OL-F017 – 17-Inch Dual-Station In/Out Lower-Alignment FOG Bonding Machine (Touch Panel Customized)
High-Precision Semi-Automatic COF Bonding System for Touch Displays
The OL-F017 by Olian Automatic Equipment Co., Ltd. is a high-performance semi-automatic FOG (Film-on-Glass) bonding machine designed specifically for large-format touch panels up to 17 inches. It features a dual-station platform with in-and-out linear motion and lower-side visual alignment, enabling efficient, precise bonding of COF (Chip-on-Film) circuits onto LCD glass edges. This model is optimized for touch panel (TP) manufacturers requiring custom alignment workflows and stable thermal compression.
Unlike top-view alignment systems, the OL-F017 uses a bottom-mounted camera and monitor setup. Operators view alignment marks from below through the transparent glass substrate. This “lower alignment” method reduces parallax error and improves accuracy—especially critical for narrow-pitch COFs used in modern touch displays.
The machine operates with two independent workstations that move linearly between loading and bonding positions. While one station is under compression, the operator can load or unload the other—doubling throughput without extra labor. Both stations share the same bonding head but operate sequentially, ensuring consistent process control.
A single operator handles all steps from one position. They place the LCD panel on the glass platform and activate vacuum hold-down. Then they position the FPC on its dedicated stage. Using the live monitor feed, they manually adjust X/Y/θ alignment until the mark points match. Once confirmed as “OK,” they press both start buttons to begin the cycle.
The platform then moves automatically into the bonding zone. The heated press head descends, applies preset force and time, and completes the main bond. After bonding, the platform returns to the loading position. If enabled, the buffer tape advances once. The operator removes the finished panel and repeats the process.
The OL-F017 supports panels from 5 inches (112 × 65 mm) to 17 inches (380 × 240 mm) with thicknesses from 0.2 mm to 2.2 mm. FPC dimensions range from 12 × 12 mm to 60 × 60 mm, with a minimum mark-to-mark distance of 11 mm. The COF-to-glass step height must be at least 0.4 mm to ensure proper contact.
Bonding parameters are fully adjustable:
The standard FPC press head measures 60 mm × 1.0 mm but can be customized per customer requirements. Heating is fast and stable, using embedded cartridge heaters with real-time feedback.
The machine includes a 2x optical magnification lens with a 1.9 mm × 1.4 mm field of view. Lighting is provided by a coaxial LED source, eliminating shadows and enhancing mark contrast. The two camera lenses can be spaced from 11 mm to 90 mm apart, accommodating various COF layouts.
This lower-alignment design is ideal for transparent substrates like cover glass or OGS (One-Glass Solution) panels. It avoids interference from upper fixtures and provides a direct view of alignment targets.
The LCD platform measures 550 mm (W) × 320 mm (D). The FPC stage is 120 mm × 60 mm. The entire machine weighs approximately 380 kg and stands 1550 mm tall, with a work height of 860 ± 30 mm. Its footprint is 1550 mm (W) × 960 mm (D).
The frame is finished in industrial beige, while functional parts are chrome-plated or anodized for durability. All surfaces are delivered clean and dust-free. Warning labels are affixed near hot or moving components for safety.
Operation requires a cleanroom environment with temperature between 22°C and 27°C and humidity from 40% to 70% RH. The machine must be used in a dust-controlled, static-safe area to protect sensitive display components.
An integrated buffer tape mechanism manages ACF carrier film. It accepts tape with an inner diameter ≥33 mm and outer diameter ≤80 mm. The feed pitch is adjustable from 1 to 20 mm. If the tape fails to advance during operation, the system triggers an audible and visual alarm—preventing missed bonds.
Control is managed via PLC logic, a color touchscreen interface, and physical manual buttons. Emergency stop and dual-hand start functions ensure operator safety. The system also includes status indicators and fault diagnostics.
Olian provides one Chinese-language operation manual. On-site training lasts one day and covers installation, parameter setup, troubleshooting, and replacement of wear parts. Training duration can be adjusted by mutual agreement.
The machine carries a 12-month warranty under normal use. Consumables and damage from misuse or force majeure are excluded. During the warranty period, if remote support fails, an engineer will arrive on-site within 72 hours. Lifelong technical support is available after warranty expiration.
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OL-FP156 – 15.6-Inch Dual-Station FOG Bonding Machine with Bottom Vision Alignment
High-Precision Thermal Compression System for Front & Rear COF/FOG Bonding on LCD Panels
The OL-FP156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-station FOG (Film-on-Glass) bonding machine engineered for the final thermal compression of COF (Chip-on-Film) flex circuits onto both front and rear edges of large-format rigid LCD panels up to 15.6 inches. Featuring bottom-side vision alignment and dual independent workstations, this system delivers exceptional positional accuracy while enabling continuous production—ideal for high-mix, medium-volume manufacturing of automotive displays, industrial HMIs, and premium consumer electronics.
Unlike top-alignment systems, the bottom-view camera design ensures direct imaging of panel bonding pads through the glass substrate, eliminating parallax errors and enabling sub-micron-level registration between COF terminals and ITO traces—even on dark or reflective panels.
⚠️ Note: This machine assumes that ACF has already been applied to the panel. It performs final main bonding only, not ACF lamination or pre-bonding.
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