Fully Automatic COG COF COP FOG FOF Bonding Machine
A fully automatic COG COF COP FOG FOB FOF TFOG bonding machine is the precision heart of every modern display factory. It decides—within ±1 µm and under three seconds—whether a driver IC sits directly on glass (COG), on a foldable plastic film (COP), on a continuous copper-clad reel (COF), or whether a touch sensor tail (TFOG) folds 180° behind the screen. All processes share the same granite spine, AI vision brain, and pulse-heat heartbeat, yet each acronym describes a different “X-on-Y” marriage that defines bezel width, fold radius, and thermal survival. This guide explains physics, hardware, software, specs, applications, trends, and maintenance ranks you for “fully automatic COG bonding machine”, “COF bonder”, “COP bonding machine”, “FOG bonder”, “FOB bonding machine”, “FOF bonding machine”, “TFOG bonder”, and every high-value permutation.
1. Why “Fully Automatic” Matters
Manual loading, hand-alignment, and operator-dependent pressure are no longer acceptable when bezels shrink to 0.9 mm and foldable phones must survive 200,000 bends. A fully automatic bonding machine integrates:
Robot Loaders: 6-axis arms or SCARA pickers feed glass, flex, or plastic reels without human touch.
AI Vision Alignment: 12 MP dual cameras + deep-learning edge detection achieve ±3 µm @ 3σ in < 200 ms.
Pulse-Heat Engine: 200 °C/s ramp, ±0.5 °C closed-loop, overshoot < 1 °C.
Force-Feedback Loop: Voice-coil or servo motor, 0.1 g resolution, 2 ms response; active gravity cancellation for 25 µm PET.
MES/Cloud Link: OPC-UA uploads every temperature, pressure, and resistance curve; AI predicts heater life 200 cycles ahead.
Change-over from COG to COP takes < 15 s: swap the low-temp recipe, load PET parameters, and let the AI retune the PID loop.
2. Physics Common to All “X-on-Y” Flavours
Bump Formation: Gold or copper bumps 5–25 µm high are plated on the IC during wafer-level bumping.
ACF Lamination: 25–45 µm anisotropic conductive film is tacked to the substrate at 80 °C, 0.2 MPa.
Vision Alignment: AI cameras capture fiducials on die and substrate; algorithm calculates offset in X, Y, θ, and scale within ±1 µm @ 3σ.
Pulse Heat & Pressure:
COG (Chip-On-Glass): 180–220 °C, 1.0–1.5 MPa, 1.5 s
COF (Chip-On-Film): 180–220 °C, 1.0–1.5 MPa, 2.0 s (includes reel index)
COP (Chip-On-Plastic): 140–180 °C, 0.6–1.0 MPa, 1.5 s (PET-friendly)
FOG (Film-On-Glass): 160–200 °C, 0.8–1.2 MPa, 2.0 s
FOB (Film-On-Board): 160–200 °C, 0.8–1.2 MPa, 2.0 s
FOF (Film-On-Film): 140–180 °C, 0.6–1.0 MPa, 1.5 s
TFOG (Touch-Flex-On-Glass): 160–200 °C, 0.8–1.2 MPa, 2.0 s
Cool Under Load to < 60 °C while maintaining pressure, locking conductive particles.
In-Situ Kelvin Test < 30 mΩ per bump; > 30 mΩ triggers automatic rework.
3. Fully Automatic COG – Razor-Bezel King
Substrate: ITO glass 0.3–1.1 mm
Die Size: 0.5 × 0.5 mm to 15 × 15 mm
Force Range: 10–100 kg
Pain Point: CTE mismatch glass vs silicon → head must cancel its own weight to 0.1 g
Auto Features: Robot loads glass, AI aligns bumps to ITO within 200 ms, bonded tail folds 180° for 0.9 mm chin
Cold-Laser Assist: Femtosecond laser pre-cleans ITO at 25 °C, enabling 120 °C PET bonds.
AI Yield Predictor: Neural networks forecast particle-trap probability, pushing yield to 99.9 %.
Servo-Hydraulic Hybrid: 80 kg force for 100″ TV glass while maintaining 1 µm accuracy.
Roll-to-Roll COF + TFOG: Reel-fed driver and touch tails bonded at 3,000 UPH.
According to industry analysis, the global fully automatic bonding machine market is expected to grow at a CAGR of 6–8 % driven by foldable phones, automotive displays, and medical wearables
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11. Daily Maintenance Across All Modes
Clean DLC head with lint-free wipe and IPA every 200 cycles to prevent ACF build-up.
Verify thermocouple vs dry-block calibrator weekly; drift > 0.3 °C triggers replacement.
A fully automatic COG COF COP FOG FOB FOF TFOG bonding machine is no longer a collection of separate presses—it is a single, AI-driven, cloud-connected gateway that turns naked silicon, floppy polyimide, and curved glass into the foldable phones, 8-K TVs, and transparent medical patches that define 2025. By mastering sub-micron alignment, single-degree thermal control, and real-time force feedback, these multi-mode platforms deliver 99.9 % yield and full Industry 4.0 traceability—future-proofing your process。
