OL-F0715 – 7-Inch 150mm Head Manual FOG Bonding Machine with Lower-Side Alignment
OL-F0715 – 7-Inch Dual-Station Manual FOG Bonding Machine
The OL-F0715 by Olian Automatic is a dual-station manual FOG (Film-on-Glass) bonding machine designed for thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. This model features an extended 150 mm press head, enabling bonding of wide FPCs or multiple connectors in a single stroke—ideal for automotive displays, industrial HMIs, and large-flex applications.
The system assumes that anisotropic conductive film (ACF) has already been pre-applied to the panel or FPC. It performs main bonding only, fully curing the ACF joint under controlled heat, pressure, and time. It does not apply ACF, nor does it support IC or COF chip bonding.
Alignment Method: Lower-Side Fixed Microscope
The OL-F0715 uses a single lower-view microscope for alignment. The operator places the panel on a transparent glass stage and views terminal marks from below through the microscope. The FPC is then positioned manually from above using visual estimation and experience.
This “lower-only” alignment approach is straightforward, robust, and well-suited for production environments where FPC pads are sufficiently large or where moderate alignment tolerance is acceptable.
Extended 150 mm Press Head
A key differentiator of the OL-F0715 is its 150 mm long press head, significantly longer than standard 60 mm heads. This allows:
Bonding of wide FPCs (e.g., full-width display connectors)
Simultaneous pressing of multiple adjacent terminals
Reduced need for repositioning during multi-zone bonding
The head thickness is 1.0 mm, and custom dimensions are available upon request.
Dual Independent Workstations
The machine includes two identical, fully independent stations arranged side by side. Each station features:
A vacuum-hold glass panel platform
A fixed upper area for FPC placement
A lower-view optical microscope with coaxial LED lighting
An automatic hot press actuator
Operators can alternate between stations for continuous workflow, maximizing uptime in small-batch or pilot-line production.
Bonding Process
Operator places the ACF-pre-laminated panel on the glass stage.
Activates vacuum to secure the panel.
Places the FPC manually, aligning using the lower microscope view.
Presses both start buttons simultaneously (dual-hand safety interlock).
The 150 mm press head descends automatically, applying heat and pressure for the set duration.
After bonding, the head retracts. Operator removes the finished panel.
The thermal cycle is fully automated once initiated, ensuring consistent results.
Performance Specifications
Temperature range: Room temperature to 400°C
Temperature uniformity: ≤ ±5°C across the press head surface
Bonding time: Adjustable from 0.1 to 99.0 seconds
Pressure control: 45 N to 600 N, pneumatically regulated
Press head size: 150 mm × 1.0 mm (standard; customizable)
Heating is achieved via high-efficiency cartridge heaters, with temperature monitored by industrial-grade sensors for process stability.
Buffer Material Handling
An integrated buffer tape feed system protects the FPC during pressing:
Buffer roll inner diameter: ≥33 mm
Outer diameter: ≤80 mm
Feeding pitch: adjustable from 1 mm to 20 mm
Failure alarm: If the buffer tape does not advance, the machine triggers an audible and visual alert to prevent dry bonding
Control System & Safety
Control unit: PLC-based logic with color touchscreen interface
Manual controls: Physical vacuum, start, and emergency stop buttons
Safety features: Dual-hand start requirement, emergency stop switch, and automatic head retraction
All critical parameters—temperature, time, pressure—are configured via the HMI for repeatability across shifts.
Physical Dimensions & Utilities
Machine size: 900 mm (W) × 720 mm (D) × 1450 mm (H)
Weight: Approximately 255 kg
Power supply: Single-phase 220V AC, 2000W, 3-wire (1.5 mm²)
Compressed air: 0.5–0.7 MPa, flow 250 L/min, supplied via Φ8 mm tubing
The compact footprint integrates easily into cleanrooms or production lines.
Applications
Ideal for bonding:
Wide FPCs for automotive instrument clusters
Industrial display modules with long connector spans
IN-CELL touch sensor flexes
Multi-terminal flexible PCB interconnects
Commonly used in automotive electronics, medical displays, and heavy-equipment HMI manufacturing.
Important Clarifications
No upper-lens or dual-lens vision system – alignment is lower-view only
Does NOT bond bare ICs or standard COF chips
Does NOT apply ACF – requires pre-laminated materials
Training, Warranty & Support
Olian Automatic provides full lifecycle support:
One-year warranty on mechanical and electrical systems (excludes wear parts such as heating tubes or buffer rollers)
On-site service within 72 hours if remote troubleshooting fails during warranty
One-day hands-on training covering:
Machine installation and calibration
Parameter setup and optimization
Manual alignment best practices
Common fault diagnosis and replacement
Lifetime technical support via phone, email, or video call
Model: OL-F0715 Type: Dual-Station Manual FOG Main Bonding Machine Key Feature: 150 mm extended press head Alignment: Lower-side microscope only Max Panel Size: 7 inches (rigid glass)
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