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OL-COF156 – 15.6-Inch Single-Side Multi-Zone Pre-Bonding Machine

OL-COF156 – 15.6-Inch Single-Side Multi-Zone Pre-Bonding Machine

OL-COF156 – 15.6-Inch Single-Side Multi-Zone Pre-Bonding Machine

OL-COF156 – 15.6-Inch Single-Side Multi-Zone Pre-Bonding Machine

OL-COF156 – 15.6-Inch Single-Side Multi-Zone Pre-Bonding Machine
OL-COF156 – 15.6-Inch Single-Side Multi-Zone Pre-Bonding Machine

Precision Thermal Alignment System for COF/IC to LCD Panel Assembly

The OL-COF156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic pre-bonding machine engineered for the initial alignment and temporary bonding of Chip-on-Film (COF) or bare IC chips onto large-format rigid LCD panels up to 15.6 inches. Designed as the critical first step in the FOG (Film-on-Glass) or COG (Chip-on-Glass) process chain, this system ensures accurate terminal registration and secure tacking before final main bonding—dramatically reducing misalignment defects and rework rates.

Unlike full bonding machines, the OL-COF156 focuses exclusively on pre-compression: applying controlled heat and pressure to activate the ACF just enough to hold components in place during transfer to the main bonder.


🔍 Key Applications

  • Pre-bonding of COF tapes and driver ICs onto LCD/OLED display panels
  • Temporary fixation of touch sensor flex circuits
  • High-mix production of industrial, automotive, medical, and consumer displays
  • Ideal for panels requiring multi-segment or single-edge bonding

⚠️ Note: This machine performs pre-bonding only—it does not apply ACF, conduct final bonding, or support double-side processing.


🛠️ Core Technical Specifications

Substrate Compatibility

  • LCD Panel Size:
    • Max: 15.6 inches (350 mm × 250 mm)
    • Min: 7 inches (150 mm × 80 mm)
    • Thickness: 0.2 – 2.2 mm
  • COF Dimensions:
    • Length: 12 – 60 mm
    • Width: 12 – 30 mm
    • Thickness: 0.02 – 0.2 mm
    • Minimum mark pitch: ≥11 mm
  • IC Dimensions:
    • Max: 40 mm × 3 mm
    • Min: 5 mm × 0.5 mm
    • Thickness: 0.08 – 0.5 mm
  • Step Requirement: COF/IC must maintain a ≥0.4 mm height difference from the glass surface for proper head clearance

Bonding Performance

  • Heating System:
    • Heater Type: Cartridge-style Φ6 mm × 75 mm heating rods
    • Temperature Range: Room temperature to 400°C
    • Control Accuracy±2°C
  • Pressure & Time:
    • Adjustable bonding force via precision air regulator
    • Bonding time: 0.1 – 99.9 seconds (user-configurable)
  • Platform:
    • Work area: 380 mm (W) × 210 mm (D)
    • Material: High-flatness alloy (implied from industrial design)

Operation & Control

  • User Interface7-inch color touchscreen, fully Chinese-language, with intuitive icons
  • Operating Modes:
    • Manual Mode: Full operator control over head movement and vacuum
    • Auto Mode: One-button cycle after alignment
  • Real-Time Monitoring: On-screen display of temperature, time, pressure, and system status

Safety & Ergonomics

  • Physical Controls:
    • Start Button (Φ24 mm)
    • Vacuum Button (Φ24 mm)
    • Emergency Stop (Φ22 mm, red mushroom type)
    • Main Power Switch
  • Safety Features:
    • Warning labels at high-temperature zones (e.g., hot press head)
    • Clean, dust-free delivery condition
    • EMO cuts power to motion systems for safe manual override

🔄 Typical Workflow

  1. Load Panel: Operator places clean LCD panel onto the platform.
  2. Fixturing: Activates vacuum to hold panel flat.
  3. Place COF/IC: Manually positions COF tape or IC chip onto ACF-pre-laminated area.
  4. Visual Alignment: Uses external microscope or camera (user-provided) for fine adjustment.
  5. Pre-Bond: Selects auto/manual mode, sets parameters, and initiates cycle.
  6. Unload: Removes pre-bonded panel for transfer to main bonder.

Cycle time is typically under 20 seconds, depending on operator skill and product complexity.


📦 Machine Physical Data

  • Dimensions: Approx. 960 mm (W) × 1020 mm (D) × 1900 mm (H)
    (Includes 1670 mm base + 230 mm top structure)
  • Weight: ~441 kg
  • Work Height: Platform 850 ± 30 mm from floor—ergonomic for seated/standing operation
  • Color Scheme: Frame in beige ; functional parts chrome-plated or anodized
  • Operating Environment:
    • Cleanroom required
    • Temperature: 22–27°C
    • Humidity: 40–70% RH

🛡️ Quality, Training & Support

  • Documentation: Includes 1 Chinese-language operation manual
  • Training1-day on-site session covering:
    • Machine installation and leveling
    • Parameter setup for different COF/IC types
    • Common fault diagnosis (e.g., poor adhesion, misalignment)
    • Replacement of consumables (heaters, buttons)
  • Warranty12 months on mechanical/electrical systems under normal use
    • Exclusions: Wear parts (buttons, seals), damage from misuse, or force majeure
  • After-Sales Service:
    • Lifetime technical support
    • On-site engineer within 72 hours if remote troubleshooting fails during warranty

✅ Included Standard Components

  • Custom COF/IC loading jig (tooling)
  • Φ24 mm start and vacuum buttons
  • Φ22 mm emergency stop switch
  • Φ6 × 75 mm cartridge heaters
  • National-standard (GB) maintenance toolkit

🔖 Model Summary

  • Model: OL-COF156
  • Function: Single-side multi-zone pre-bonding for COF/IC on LCD
  • Panel Size: Up to 15.6 inches
  • Key Advantage: Precise thermal tacking with manual alignment flexibility
  • Target Industries: Display module assembly, automotive electronics, industrial HMIs, medical monitors

🔎 SEO Keywords (for Global Search Visibility)

15.6 inch COF pre-bonding machine, OL-COF156 Olian, single-side COF tacking system, LCD panel pre-bonder for COF and IC, semi-automatic FOG pre-compression machine, thermal alignment system for display driver chips, multi-zone COF pre-bond equipment, 400°C hot bar pre-bonder for LCD, COF temporary bonding machine with vacuum platform, display module pre-bond workstation for automotive and industrial panels.

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