OL-F003 – 7-Inch Dual-Station Manual FOG Bonding Machine

OL-F003 – 7-Inch Dual-Station Manual FOG Bonding Machine

OL-F003 – 7-Inch Dual-Station Manual FOG Bonding Machine with Lower-Side Fixed Alignment

The OL-F003 by Olian Automatic is a dual-station manual FOG (Film-on-Glass) bonding machine designed for thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. This system uses lower-side visual alignment only, where operators view panel terminals from below through a single microscope while manually positioning the FPC from above.

The machine assumes that anisotropic conductive film (ACF) has already been pre-applied to either the panel or the FPC. It performs main bonding only—fully curing the ACF joint under heat and pressure. It does not apply ACF, nor does it support IC or COF bonding.

Alignment Method: Lower-Side Fixed Microscope

Unlike dual-lens systems, the OL-F003 employs a single lower-view microscope. The operator places the panel on a transparent glass stage. They look through the microscope from below to see the panel’s terminal marks. Then, they manually place and adjust the FPC from above using visual estimation and experience.

This “lower-only” method is simple, cost-effective, and suitable for applications where ultra-high precision is not required or where FPC pads are large enough for manual placement tolerance.

Dual Independent Workstations

The machine features two identical, fully independent bonding stations side by side. Each station includes:

• A vacuum-hold glass panel stage
• A fixed upper FPC positioning area
• A lower-view microscope with lighting
• An automatic hot press head

Operators can work on one station while the other is idle, enabling continuous production. All loading, unloading, and alignment are performed manually at the front.

Bonding Process

1. Operator places the ACF-pre-laminated panel on the glass stage.
2. Activates vacuum to secure the panel.
3. Places the FPC onto the panel by hand, aligning visually using the lower microscope.
4. Presses both start buttons simultaneously (dual-hand safety).
5. The hot press head descends automatically, applies heat and pressure for a preset time.
6. After bonding, the head retracts. Operator removes the finished panel.

The entire bonding cycle is semi-automatic—alignment is manual, but pressing is controlled and repeatable.

Performance Specifications

• Bonding temperature: Up to 400°C
• Temperature uniformity: ≤ ±8°C across the press head
• Bonding time: Adjustable from 0.1 to 99.0 seconds
• Pressure range: 20 N to 300 N, pneumatically regulated
• Standard press head size: 60 mm × 1.0 mm (custom sizes available)

Heating is delivered via embedded cartridge heaters, monitored by K-type thermocouples for stable thermal control.

Buffer Material Handling

An integrated buffer tape feed system protects the FPC during bonding:

• Buffer roll inner diameter: ≥33 mm
• Outer diameter: ≤80 mm
• Feeding pitch: 1–20 mm
• Alarm function: If the buffer tape fails to advance, the machine triggers an audible and visual alert

Control System & Safety

• Control unit: PLC-based logic with color touchscreen interface
• Manual controls: Physical start, vacuum, and emergency stop buttons
• Safety features: Dual-hand start requirement, emergency stop switch (Φ22), and automatic head retraction

All critical parameters—temperature, time, pressure—are set via the HMI for consistent results.

Physical Dimensions & Utilities

• Machine size: 900 mm (W) × 720 mm (D) × 1450 mm (H)
• Weight: Approximately 255 kg
• Power supply: Single-phase 220V AC, 2000W, 3-wire (1.5 mm²)
• Compressed air: 0.5–0.7 MPa, flow 250 L/min, supplied via Φ8 mm tubing

Compact footprint suits cleanrooms, pilot lines, and repair workshops.

Applications

Suitable for bonding:

• FPCs to rigid TFT, IPS, or OLED panels
• IN-CELL touch sensor flexes

Commonly used in:

• Industrial display assembly
• Automotive cluster manufacturing
• Small-batch production and R&D labs

Important Clarifications

• No upper-lens or dual-lens vision system – alignment is lower-view only
• Does NOT bond bare ICs or standard COF modules
• Does NOT apply ACF – requires pre-laminated materials

Training, Warranty & Support

Olian Automatic provides complete post-sale support:

• One-year warranty on all mechanical and electrical components (excludes wear parts like heaters or buffer rollers)
• On-site service within 72 hours if phone support fails during warranty
• One-day training covering:
  • Machine installation and leveling
  • Parameter setup (temp/time/pressure)
  • Manual alignment technique
  • Common fault diagnosis and易损件 replacement
• Lifetime technical support via remote assistance

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Model: OL-F003
Type: Dual-Station Manual FOG Bonding Machine
Alignment: Lower-side microscope only
Max Panel Size: 7 inches (rigid glass)
Core Advantage: Simple, reliable, cost-effective manual bonding with dual-station throughput

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