Precision Thermal Alignment System for COF/IC to LCD Panel Assembly
The OL-COF156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic pre-bonding machine engineered for the initial alignment and temporary bonding of Chip-on-Film (COF) or bare IC chips onto large-format rigid LCD panels up to 15.6 inches. Designed as the critical first step in the FOG (Film-on-Glass) or COG (Chip-on-Glass) process chain, this system ensures accurate terminal registration and secure tacking before final main bonding—dramatically reducing misalignment defects and rework rates.
Unlike full bonding machines, the OL-COF156 focuses exclusively on pre-compression: applying controlled heat and pressure to activate the ACF just enough to hold components in place during transfer to the main bonder.
🔍 Key Applications
Pre-bonding of COF tapes and driver ICs onto LCD/OLED display panels
Temporary fixation of touch sensor flex circuits
High-mix production of industrial, automotive, medical, and consumer displays
Ideal for panels requiring multi-segment or single-edge bonding
⚠️ Note: This machine performs pre-bonding only—it does not apply ACF, conduct final bonding, or support double-side processing.
🛠️ Core Technical Specifications
Substrate Compatibility
LCD Panel Size:
Max: 15.6 inches (350 mm × 250 mm)
Min: 7 inches (150 mm × 80 mm)
Thickness: 0.2 – 2.2 mm
COF Dimensions:
Length: 12 – 60 mm
Width: 12 – 30 mm
Thickness: 0.02 – 0.2 mm
Minimum mark pitch: ≥11 mm
IC Dimensions:
Max: 40 mm × 3 mm
Min: 5 mm × 0.5 mm
Thickness: 0.08 – 0.5 mm
Step Requirement: COF/IC must maintain a ≥0.4 mm height difference from the glass surface for proper head clearance
Bonding Performance
Heating System:
Heater Type: Cartridge-style Φ6 mm × 75 mm heating rods
Temperature Range: Room temperature to 400°C
Control Accuracy: ±2°C
Pressure & Time:
Adjustable bonding force via precision air regulator
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