OL-CBY156 – 15.6-Inch Dual-Head IC Servo Main Bonding Machine
The OL-CBY156 is a semi-automatic dual-head main bonding machine. It performs thermal compression for IC or COF bonding on display panels. This model supports panel sizes from 7 to 15.6 inches. The dual-head design enables simultaneous or sequential bonding operations. It delivers high accuracy of ±0.005mm for IC bonding.
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产品详情
Product Introduction
The OL-CBY156 is a precision main bonding machine from Olian Automatic Equipment Co., Ltd. . It performs the final thermal compression step in display manufacturing. The machine permanently bonds driver ICs or COFs onto ACF-pre-laminated panels. It is designed for rigid glass and flexible displays. This machine supports TFT, OLED, and flexible screen types.
High Precision for Critical Bonding
The OL-CBY156 delivers outstanding bonding accuracy. IC bonding achieves ±0.005mm on both X and Y axes . COF bonding accuracy is within ±0.006mm. This precision ensures reliable electrical interconnections. Minimum pitch capability is 18um for ICs and 20um for COFs. The machine supports panel sizes from 7 inches to 15.6 inches. Maximum panel dimensions are 350mm by 250mm. Minimum panel size is 150mm by 80mm.
Dual-Head Design for Higher Productivity
This machine features two independent bonding heads. The center distance between heads is adjustable from 120mm to 330mm. Operators can use both heads simultaneously for dual IC bonding. They can also process multiple segments sequentially along one panel edge. This flexible dual-head architecture can reduce cycle time significantly. Multi-IC applications benefit most from this parallel processing capability. The machine achieves approximately 150 to 500 IC bonds per hour.
Advanced Thermal and Pressure Control
Temperature control is critical for reliable ACF curing. The press heads heat from room temperature to 400°C. Surface temperature uniformity across each head is ≤ ±5°C. An optional back-up heater maintains temperatures up to 100°C. The system automatically monitors temperature. It stops and alarms if temperatures fall outside the set range .
Servo-driven pressure control ensures consistent bond quality. The force range is adjustable from 20N to 500N. Pressure repeatability is ≤ ±5N. Bonding time is programmable from 0.1 to 99.9 seconds. These precise controls produce reliable, low-resistance electrical connections.
Streamlined Workflow and Ease of Use
The OL-CBY156 is designed for efficient production. The operator loads the panel onto the vacuum platform. Vacuum secures the panel flat during bonding. The operator initiates the cycle with a two-hand start system for safety. The press heads descend automatically with the programmed parameters. Upon completion, the heads rise automatically. The platform moves to the next bonding position for multi-segment panels. Buffer material feeds automatically between cycles. A “tape not feeding” alarm alerts operators to prevent missed bonds.
Comprehensive Safety and ESD Protection
The machine incorporates robust safety features. Emergency stop (EMO) cuts power to all moving parts . Safety warning labels are placed on all potential hazards. A three-color signal tower and audible alarm indicate machine status. The ESD protection system includes static-dissipative materials and grounding. Grounding impedance is ≤ 5Ω . ESD wrist strap sockets are installed at all material handling points. Panel surface static charge is maintained below ±100V during operation.
High-Quality Components
The OL-CBY156 uses premium industrial components. PLC controls are from Panasonic or Delta. Color touchscreen HMI provides an intuitive interface. Servo motors are from Panasonic or Yaskawa. Precision linear guides are from THK or Kuroda. Pneumatic components are from SMC or Airtac. The press heads are made from tungsten steel or ceramic. The vacuum platform uses hard magnesium aluminum material. Platform flatness is ≤ ±8um per 100mm.
Technical Specifications at a Glance
Panel Compatibility:
- Panel Size: Max 350mm x 250mm (15.6″), Min 150mm x 80mm (7″)
- Panel Thickness: 0.2mm to 2.2mm
- IC Size: Length 5mm to 40mm, Width 0.5mm to 3mm
- IC Thickness: 0.08mm to 0.5mm
Bonding Performance:
- Pressure: 20N to 500N, repeatability ≤ ±5N
- Temperature: RT to 400°C (main head)
- Temperature Uniformity: ≤ ±5°C
- Bonding Time: 0.1 to 99.9 seconds
- Accuracy: IC ±0.005mm, COF ±0.006mm
Machine Data:
- Dimensions: Approx. 1290mm (W) x 1100mm (D) x 1845mm (H)
- Weight: Approx. 824 kg
- Power: Single-phase 220V, 2500W
- Air: 0.5 to 0.7MPa, 480L/min
- Environment: Cleanroom, 22-27°C, 40-70% humidity
Support and After-Sales Service
Olian Automatic provides comprehensive training and support. One day of on-site training covers installation, operation, and parameter setting. The equipment includes a one-year warranty under normal use conditions. Consumables and wear parts are excluded from warranty coverage. Lifetime technical support and service are available. On-site service within 72 hours is provided when phone support cannot resolve issues.

