COG/COF Pre-Bonding machine OL-C0156
This device is a semi-automatic Pre Bonding machine, which is a device for aligning and Pre Bonding IC on a panel that has already been attached with a conductive film (ACF). The removal and placement of the panel are manually completed, while the alignment and Pre Bonding are automatically completed by the device.
COG/COF Pre-Bonding machine .This device is suitable for medium sized COG and COF products.
LCD SIZE： 7~17.3inch
Capacity: About400~600pcs IC／hour;
Maximum number of segments ≤10
IC specification range: MIN:60.6mm,MAX385mm;
Pre bonding accuracy: ±0.003mm
Heating method: Constant temperature control;
Temperature range: RT-150℃;
Working air pressure: 0.4~0.6Mpa;
Power Supply: 220V，50HZ，1000W;
Total weight: 488Kg;
Dimensions: L1010W1060H1500;
