85inch Dual station pulse heating ACF OLB TAB COF bonding machine OL-FP085

This is a dual station repair hot press machine, with OLB repair at the left station and FOB repair at the right station. Only OLB or PCB is working at each time.
Left workstation: It is a device that performs alignment bonding on the display screen to connect COF (with conductive film ACF attached). The placement and alignment of the display screen and FPC are manually completed, while bonding is automatically completed by the device. Mainly used for the maintenance or production of TV display screens, with the platform manually moving left and right
Right workstation: It is a device that performs alignment bonding for connecting FPC(COF) on a PCB with a conductive film (ACF) attached. The placement and alignment of the PCB and FPC(COF) are manually completed, while bonding is automatically completed by the device.

This device is mainly used for repairing the display panel of monitors, tablets, or televisions in case of poor COF. You can repair defects on the OLB side (using the left bonding head for bottom alignment), as well as defects on the PCB side (using the right bonding head for top alignment).

1. Adopting a high accuracy imaging unit, the amplification bit is increased to nearly 150 times;
2. Add manual room temperature Pre Bonding function to solve COF bending problem;
3. The use of both upper and lower light sources for alignment enhances the clarity of the alignment process.
4. Adopting Pulse heating method, suitable for various products.
5. The PLC control action increases the accuracy temperature control module to control the temperature, improving the stability of the entire machine.
6. Increase the platform to 100 inches.
7. Change the fixed platform to a platform that can be moved left and right (manually) to reduce the number of times to handle and place LCD glass.
8. Install a retractable support mechanism at the end of the platform, which extends out to fix the LCD glass when producing the G-L of the product.
9. A cushion block structure is added to the platform surface to prevent vacuum between the LCD glass and the platform, making it easy to pick up and place the glass when producing large-sized LCD glass.
10. The platform flatness adjustable system has been equipped with a flatness adjustment mechanism at the bottom layer of the platform.

11. Bonding the PLB and PCB separately on the left and right bonding heads to reduce the steps of changing the size of the bonding head and modifying parameters.
12. Using dual bonding heads, separate the OLB and PCB ends with two bonding heads for better separation of process parameters.

LCD SIZE： 7~85inch
Capacity: 100 segments/H
COF bonding range： 11~65mm;
OLBBonding accuracy: X±0.008mm,Y±0.008mm;
PCBBonding accuracy: X±0.08mm,Y±0.08mm;
Heating method: Pulse heating
Temperature range: RT-400℃;
Working air pressure: 0.4~0.6Mpa;
Power Supply: 220V，50HZ，4000W;
Total weight: 550Kg;
Dimensions: L800*W840*H1310