OL-A003 Semi-Automatic 12-Inch ACF Laminating Machine – Precision Thermal Bonding for LCD, FPC, and Display Module Assembly。

The OL-A003 semi-automatic ACF laminating machine by Olian Automation is a compact, high-accuracy bonding system engineered for reliable application of anisotropic conductive film (ACF) onto LCD panels, flexible printed circuits (FPCs), and printed circuit boards (PCBs). Designed for R&D labs, pilot production lines, and small-to-medium batch manufacturing, this manual ACF bonding machine supports panel sizes from 1 inch up to 12 inches, making it ideal for applications in consumer electronics, automotive displays, medical devices, and industrial HMIs.
Unlike fully automated systems that require complex integration, the OL-A003 desktop ACF bonder strikes the perfect balance between operator control and process automation. Users manually load and unload the panel, while the machine automatically handles ACF feeding, thermal compression bonding, carrier film peeling, and precision cutting—ensuring consistent results with minimal training.
The OL-A003 is built with reliability in mind. It features:
This semi-auto ACF laminator is widely used in:
For engineers and procurement teams searching for a cost-effective 12-inch ACF bonding machine, a benchtop ACF laminating system, or a manual ACF bonder with high positional accuracy, the OL-A003 delivers exceptional value. It eliminates the complexity and cost of full automation while maintaining the precision required for modern micro-electronics assembly.
Backed by Olian Automatic—a certified national high-tech enterprise specializing in LCM automation solutions—the OL-A003 combines proven engineering, robust component selection, and user-centric design into one dependable platform.
Model: OL-A003
Type: Semi-Automatic ACF Laminating Machine
Panel Size Range: 1″ to 12″
Bonding Accuracy: ±0.2 mm (X/Y)
Operation Mode: Manual loading/unloading, automatic bonding cycle
Target Industries: Display manufacturing, electronics assembly, R&D, repair
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