66 L/min (yellow tubing).

Safety and Compliance

  • Emergency Stop: EMO button halts all motion.
  • Warning Labels: Placed at high-temperature and pinch points.
  • Access Control:
    • Operator mode: No password (basic operation).
    • Engineer mode: Password-protected (parameter settings).

After-Sales Support

  • Warranty: 1 year (excludes wear parts and human-induced damage).
  • Training: 1-day on-site program covering operation, calibration, and troubleshooting.
  • Service: 72-hour on-site response for warranty-period issues.

Target Applications

Ideal for manufacturers of:

  • Medium-to-large LCD/OLED panels (e.g., monitors, TVs).
  • Touchscreen modules and optical film assemblies.
  • Automotive displays and industrial control screens.

SEO Keywords

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OL-FS120 Single-Station Servo-Driven FOG Bonder

OL-FS120 Single-Station Servo-Driven FOG Bonder

OL-FS120 Single-Station Servo-Driven FOG Bonder

High-Precision Manual FOG Bonding for 120-Inch Displays

Engineered by Olian Automaic

  • Developed by Olian Automaic, a Shenzhen-based leader in automation equipment.
  • Designed for manual single-head servo-driven FOG bonding on panels with pre-attached anisotropic conductive film (ACF).
  • Supports display sizes from 25 inches (550×320 mm) to 120 inches (2700×1500 mm) with material thicknesses of 0.1–1 mm.

Core Functionality

  • Manual Loading/Alignment: Operators place LCD panels and FPCs manually, aligning via Mark points using a dual-camera imaging system.
  • Automated Thermocompression: After alignment, the system executes precision thermocompression bonding.
  • Single-Station Design: Optimized for pre-bonding applications in large-format display manufacturing.

Key Specifications

  • Platform Size: 2800 mm (W) × 2000 mm (D).
  • Display Compatibility:
    • Max: 120″ (2700×1500 mm).
    • Min: 25″ (550×320 mm).
    • Thickness: 0.1–1 mm.
  • FPC Dimensions: 12–60 mm (L×W); Thickness: 0.1–1 mm.
  • Production Capacity: Single-section bonding with cycle time ≤20 seconds per unit (excluding manual alignment).
  • Bonding Time: <10 seconds per unit.

Technical Features

  1. Precision Bonding System:
    • Main Press Head:
      • Material: Tungsten steel.
      • Surface Flatness: ≤±3 μm (45 mm standard).
      • Temperature Range: RT–400°C (constant-temperature heating).
      • Pressure Control: 25–400 N (±3 N precision).
    • Backup Plate: Quartz material (standard: customizable).
  2. Adjustable Platforms:
    • LCD Platform:
      • Fixed position with ±2 mm Z-axis adjustment (micrometer).
      • Vacuum fixation (1 mm holes, 1.5 mm grooves) with分区 control (300×300 mm units).
      • Platform Material: Hard-anodized aluminum.
      • Platform Flatness: ≤±8 μm/100 mm.
    • FPC Platform: Manual X/Y/Q/Z-axis adjustment.
  3. Servo-Driven Motion:
    • X-axis: Servo motor + gear rack + linear guide.
    • Z-axis: Servo motor + ball screw + linear guide.
  4. Imaging System:
    • Dual 300K-pixel CCD cameras with coaxial LED lighting.
    • Field of View: 3.2×2.4 mm.

Performance Metrics

  • Alignment Accuracy: X/Y-axis ≤±0.035 mm (excluding human/material errors).
  • Minimum Pitch Support: ≥80 μm.
  • Platform Repeatability: ≤0.01 mm.
  • Model Changeover Time: ≤10 minutes (new product setup).

Operational Environment

  • Power Supply: Single-phase AC 220V, 50/60 Hz, 2000W.
  • Air Supply: 0.4–0.7 MPa, 250 L/min (φ8 mm transparent tubing).
  • Vacuum: Self-generated; ≥-60 kPa (yellow tubing).
  • Conditions: Cleanroom (22–27°C, 40–70% humidity).

After-Sales Support

  • Warranty: 1 year (excludes wear parts and human-induced damage).
  • Training: 1-day on-site program covering operation, calibration, and troubleshooting.
  • Service: 72-hour on-site response for warranty-period issues.

Target Applications

Ideal for manufacturers of ultra-large LCD/OLED panels, including:

  • Television displays (85–120 inches).
  • Digital signage and industrial monitors.
  • Automotive infotainment systems.

SEO Keywords

FOG bonding machine,FOG bonder,COF bonder ,COF bonding machine,OL-FS120, single-station FOG bonder, 120-inch display equipment, servo-driven heat press, FPC bonding machine, thermocompression bonding system, large-format display assembler, Olian Automaic, manual FOG bonder, high-precision alignment bonder, flat panel display equipment, constant-temperature bonder, display module assembly, glass-to-film bonding, industrial display machinery, China automation equipment, reliable FOG bonder, cleanroom-compatible bonder, high-yield display manufacturing, display production line, precision display assembler.

OL-FPD85 Single-Station FOG FOB COF Pulse Bonder

OL-FPD85 Single-Station FOG FOB COF Pulse Bonder

OL-FPD85 Single-Station FOG FOB COF Pulse Bonder Precision Manual FOG Bonding for 85-Inch Displays.

OL-FPD85 Single-Station FOG FOB COF Pulse Bonder
OL-FPD85 Single-Station FOG FOB COF Pulse Bonder

The OL-FPD85 Single-Station Dual-Sided Alignment Pulse Bonder, manufactured by Shenzhen Olian Automatic Equipment Co., Ltd., is a manual flat-panel display (FPD) bonding solution engineered for pre-bonding flexible printed circuits (FPC/COF) or film-on-board (FOB) applications. Designed for 85-inch platforms, this equipment supports display sizes from 10 inches (200×110 mm) to 85 inches (1890×1060 mm) with thicknesses of 0.1–1 mm.

OL-FPD85 Single-Station FOG FOB COF Pulse Bonder Key Specifications

  • Platform Size: 85-inch compatible
  • Display Compatibility:
    • Max: 85″ (1890×1060 mm)
    • Min: 10″ (200×110 mm)
    • Thickness: 0.1–1 mm
  • FPC/COF Dimensions: 12–60 mm (L×W), thickness 0.1–1 mm
  • Accuracy: ±0.040 mm (X-axis), ±0.045 mm (Y-axis)
  • Cycle Time: ≤25 seconds per unit (excluding manual alignment)
  • Temperature Range: Room temperature to 450°C (pulse heating)
  • Pressure Control: 30–400 N (±5 N precision)

Core Features

  1. Manual Dual-Sided Alignment:
    Operators place glass/film on the platform, position FPC/PCB manually, and align using Mark points. The system automates the thermocompression bonding process.
  2. Dual Imaging System:
    • OLB Unit (Lower Lens): 2× 300K-pixel CCD cameras with coaxial LED lighting (FOV: 1.9×1.4 mm).
    • PCB Unit (Upper Lens): 2× 300K-pixel CCD cameras with spot LED lighting (FOV: 1.9×1.4 mm).
  3. Adjustable Platforms:
    • Glass platform with ±2 mm Z-axis adjustment (micrometer).
    • Aluminum platform with ±2 mm lifting stage adjustment.
    • Vacuum fixation (1 mm holes, 1.5 mm grooves).
  4. Titanium Alloy Hot Press Head:
    • Surface flatness: ≤3 μm (55 mm standard).
    • Parallelism adjusted via screws.

Technical Advantages

  • High Yield: ≥98% product pass rate (excluding human/material factors).
  • Low Downtime: ≤2% failure rate (non-human factors).
  • Quick Changeover: ～20 minutes for new model setup.
  • Dual Access Levels: Operator (no password) and engineer (password-protected parameters).

Operational Environment

  • Power: Single-phase AC 220V, 50/60 Hz, 1500W.
  • Air Supply: 0.4–0.7 MPa, 250 L/min (transparent 8 mm tubing).
  • Vacuum: 36 L/min (yellow tubing).
  • Conditions: Cleanroom (22–27°C, 40–70% humidity).

After-Sales Support

  • Warranty: 1 year (excludes wear parts and human-induced damage).
  • Training: 1-day on-site program covering operation, calibration, and troubleshooting.
  • Service: 72-hour on-site response for warranty-period issues.

This bonder is ideal for manufacturers requiring precision alignment for large-format displays. Its manual flexibility and automated pressing ensure high-quality bonds for FPC/COF applications.

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Bonding Machines and Technologies

Bonding Machines and Technologies

In the rapidly evolving world of electronics and display manufacturing, precision bonding technologies play a crucial role in creating high-quality, reliable, and innovative products. Whether you are producing smartphone screens, wearable devices, large TV panels, or advanced OLED displays, our company offers a comprehensive range of bonding machines and solutions to meet your specific needs. Below is an introduction to our product offerings, covering various bonding technologies and applications.

Chip on Glass (COG) Bonding Machines

COG (Chip on Glass) technology is a widely used method for mounting LCD driver chips directly onto the glass substrate of a display panel

. This technique is known for its simplicity, cost-effectiveness, and reliability. Our COG bonding machines are designed to provide high precision and efficiency, making them ideal for applications such as smartphone screens, LCD panels, and other display devices

. We offer both pre-bonding and main-bonding machines, ensuring accurate alignment and strong connections.

Chip on Film (COF) Bonding Machines

COF (Chip on Film) technology represents a significant advancement in display manufacturing. It involves mounting integrated circuits (ICs) onto flexible printed circuits (FPCs), which can then be bent and folded to fit compact spaces

. Our COF bonding machines support high-speed production and offer precise temperature and pressure control, ensuring reliable connections for applications such as flexible screens, smartwatches, and other wearable devices

. We provide both COF pre-bonding and main-bonding machines, tailored to meet the demands of modern display manufacturing

.

Chip on Plastic (COP) Bonding Machines

COP (Chip on Plastic) technology is another innovative approach, where ICs are mounted directly onto plastic substrates. This method is particularly useful for creating lightweight and flexible displays

. Our COP bonding machines are designed to handle the unique challenges of plastic substrates, offering high precision and reliability. These machines are ideal for applications such as flexible OLED displays and wearable devices

.

FPC on Glass (FOG) Bonding Machines

FOG (FPC on Glass) bonding involves attaching flexible printed circuits to glass substrates. This technique is commonly used in applications requiring flexibility and compact design, such as touch screens and wearable devices

. Our FOG bonding machines feature advanced alignment systems and precise temperature control, ensuring high-quality connections. We offer both hot press and automated bonding solutions for FOG applications

.

FPC on PCB (FOB) Bonding Machines

FOB (FPC on PCB) bonding machines are designed for attaching flexible printed circuits to printed circuit boards. These machines are essential for creating compact and reliable electronic assemblies, commonly used in smartphones, tablets, and other consumer electronics

. Our FOB bonding machines provide high precision and flexibility, supporting both manual and automated production processes

.

FPC on FPC (FOF) Bonding Machines

FOF (FPC on FPC) bonding involves connecting flexible printed circuits to each other. This technique is ideal for applications requiring extreme flexibility and compactness, such as wearable devices and flexible displays

. Our FOF bonding machines offer high precision and reliability, ensuring strong and durable connections.

Anisotropic Conductive Film (ACF) Bonding Machines

ACF (Anisotropic Conductive Film) bonding is a versatile technique used in various bonding processes, including COG, COF, and FOG

. Our ACF bonding machines are designed to provide precise temperature, pressure, and alignment control, ensuring reliable and high-quality connections. We offer a range of ACF bonding solutions, including pre-bonding and main-bonding machines

.

Tape Automated Bonding (TAB) Machines

TAB (Tape Automated Bonding) is a technique used for bonding integrated circuits to substrates using tape carriers. Our TAB bonding machines are designed for high-speed production and offer precise alignment and bonding capabilities

. These machines are ideal for applications requiring high-density interconnections and compact designs

.

Flexible Printed Circuit (FPC) Bonding Machines

FPC (Flexible Printed Circuit) bonding machines are essential for creating flexible and lightweight electronic assemblies. Our FPC bonding machines offer high precision and reliability, supporting various bonding processes and applications

. These machines are ideal for applications such as wearable devices, flexible displays, and other consumer electronics

.

Additional Bonding Solutions

In addition to the above technologies, we also offer specialized bonding machines for various applications, including:

  • Touch Panel FPC Bonding Machines: For bonding flexible circuits to touch panels.
  • Zebra Paper Bonding Machines: For bonding components to Zebra paper.
  • Pulse Hot Press Machines: For applications requiring rapid heating and cooling.
  • OLED Bonding Machines: For bonding OLED displays.
  • Camera FPC Bonding Machines: For bonding flexible circuits to camera modules.

Why Choose Our Bonding Machines?

Our bonding machines are designed with the latest innovations in mind, ensuring high precision, reliability, and efficiency. Key features of our machines include:

  • High Precision: Equipped with advanced vision systems and precise temperature control.
  • Versatility: Support a wide range of bonding processes and applications.
  • Automation: Available in both semi-automatic and fully automatic configurations.
  • Customization: Tailored solutions to fit your specific manufacturing processes and requirements.

Conclusion

Whether you are producing smartphone screens, wearable devices, large TV panels, or advanced OLED displays, our comprehensive range of bonding machines is designed to meet your specific needs. With advanced features such as high precision, versatility, and automation, our machines are ideal for ensuring high-quality connections and efficient production processes. Contact us today to find the perfect bonding machine for your application.

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