65inch single station simple OLB pulse heating COF bonding machine OL-FD065

This single station OLB COF bonding machine is a device that performs alignment bonding on the display screen to connect COF (with conductive film ACF attached). The placement and alignment of the display screen and FPC are manually completed, while bonding is automatically completed by the device. Mainly used for the maintenance or production of TV display screens, with the platform manually moving left and right.

This device is mainly used for repairing the display panel of monitors, tablets, or televisions in case of bad COFs. It is possible to repair defects on the OLB side (using lower alignment), as well as on the PCB side (using upper alignment).

1. Adopting a high accuracy imaging unit, the amplification bit is increased to nearly 150 times;
2. Add manual room temperature Pre Bonding function to solve COF bending problem;
3. The use of both upper and lower light sources for alignment enhances the clarity of the alignment process.
4. Adopting pulse heating method, suitable for various products.
5. The PLC control action increases the accuracy temperature control module to control the temperature, improving the stability of the entire machine.
6. Increase the platform to 85 inches,
7. Change the fixed platform to a platform that can be moved left and right (manually) to reduce the number of times to handle and place LCD glass,
8. Install a retractable support mechanism at the end of the platform, which extends out to fix the LCD glass when producing the G-L of the product.
9. A cushion block structure is added to the platform surface to prevent vacuum between the LCD glass and the platform, making it easy to pick up and place the glass when producing large-sized LCD glass.
10 platform flatness adjustable system, with a flatness adjustment mechanism added at the bottom of the platform;
11. OLB and PCB are crimped using the same bonding head, and the process parameters are switched through the touch screen;

LCD SIZE： 15~65inch
Capacity: 100 segments/H
Maximum number of segments no limit
COF bonding range： 11~65mm;
Bonding accuracy: X±0.008mm,Y±0.008mm;
Heating method: Pulse heating;
Temperature range: RT-400℃;
Working air pressure: 0.4~0.6Mpa;
Power Supply: 220V，50HZ，2100W;
Total weight: About350Kg;
Dimensions: “Width：About 1450mm
Deepth：About 1250 mm
Height：About 1450 mm
Workbench height：About850±50mm (not include brackets and glass size)
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