Cuts all hard-brittle sheet materials: ordinary glass, optical glass, quartz, sapphire, reinforced glass, optical filters, mirrors, etc. The same system also produces internal cut-outs and holes to specified dimensions.
Laser type: Infrared picosecond Model: OL-IPC70120-D/OL-IPC90140-D Standard platform sizes: 700 mm × 1 200 mm and 900 mm × 1 400 mm (custom sizes on request) Thickness range: 0.03 – 8 mm Maximum cutting speed: 1 000 mm/s Edge chipping: ≤ 10 µm
Processing Advantages
Dual-platform layout integrates cutting and cleaving in one compact footprint
High-speed shaping of irregular outlines shortens process transfer time
Cut edges are straight (no taper), micro-chipping is below 10 µm and edges are safe to touch
Instant change-over between different product sizes through simple software settings; operator training is minimal
Low running cost: no consumables, no waste liquids, slurry or sludge, no surface scratching, high yield
