OL-C012C – 7-Inch Dual-Station Servo Main Bonding Machine with CCD Alignment
The OL-C012C by Olian Automatic is a dual-station manual main bonding machine with CCD vision alignment. It performs final thermal compression bonding of bare ICs onto rigid LCD panels up to 7 inches.
This system assumes that ACF has already been applied to the panel. The operator places the IC roughly by hand. The built-in CCD system then enables fine visual alignment before main bonding.
The operator loads an ACF-pre-laminated panel onto either station.
They place the IC near the terminal area by hand.
Using the CCD display, they adjust the IC position visually for alignment.
After alignment, they press both start buttons with two hands.
The servo-driven hot bar descends automatically.
It applies heat, pressure, and time to complete the main bond.
The head retracts after cooling. The operator removes the panel.
Both stations can be used alternately by one operator or simultaneously by two.
Bonding temperature: up to 300°C
Temperature uniformity: within ±5°C
Bonding time: 0.1 to 99.0 seconds, adjustable
Pressure range: 20 N to 400 N, servo-regulated
Standard hot bar size: 40 mm × 4.0 mm (custom sizes available)
Heating elements: Φ9.5 × 70 mm cartridge heaters
Temperature sensing: K-type thermocouples
Control system: PLC + touchscreen interface
Manual backup: physical start and emergency stop buttons
Safety: dual-hand start prevents accidental activation
Dimensions: 920 mm (W) × 900 mm (D) × 1590 mm (H)
Weight: approx. 430 kg
Power: single-phase 220V AC, 2000W
Compressed air: 0.5–0.7 MPa, flow 450 L/min, Φ8 mm tubing
Designed exclusively for main bonding of bare driver ICs on:
This machine does not perform:
Its role is final IC/COF/FPC curing with visual alignment aid.
Model: OL-C012C
Type: Dual-Station Main Bonding Machine with CCD
Function: Final IC Thermal Bonding with Visual Alignment
Max Panel Size: 7 inches (rigid glass only)
Core Advantage: Combines manual flexibility with CCD-assisted precision
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OL-C012 – 7-Inch Dual-Station Servo Main Bonding Machine
The OL-C012 by Olian Automatic is a dual-station manual main bonding machine. It performs final thermal compression bonding of ICs/COF/FPC onto rigid LCD panels up to 7 inches.
This system assumes that ACF has already been applied and ICs have been pre-aligned on the panel. The machine executes only the main bonding (final curing) step.
The operator places an ACF-pre-laminated LCD with pre-positioned IC onto either station.
They press a vacuum button to secure the panel.
Then they press both start buttons with two hands.
The servo-driven bonding head descends smoothly.
It applies precise heat, pressure, and time to fully cure the bond.
After cooling, the head retracts automatically.
The operator removes the bonded panel manually.
Both left and right stations operate independently. Two operators can work simultaneously, or one operator can alternate between stations.
Bonding head temperature: up to 300°C
Temperature uniformity: within ±5°C
Bonding time: adjustable from 0.1 to 99.0 seconds
Pressure range: 20 N to 400 N, controlled by servo motor
Standard head size: 40 mm × 4.0 mm (custom sizes available)
Heating uses high-efficiency Φ9.5×70 mm, 220V, 220W cartridge heaters.
Temperature is monitored by K-type thermocouples.
Machine frame: industrial-grade steel
Control system: servo motor + PLC logic
Safety features: dual-hand start buttons, emergency stop switch
All manual operations occur at the same front position for ergonomic workflow
Dimensions: 920 mm (W) × 900 mm (D) × 1590 mm (H)
Weight: approximately 430 kg
Power: single-phase 220V AC, 2000W
Compressed air: 0.5–0.7 MPa, flow 450 L/min, tubing Φ8 mm
Designed exclusively for main bonding of bare ICs on:
Not suitable for pre-bonding.
This machine does not include:
It is a dedicated main bonder for final IC curing only.
Includes one-year warranty (excluding wear parts like heating tubes).
On-site service within 72 hours if phone support fails during warranty.
One day of training covers installation, operation, parameter setup, and maintenance.
Lifetime remote technical support is provided.
Model: OL-C012
Type: Dual-Station Manual Main Bonding Machine
Function: Final IC Thermal Compression Only
Substrate: Rigid Glass Panels (≤7 inches)
Core Tech: Servo-controlled pressure, precise thermal management
SEO Keywords:
Servo main bonding machine, OL-C012, Olian Automatic IC bonder, 7-inch dual-station hot bar press, manual main bonding for COG, thermal compression machine for LCD IC, final curing bonder for rigid displays, servo-controlled hot bar system, IC main bonding equipment, COG main bonder without vision.
