Single-Platform Laser Processing Equipment
Engineered for cutting and drilling every kind of brittle, hard sheet: common glass, optical glass, quartz, sapphire, strengthened glass, optical filters, ceramics, etc.
Cutting Configuration – Infrared Picosecond
Model series: OL-IPC4050-S，
Table size: 400 mm × 500 mm (custom sizes available).
Thickness range: 0.03 – 8 mm.
Cutting speed: 0 – 1 000 mm/s.
Edge chipping: ≤ 10 µm.
Drilling Configuration – Green Nanosecond.
Model series: OL-GND4050-S.
Table size: 400 mm × 500 mm (custom sizes available).
Thickness range: 0.03 – 2 mm.
Drilling speed: 0 – 5 000 mm/s.
Edge chipping: ≤ 100 µm.
Processing Advantages
The machine merges modular architecture with high-density integration, re-engineers the conventional optical path and support structure, and enables on-the-fly switching between cutting and drilling on the same platform. An adaptive process controller guarantees micron-level precision across multiple materials.
