The OL-FP003 by Olian Automatic is a dual-station manual pulse pre-bonding machine designed for temporary tacking of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. This system uses short-duration pulse heating to lightly cure anisotropic conductive film (ACF), holding the FPC in place before final main bonding.
The machine assumes that ACF has already been pre-applied to the panel or FPC. It performs pre-bonding only—not full main bonding—and does not support IC, COF, or ACF lamination functions.
Alignment Method: Lower-Side Microscope Only
The OL-FP003 employs a single lower-view microscope for alignment. The operator places the panel on a transparent glass stage and views terminal marks from below through the microscope. The FPC is then positioned manually from above using visual estimation.
This “lower-only” method provides a simple, cost-effective solution for applications where moderate alignment accuracy is sufficient.
Dual Independent Workstations
The machine features two identical, fully independent stations arranged side by side. Each includes:
A vacuum-hold glass panel platform
A fixed upper area for FPC placement
A lower-view optical microscope with coaxial LED lighting
An automatic pulse-heated press head
Operators can alternate between stations for continuous workflow, improving efficiency in small-batch or R&D environments.
Pulse Pre-Bonding Process
Operator places the ACF-pre-laminated panel on the glass stage.
Activates vacuum to secure the panel.
Places the FPC manually, aligning using the lower microscope view.
Presses both start buttons simultaneously (dual-hand safety interlock).
The press head descends and delivers a brief thermal pulse.
After tacking, the head retracts. Operator removes the panel for transfer to a main bonder.
The cycle is semi-automatic—alignment is manual, but heating and pressing are controlled and repeatable.
Performance Specifications
Temperature range: Up to 400°C
Temperature uniformity: ≤ ±8°C across the press head
Heating time: Adjustable from 0.1 to 99.9 seconds
Pressure range: 20 N to 300 N, pneumatically regulated
Standard press head size: 50 mm × 0.8 mm (custom sizes available)
Rapid-response cartridge heaters enable precise thermal pulses ideal for ACF tacking without over-curing.
Buffer Material Handling
An integrated buffer tape feed system protects the FPC during pressing:
Buffer roll inner diameter: ≥33 mm
Outer diameter: ≤80 mm
Feeding pitch: 1–20 mm
Failure detection: If the buffer tape fails to advance, the machine triggers an audible and visual alarm
Control System & Safety
Control unit: PLC-based logic with color touchscreen interface
Manual controls: Physical vacuum, start, and emergency stop buttons
Safety features: Dual-hand start requirement and emergency stop switch (Φ22)
All key parameters—temperature, time, pressure—are set via the HMI for consistent pre-bond quality.
Physical Dimensions & Utilities
Machine size: 900 mm (W) × 720 mm (D) × 1450 mm (H)
Weight: Approximately 255 kg
Power supply: Single-phase 220V AC, 2000W, 3-wire (1.5 mm²)
Compressed air: 0.5–0.7 MPa, flow 250 L/min, supplied via Φ8 mm tubing
Compact and robust, suitable for cleanrooms, pilot lines, and repair workshops.
Applications
Ideal for pre-bonding:
FPCs for small TFT, IPS, or OLED displays
IN-CELL touch sensor flexes
Flexible interconnects in automotive or industrial modules
Commonly used in display assembly, prototyping labs, and low-volume production.
Important Clarifications
Does NOT apply ACF – requires pre-laminated materials
