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3-8 Inch Small-Size COP/FOP Bonding Line Wiring Solution

COP/FOP Bonding Line

3-8 Inch Small-Size COP/FOP Bonding Line Wiring Solution


3-8 Inch Small-Size COP/FOP Bonding Line Solution

1. Company Overview

Shenzhen Olian Automatic Equipment Co., Ltd., established in 2012, specializes in automation equipment for FPD flat-panel displays and next-generation flexible screens. As a national high-tech enterprise and “Specialized, Refined, Unique, Innovative” enterprise, Olian integrates R&D, production, sales, and service. Key highlights:

  • 80+ professional R&D team with expertise in precision manufacturing.
  • 4,000㎡ facility featuring CNC machining centers (precision CNC, large surface grinders, lathes, milling machines) and a quality inspection center (Japanese-imported 2D measuring instruments, Olympus microscopes).
  • 2,100+ clients served globally, including partnerships with leading enterprises in China, Taiwan, Canada, South Korea, Singapore, India, and Vietnam.
  • Core products: Full-process equipment for LCM module factories (bonding, AOI, dispensing, backlight, soldering), serving smartphones, e-tags, tablets, wearables, automotive displays, and smart factories.

2. Bonding Line Layout & Process Flow

2.1 Overall Wiring Scheme

Scope: Fully automated EC/COP/FOP production line for small-size (3″–8″) single-IC, single-FPC products.

Key Stations:

  1. FPC Handling: Loading platform → 1# ACF station → 1# Pre-Bond → Main-Bond (3 modules).
  2. Panel Processing: Loading → Plasma cleaning → ACF application → IC pre-bond alignment → Main bonding → Output.
  3. Quality Control: Dual CCD correction (pre-bond and main bond), ACF visual inspection, and USC (Ultrasonic Cleaning) optional.

Process Flow:

Panel Loading → Plasma Cleaning →ACF Application → COP Pre-Bond → COP Main Bonding FPC Loading → ACF Application On Panel → FOP Pre-Bond  → FOP Main Bonding → Output  

3. Equipment Specifications

3.1 COP Bonder (Chip-on-Panel Or Chip-on-Plastic)

  • Panel Range: 3″–8″ (65×30mm – 190×120mm), thickness: 0.3–0.5mm.
  • IC Specifications: Single IC (5×0.6mm – 36×6mm).
  • Precision:
    • ACF placement: X±0.15mm, Y±0.1mm
    • Total bonding accuracy: ±5μm
  • Cycle Time6 seconds per unit.
  • Key Components:
    • ACF Head: SUS 440C, 4.0×60mm (pneumatic).
    • Main Bonding Head: Ceramic/tungsten carbide, 5.0×40mm (servo + pneumatic).
  • Power & Size: 220V/50Hz/12.5kW; Dimensions: 3,250L × 1,500W × 1,800H mm (excl. FFU).

3.2 FOP Bonder (FPC-on-Panel or FPC-on-Plastic)

  • FPC Range: 10×14mm – 80×120mm (bonding area ≤60mm).
  • Precision±15μm total accuracy.
  • Cycle Time6 seconds (for 5.2″).
  • Key Components:
    • Main Bonding Head: SUS 440C (×2, pneumatic).
  • Power & Size: 220V/50Hz/7.5kW; Dimensions: 2,500L × 1,300W × 1,800H mm (excl. FFU).

4. Technical Advantages

4.1 Precision & Efficiency

  • Linear Motor Robots: High-speed, low-vibration handling.
  • CCD Vision System: Beijing Boshi for real-time alignment correction.
  • Plasma Cleaning: SVD brand (15° water contact angle).

4.2 Component Quality

  • Critical Parts: Fuji/Servotronix servos, THK/HIWIN linear guides, SMC pneumatic components.
  • Inspection Tools: Visual ACF detection, plasma treatment validation.

5. After-Sales & Quality Assurance

5.1 VIP Service

  • 30-minute response time, 24/7 support.
  • 1-year warranty with free installation, training, and lifetime service.
  • 30-day defect resolution: Free replacement/refund if unresolved.

5.2 Quality Control System

  • Design: DQA (Design Quality Assurance) with safety and ESD compliance.
  • Production: Strict assembly standards, precision calibration, and final testing per client specifications.

6. Certifications & Capabilities

  • Certifications: National High-Tech Enterprise (2022–2025), “Specialized, Refined, Unique, Innovative” (2024–2027), AAA Credit Enterprise.
  • Patents: 10+ utility patents, software copyrights, and proprietary technologies.
  • Production Capacity: 4,000+ equipment units delivered, 200+ automated lines deployed.

Contact Information
Shenzhen Olian Automatic Equipment Co., Ltd.
📍 Shenzhen, China
🌐 [bonding-machine.com]
📧 [olian@szolian.com]
📞 [+8618025364779] wechat/whatsapp:+8618025364779

Empowering global display manufacturing with precision automation since 2012.


SEO Keywords: COP bonder, FOP bonder, LCM module automation, chip-on-panel equipment, flexible display bonding, Shenzhen automation company, high-precision bonder, Olian equipment,chip on plastic, fpc on plastic.

szolian

3 comments so far

LeahPosted on11:07 上午 - 12 月 30, 2025

best COP FOP bonding line,help us in the flexible amoled displays production.

DanielPosted on3:40 下午 - 1 月 3, 2026

3-8 Inch Small-Size COP/FOP Bonding Line

EloisePosted on6:40 下午 - 1 月 11, 2026

COP FOP bonder for OLED panels, good machines for future.

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