1-7 inch fully automatic COG/COP/COF Bonding production line
Product Overview: A high-precision and highly configured fully automatic production line developed specifically for small-sized single sided single chip ICs and single chip FPCs. Suitable for various types of COG/COF/COP bonding production, with supporting COF punching, EC/PLASMA cleaning, FOG/FOF/FOB bonding
Equipment Usage: Suitable for small-sized TFT, IPS, OLED LCD and other products, achieving LCD bonding terminal cleaning and plasma cleaning, automatic ACF attachment, alignment, pre-bonding, and main-bonding of single sided single chip IC (or COF), as well as related process requirements. This device can be connected to the front and rear devices of our company or other companies for use.
Olian's products include LCM module factories and full process equipment:( bonding: Glass loading,FPC loading,COF punching,IC loading,Glass ITO cleaning,ACF Attaching ,FPC loading,COG COP COF pre Bonding and main bonding,FPC FOG FOB FOF TFOT pre bonding and main bonding, AOI, dispensing, backlight assembling, soldering), achieving manufacturing of integrated display and touch products. Olian's series of products are widely used in display fields such as mobile phones, electronic tags, tablets, smart wearables, automotive displays, televisions, computers, etc., and provide overall solutions for smart factories.
