5-17.3 Inch Mid-Size LOAD/EC/COG/FOG/FPC Production Line.
Engineered for High-Mix, High-Precision Display Manufacturing
This document details Olian Automatic’s turnkey solution for mid-size display module assembly (5″–17.3″), focusing on LOAD (Panel Handling), EC (End-to-end Cleaning), COG (Chip-on-Glass), COF (Chip-on-Film), FOG (Film-on-Glass), and FPC (Flexible Printed Circuit) loading processes. Designed for rigid and flexible panel substrates, this production line integrates robotics, vision systems, and precision bonding technologies to achieve sub-micron accuracy and support high-mix production environments.
1. Production Line Overview
Core Capabilities
Size Range: Supports 5″ to 17.3″ displays (16:9 aspect ratio) with substrate thicknesses from 0.15mm to 0.7mm and (warpage) ≤0.2mm.
High-Mix Flexibility: Accommodates up to 4 ICs (adjacent sides) and 2 FPCs per panel, with dual material loading for non-stop loading.
Throughput: Achieves 4–20 seconds per unit, depending on configuration (e.g., 6.5 sec for single IC on 12″ panels).
Temperature: 60°C–100°C (adjustable via line speed).
2.3 COG Bonder (CB3000)
Function: Full-process IC bonding with ACF application, pre-press, and main press.
IC Handling: Supports MIN: 4×0.5mm to MAX: 45×2mm ICs, with dual materials wells for non-stop loading.
Bonding Heads:
ACF head: SUS440C (HRC 52–58), 5.0×70mm
Pre-press head: SUS440C, 2×60mm (dual sets)
Main press heads: Tungsten steel, 5×50mm (dual Short Bar groups)
Vision Alignment: 300k-pixel cameras with 0.5× lenses for input correction and 1300k-pixel cameras with 6× lenses for pre-press alignment.
2.4 COF Punching Machine (Optional)
Function: Servo-driven COF tape feeding with CCD-guided punching.
Accuracy: ±50μm (requires qccuracy ≤±15μm and mode accuracy ≤±5μm).
Cycle Time: 3.5–4.5 seconds per unit.
Reel Compatibility: φ405–600mm outer diameter with φ25.4mm inner diameter.
2.5 FOG Bonder (FB3000)
Function: FPC-to-glass bonding with Long Bar bonding heads and dual-channel FPC feeding.
FPC Support: Standard/U-shaped FPCs up to 200×165mm.
Bonding Heads:
ACF head: SUS440C, 5.0×165mm
Pre-press head: SUS440C, 1.8×165mm
Main press heads: SUS440C, 1×200mm (dual Long Bar groups)
Platform Design: Molybdenum alloy with super-hard oxidation for durability.
2.6 FPC Loader (FLD3000)
Function: Dual-channel FPC feeding with tray-to-bonder transfer.
Tray Compatibility: 250×220mm to 400×460mm trays.
Accuracy: ±0.03mm handling precision with below-arm vacuum pickup.
Cycle Time: 4 seconds (single FPC type) or 6 seconds (dual loading one by one).
3. Technical Advantages
3.1 Automation & Integration
Robotic Handling: Linear motor-driven arms for panel/FPC transfer between stations.
Modular Design: Stations support standalone operation or inline integration via interface ports.
Scalability: Optional USC (Ultrasonic Cleaning) modules and plasma units for enhanced adhesion.
3.2 Precision Engineering
Thermocompression Control: Dual servo-pneumatic systems ensure consistent pressure (20–500N) and temperature (200°C max).
Vision Systems: Real-time CCD correction compensates for substrate warpage or misalignment, with torque motor tension control for ACF/COF feeding.
3.3 Process Reliability
ACF Quality Control: Inline vision inspection verifies film placement before bonding.
Plasma Activation: PT300 plasma units enhance adhesion with water contact angles of 15°–30°.
4. Applications & Industry Impact
This solution targets high-mix manufacturing of:
Automotive Displays: Ensures reliability under 85°C/85% RH conditions with multi-segment ACF application.
Consumer Electronics: Enables ultra-narrow bezels with <0.1mm pitch bonding for foldable OLEDs.
Industrial Panels: Supports ruggedized designs with redundant IC bonding for mission-critical systems.
By integrating LOAD, EC, COG, FOG, and FPC processes into a single line, manufacturers reduce handling errors by 40% and achieve 25% faster changeover times for batch switching.
5. Future-Proof Design
The production line accommodates emerging trends:
AI Integration: Vision systems support machine learning for defect prediction (e.g., void prediction via thermal imaging).
Scalable I/O: Modular stations allow addition of AOI (Automated Optical Inspection) or curing modules.
6. After-Sales Support & Quality Assurance
VIP Service: 30-minute response time, 24/7 support, and lifetime maintenance.
Nice breakdown of Olian Automatic’s mid-size display line—that’s some high-precision, high-mix capability. I especially relate to the panel handling and automated cleaning steps
1 comment so far
Liam CarterPosted on10:55 下午 - 12 月 3, 2025
Nice breakdown of Olian Automatic’s mid-size display line—that’s some high-precision, high-mix capability. I especially relate to the panel handling and automated cleaning steps