OL-CBY156 – 15.6-Inch Dual-Head IC Servo Main Bonding Machine
OL-CBY156 – 15.6-Inch Dual-Head IC Servo Main Bonding Machine
High-Efficiency Thermal Compression System for IC Bonding on 7-17.3inch LCD Panels
The OL-CBY156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-head main bonding machine engineered for the final thermal compression of bare driver IC chips onto ACF-pre-laminated edge terminals of large-format rigid LCD panels up to 15.6 inches. Featuring two independent servo-controlled bonding heads, this system enables either simultaneous bonding of two ICs or sequential multi-zone processing along a single panel edge—significantly boosting throughput while maintaining high bond consistency.
As the critical final step in the COG (Chip-on-Glass) process, the OL-CBY156 fully cures the anisotropic conductive film (ACF), creating permanent, low-resistance electrical interconnects essential for display reliability in automotive, industrial, and consumer applications.
⚠️ Note: This machine assumes that ACF has already been applied and ICs have been pre-aligned (e.g., via a pre-bonder). It does not include ACF application, vision alignment, or double-side bonding capability.
🔧 Key Technical Specifications
Substrate & Component Compatibility
Panel Size:
Max: 350 mm × 250 mm (~15.6″ diagonal)
Min: 150 mm × 80 mm (~7″)
Thickness: 0.2 – 2.2 mm
IC Dimensions:
Length: 5 – 40 mm
Width: 0.5 – 3 mm
Thickness: 0.08 – 0.5 mm
Bonding Configuration:
Single-side only
Supports up to 10 bonding segments per edge
Dual-head operation: Parallel or sequential bonding
Bonding Performance
Heating System:
Heater Type: Cartridge-style Φ9.5 mm × 70 mm heating rods (per head)
Temperature Range: Room temperature to 400°C
Surface Uniformity: ≤ ±3°C across each press head
Pressure Control:
Servo-driven actuators (independent for each head)
Adjustable Force: 20 N to 120 N
Repeatability: ≤ ±3 N
Bonding Time: 0.1 – 99.9 seconds (programmable per head)
Control & Operation
Control Unit:
PLC-based logic controller
Color touchscreen HMI (Chinese interface) for parameter setup and monitoring
Real-time display of temperature, time, pressure, and system status
Operating Modes:
Manual Mode: Full operator control over each head
Auto Mode: One-button cycle with coordinated dual-head action
Replacement of wear parts (heaters, thermocouples, buttons)
Warranty: 12 months on mechanical and electrical systems under normal use
Exclusions: Consumables, damage from misuse, or force majeure
After-Sales Service:
Lifetime technical support via phone/email
On-site engineer dispatch within 72 hours if remote resolution fails during warranty
✅ Included Standard Components
Two custom IC bonding heads (tooling per customer drawing)
Φ9.5 × 70 mm cartridge heaters (×2)
K-type thermocouples for closed-loop temperature control (×2)
Φ24 mm start and vacuum buttons
Φ22 mm emergency stop switch
National-standard (GB) maintenance toolkit
🔖 Model Summary
Model: OL-CBY156
Function: Single-station, dual-head IC main bonder for COG process
Panel Size: Up to 15.6 inches
Core Advantage: Higher throughput via dual servo heads with ±3 N repeatability
Target Applications:
Automotive center-stack displays
Industrial HMIs with redundant drivers
Medical monitors requiring dual ICs
High-mix display module production
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