7-17 Inch Semi Automatic Bonding Machines Production Line Solution

7-17 Inch Semi Automatic Bonding Machines Production Line Solution

7-17 Inch Semi Automatic Bonding Machines Production Line Solution

In the competitive landscape of display manufacturing, the production of mid-size Liquid Crystal Modules (LCMs) for applications such as tablets, notebooks, and automotive displays requires a specialized and semi-automated bonding solution. Our 7-17 Inch Semi Automatic Bonding Machines Production Line Solution is designed to meet the demands of producing LCMs ranging from 7” to 17.3”, offering a comprehensive and integrated approach to ensure high efficiency, precision, and adaptability.

Key Features of the Solution

1. Plasma Cleaning (EC)
   • High-Purity Cleaning: The process begins with plasma cleaning to remove any contaminants from the substrates. This step is crucial for ensuring a high-quality bond and reducing defects.
2. ACF (Anisotropic Conductive Film) Attaching
   • Precision Application: ACF is applied to the substrates with high precision, ensuring a reliable electrical connection between the components.
3. COG/COF/COP Pre-Bonding
   • Pre-Bonding Process: The pre-bonding machine automatically peels and cuts 1 or 2 layers of ACF tape and attaches it to the LCD, PCB, FPC, or TAB. This step ensures proper alignment and adhesion before the main bonding process.
4. COG/COF/COP Main Bonding
   • Main Bonding Process: The main bonding machine performs the final bonding of ICs, cables, or COF pre-pressed on the LCD glass. This process is critical for ensuring the stability and performance of the display modules.
5. FOG/FOP/FOF/FOB Bonding
   • FPC Bonding: The FOG/FOP/FOF/FOB bonding machine bonds flexible printed circuits (FPCs) to the glass or flexible substrates. This step is essential for connecting the display module to the mainboard and other components.

Applications

Our 7-17 Inch Semi Automatic Bonding Machines Production Line Solution is ideal for a wide range of display products, including:

• Notebooks: High-resolution displays for laptops and notebooks.
• Tablets: For use in consumer electronics and professional applications.
• Automotive Displays: Center console and dashboard displays for vehicles.

Key Specifications

• Product Size Range: 7” to 17.3”
• Main Precision:
  • ACF Attachment: X/±0.15mm, Y/±0.1mm
  • COG: X/Y ±5μm
  • FOG: X/Y ±15μm
• Tact Time:
  • 7” to 17.3” Displays: Whole line TT ≤ 6s
• Uptime: ≥98%

Optional Features

• Flexible Configuration: The entire line can be configured according to customer process requirements.
• Customized Solutions: Other sizes can be customized to meet specific needs.
• AOI, CIM, and Dispensing Valve: The line is equipped with optional features such as AOI inspection, CIM (Computer Integrated Manufacturing), and precision dispensing valves.

Conclusion

Our 7-17 Inch Semi Automatic Bonding Machines Production Line Solution is designed to meet the future demands of the display industry, offering a versatile, high-precision, and efficient production process. By integrating multiple advanced technologies and ensuring high-quality standards, our solution is ideal for manufacturers looking to produce a wide range of advanced display modules. Choose our solution to stay ahead in the competitive market and deliver top-quality products.