120inch single station FOB bonding machine OL-FDB120

This equipment is a single station FOB bonding machine, which is a device that performs alignment bonding for connecting FPC on a PCB with a conductive film (ACF) attached. The placement and alignment of the PCB and FPC are manually completed, while bonding is automatically completed by the equipment.

This device is suitable for large and middle size PCB product bonding.

LCD SIZE： 21.5~120inch
Capacity: 180~250 segments/H
Maximum number of segments ≤10
Bonding accuracy: X±0.08mm,Y±0.08mm;
Heating method: Constant temperature control;
Temperature range: RT-400℃;
Working air pressure: 0.4~0.6Mpa;
Power Supply: 220V，50HZ，3500W;
Total weight: About540Kg;
Dimensions: L3550*W1550*H1610;