OL-C012 – 7-Inch Dual-Station Servo Main Bonding Machine
The OL-C012 by Olian Automatic is a dual-station manual main bonding machine. It performs final thermal compression bonding of ICs/COF/FPC onto rigid LCD panels up to 7 inches.
This system assumes that ACF has already been applied and ICs have been pre-aligned on the panel. The machine executes only the main bonding (final curing) step.
The operator places an ACF-pre-laminated LCD with pre-positioned IC onto either station.
They press a vacuum button to secure the panel.
Then they press both start buttons with two hands.
The servo-driven bonding head descends smoothly.
It applies precise heat, pressure, and time to fully cure the bond.
After cooling, the head retracts automatically.
The operator removes the bonded panel manually.
Both left and right stations operate independently. Two operators can work simultaneously, or one operator can alternate between stations.
Bonding head temperature: up to 300°C
Temperature uniformity: within ±5°C
Bonding time: adjustable from 0.1 to 99.0 seconds
Pressure range: 20 N to 400 N, controlled by servo motor
Standard head size: 40 mm × 4.0 mm (custom sizes available)
Heating uses high-efficiency Φ9.5×70 mm, 220V, 220W cartridge heaters.
Temperature is monitored by K-type thermocouples.
Machine frame: industrial-grade steel
Control system: servo motor + PLC logic
Safety features: dual-hand start buttons, emergency stop switch
All manual operations occur at the same front position for ergonomic workflow
Dimensions: 920 mm (W) × 900 mm (D) × 1590 mm (H)
Weight: approximately 430 kg
Power: single-phase 220V AC, 2000W
Compressed air: 0.5–0.7 MPa, flow 450 L/min, tubing Φ8 mm
Designed exclusively for main bonding of bare ICs on:
Not suitable for pre-bonding.
This machine does not include:
It is a dedicated main bonder for final IC curing only.
Includes one-year warranty (excluding wear parts like heating tubes).
On-site service within 72 hours if phone support fails during warranty.
One day of training covers installation, operation, parameter setup, and maintenance.
Lifetime remote technical support is provided.
Model: OL-C012
Type: Dual-Station Manual Main Bonding Machine
Function: Final IC Thermal Compression Only
Substrate: Rigid Glass Panels (≤7 inches)
Core Tech: Servo-controlled pressure, precise thermal management
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