Tag Archive FOG bonding equipment

7-17 Inch Mid-Size EC/COG/FOG Production Line

7-17 Inch Mid-Size EC/COG/FOG Production Line

Engineered for Precision, Scalability, and High-Throughput Display Manufacturing

This is automated solution for mid-size display module assembly (7″–17″), focusing on EC (End-to-end Cleaning), COG (Chip-on-Glass), and FOG (Film-on-Glass) processes. Designed for rigid panel substrates, this production line integrates advanced robotics, vision systems, and precision bonding technologies to achieve sub-micron accuracy and high-efficiency throughput.

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1. Production Line Overview

Core Capabilities

• Size Range: Supports 7″ to 17″ displays (16:9 aspect ratio) with substrate thicknesses from 0.2mm to 1.1mm.
• Multi-Component Handling: Accommodates up to 6 ICs per side and 4 FPCs per side (expandable to 8 with optional configurations).
• Throughput: Achieves 12 seconds per unit for a configuration with 4 ICs and 2 FPCs.
• Precision Standards:
  • ACF (Anisotropic Conductive Film) placement: ±0.15mm
  • COG bonding: ±5μm
  • FOG bonding: ±15μm

Process Flow

The production line follows a sequential workflow:

1. Platform Conveyor System: Transports substrates between stations.
2. Terminal Cleaning (EC1001): Automated alcohol wiping + plasma treatment.
3. COG Bonding (CB1100/CB1162): ACF dispensing, IC pre-bonding, and main bonding.
4. FOG Bonding (FB1142): FPC alignment, ACF application, and thermal compression.
5. Outfeed Conveyor: Final product handling.

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2. Equipment Specifications

2.1 Terminal Cleaning Station (EC1001)

Function: Automated ITO terminal cleaning for both S-side and G-side substrates.

• Cleaning Process: Dual-stage alcohol wiping followed by plasma activation.
• Vision System: Beijing Boshii image processing for positional accuracy (X: ±0.5mm, Y: ±0.1mm).
• Throughput: 9 seconds per cycle (for 12″ substrates at 80mm/s wiping speed).
• Plasma Specifications:
  • Power: 300W
  • Frequency: 18kHz–60kHz
  • Temperature: 90°C–100°C
• Dimensions: 1970mm (L) × 1250mm (W) × 2000mm (H).

2.2 COG Bonding Stations (CB1100 & CB1162)

Function: Full-process IC-to-glass bonding with ACF application, pre-press, and main press.

• IC Handling: Supports ICs from 5.0×0.8mm to 35×4mm, with dual-IC type compatibility.
• Vision Alignment: Beijing Boshii system ensures ±5μm total bonding accuracy.
• Bonding Heads:
  • ACF head: SUS 440C, 4.0×60mm
  • Pre-press head: SUS 440C, 3×30mm (servo + pneumatic)
  • Main press heads: Ceramic/tungsten steel, 5.0×40mm (dual servo-pneumatic groups)
• Throughput: 125 seconds for 2+2 IC configuration on 12″ substrates.
• Dimensions: 6700mm (L) × 1650mm (W) × 2000mm (H).

2.3 FOG Bonding Station (FB1142)

Function: FPC-to-glass bonding with integrated ACF application and thermal compression.

• FPC Support: Handles FPCs up to 35×4mm (length ≤100mm).
• Precision: ±15μm total bonding accuracy with vision-guided alignment.
• Bonding Heads:
  • ACF head: SUS 440C, 4.0×40mm
  • Pre-press head: SUS 440C, 3×60mm (servo + pneumatic)
  • Main press heads: SUS 440C (dual servo-pneumatic groups)
• Throughput: 12 seconds per unit (for 2 FPCs on 12″ substrates).
• Dimensions: 4000mm (L) × 1465mm (W) × 2000mm (H).

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3. Technical Advantages

3.1 Automation & Integration

• Robotic Handling: Linear motor-driven robotic arms for substrate transfer between stations.
• Modular Design: Stations support standalone operation or inline integration.
• Scalability: Optional LCD/FPC loaders for fully automated material handling.

3.2 Precision Engineering

• Thermocompression Control: Dual servo-pneumatic systems ensure consistent pressure (0.2–0.8MPa) and temperature (350°C–450°C).
• Vision Systems: Real-time CCD correction compensates for substrate warpage or misalignment.

3.3 Process Reliability

• ACF Quality Control: Inline vision inspection verifies film placement before bonding.
• Plasma Activation: PT300 plasma units enhance adhesion with water contact angles of 20°–30°.

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4. Applications & Industry Impact

This solution targets high-volume manufacturing of:

• Automotive Displays: Ensures reliability under 85°C/85% RH conditions.
• Consumer Electronics: Enables ultra-narrow bezels with <0.1mm pitch bonding.
• Industrial Panels: Supports ruggedized designs with multi-IC redundancy.

By integrating cleaning, COG, and FOG processes into a single line, manufacturers reduce handling errors, minimize footprint, and achieve 20% faster time-to-market.

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5. Future-Proof Design

The production line accommodates emerging trends:

• AI Integration: Vision systems support machine learning for defect prediction.
• Scalable I/O: Modular stations allow addition of AOI (Automated Optical Inspection) or curing modules.

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