3-8 Inch Small-Size COP/FOP Bonding Line Solution
1. Company Overview
Shenzhen Olian Automatic Equipment Co., Ltd., established in 2012, specializes in automation equipment for FPD flat-panel displays and next-generation flexible screens. As a national high-tech enterprise and “Specialized, Refined, Unique, Innovative” enterprise, Olian integrates R&D, production, sales, and service. Key highlights:
80+ professional R&D team with expertise in precision manufacturing.
4,000㎡ facility featuring CNC machining centers (precision CNC, large surface grinders, lathes, milling machines) and a quality inspection center (Japanese-imported 2D measuring instruments, Olympus microscopes).
2,100+ clients served globally, including partnerships with leading enterprises in China, Taiwan, Canada, South Korea, Singapore, India, and Vietnam.
Core products : Full-process equipment for LCM module factories (bonding, AOI, dispensing, backlight, soldering), serving smartphones, e-tags, tablets, wearables, automotive displays, and smart factories.
2. Bonding Line Layout & Process Flow
2.1 Overall Wiring Scheme
Scope : Fully automated EC/COP/FOP production line for small-size (3″–8″) single-IC, single-FPC products.
Key Stations :
FPC Handling : Loading platform → 1# ACF station → 1# Pre-Bond → Main-Bond (3 modules).
Panel Processing : Loading → Plasma cleaning → ACF application → IC pre-bond alignment → Main bonding → Output.
Quality Control : Dual CCD correction (pre-bond and main bond), ACF visual inspection, and USC (Ultrasonic Cleaning) optional.
Process Flow :
Panel Loading → Plasma Cleaning →ACF Application → COP Pre-Bond → COP Main Bonding FPC Loading → ACF Application On Panel → FOP Pre-Bond → FOP Main Bonding → Output
3. Equipment Specifications
3.1 COP Bonder (Chip-on-Panel Or Chip- on-Plastic)
Panel Range : 3″–8″ (65×30mm – 190×120mm), thickness: 0.3–0.5mm.
IC Specifications : Single IC (5×0.6mm – 36×6mm).
Precision :
ACF placement: X±0.15mm, Y±0.1mm
Total bonding accuracy: ±5μm
Cycle Time : 6 seconds per unit.
Key Components :
ACF Head : SUS 440C, 4.0×60mm (pneumatic).
Main Bonding Head : Ceramic/tungsten carbide, 5.0×40mm (servo + pneumatic).
Power & Size : 220V/50Hz/12.5kW; Dimensions: 3,250L × 1,500W × 1,800H mm (excl. FFU).
3.2 FOP Bonder (FPC-on-Panel or FPC-on-Plastic)
FPC Range : 10×14mm – 80×120mm (bonding area ≤60mm).
Precision : ±15μm total accuracy.
Cycle Time : 6 seconds (for 5.2″).
Key Components :
Main Bonding Head : SUS 440C (×2, pneumatic).
Power & Size : 220V/50Hz/7.5kW; Dimensions: 2,500L × 1,300W × 1,800H mm (excl. FFU).
4. Technical Advantages
4.1 Precision & Efficiency
Linear Motor Robots : High-speed, low-vibration handling.
CCD Vision System : Beijing Boshi for real-time alignment correction.
Plasma Cleaning : SVD brand (15° water contact angle).
4.2 Component Quality
Critical Parts : Fuji/Servotronix servos, THK/HIWIN linear guides, SMC pneumatic components.
Inspection Tools : Visual ACF detection, plasma treatment validation.
5. After-Sales & Quality Assurance
5.1 VIP Service
30-minute response time , 24/7 support.
1-year warranty with free installation, training, and lifetime service.
30-day defect resolution : Free replacement/refund if unresolved.
5.2 Quality Control System
Design : DQA (Design Quality Assurance) with safety and ESD compliance.
Production : Strict assembly standards, precision calibration, and final testing per client specifications.
6. Certifications & Capabilities
Certifications : National High-Tech Enterprise (2022–2025), “Specialized, Refined, Unique, Innovative” (2024–2027), AAA Credit Enterprise.
Patents : 10+ utility patents, software copyrights, and proprietary technologies.
Production Capacity : 4,000+ equipment units delivered, 200+ automated lines deployed.
Contact Information Shenzhen Olian Automatic Equipment Co., Ltd. 📍 Shenzhen, China 🌐 [bonding-machine.com] 📧 [olian@szolian.com] 📞 [+8618025364779] wechat/whatsapp:+8618025364779
Empowering global display manufacturing with precision automation since 2012.
SEO Keywords : COP bonder, FOP bonder, LCM module automation, chip-on-panel equipment, flexible display bonding, Shenzhen automation company, high-precision bonder, Olian equipment,chip on plastic, fpc on plastic.
3 comments so far
LeahPosted on11:07 上午 - 12 月 30, 2025
best COP FOP bonding line,help us in the flexible amoled displays production.
DanielPosted on3:40 下午 - 1 月 3, 2026
3-8 Inch Small-Size COP/FOP Bonding Line
EloisePosted on6:40 下午 - 1 月 11, 2026
COP FOP bonder for OLED panels, good machines for future.