Engineered for Precision, Scalability, and High-Throughput Display Manufacturing
This is automated solution for mid-size display module assembly (7″–17″), focusing on EC (End-to-end Cleaning), COG (Chip-on-Glass), and FOG (Film-on-Glass) processes. Designed for rigid panel substrates, this production line integrates advanced robotics, vision systems, and precision bonding technologies to achieve sub-micron accuracy and high-efficiency throughput.
1. Production Line Overview
Core Capabilities
Size Range: Supports 7″ to 17″ displays (16:9 aspect ratio) with substrate thicknesses from 0.2mm to 1.1mm.
Multi-Component Handling: Accommodates up to 6 ICs per side and 4 FPCs per side (expandable to 8 with optional configurations).
Throughput: Achieves 12 seconds per unit for a configuration with 4 ICs and 2 FPCs.
Throughput: 9 seconds per cycle (for 12″ substrates at 80mm/s wiping speed).
Plasma Specifications:
Power: 300W
Frequency: 18kHz–60kHz
Temperature: 90°C–100°C
Dimensions: 1970mm (L) × 1250mm (W) × 2000mm (H).
2.2 COG Bonding Stations (CB1100 & CB1162)
Function: Full-process IC-to-glass bonding with ACF application, pre-press, and main press.
IC Handling: Supports ICs from 5.0×0.8mm to 35×4mm, with dual-IC type compatibility.
Vision Alignment: Beijing Boshii system ensures ±5μm total bonding accuracy.
Bonding Heads:
ACF head: SUS 440C, 4.0×60mm
Pre-press head: SUS 440C, 3×30mm (servo + pneumatic)
Main press heads: Ceramic/tungsten steel, 5.0×40mm (dual servo-pneumatic groups)
Throughput: 125 seconds for 2+2 IC configuration on 12″ substrates.
Dimensions: 6700mm (L) × 1650mm (W) × 2000mm (H).
2.3 FOG Bonding Station (FB1142)
Function: FPC-to-glass bonding with integrated ACF application and thermal compression.
FPC Support: Handles FPCs up to 35×4mm (length ≤100mm).
Precision: ±15μm total bonding accuracy with vision-guided alignment.
Bonding Heads:
ACF head: SUS 440C, 4.0×40mm
Pre-press head: SUS 440C, 3×60mm (servo + pneumatic)
Main press heads: SUS 440C (dual servo-pneumatic groups)
Throughput: 12 seconds per unit (for 2 FPCs on 12″ substrates).
Dimensions: 4000mm (L) × 1465mm (W) × 2000mm (H).
3. Technical Advantages
3.1 Automation & Integration
Robotic Handling: Linear motor-driven robotic arms for substrate transfer between stations.
Modular Design: Stations support standalone operation or inline integration.
Scalability: Optional LCD/FPC loaders for fully automated material handling.
3.2 Precision Engineering
Thermocompression Control: Dual servo-pneumatic systems ensure consistent pressure (0.2–0.8MPa) and temperature (350°C–450°C).
Vision Systems: Real-time CCD correction compensates for substrate warpage or misalignment.
3.3 Process Reliability
ACF Quality Control: Inline vision inspection verifies film placement before bonding.
Plasma Activation: PT300 plasma units enhance adhesion with water contact angles of 20°–30°.
4. Applications & Industry Impact
This solution targets high-volume manufacturing of:
Automotive Displays: Ensures reliability under 85°C/85% RH conditions.
Consumer Electronics: Enables ultra-narrow bezels with <0.1mm pitch bonding.
Industrial Panels: Supports ruggedized designs with multi-IC redundancy.
By integrating cleaning, COG, and FOG processes into a single line, manufacturers reduce handling errors, minimize footprint, and achieve 20% faster time-to-market.
5. Future-Proof Design
The production line accommodates emerging trends:
AI Integration: Vision systems support machine learning for defect prediction.
Scalable I/O: Modular stations allow addition of AOI (Automated Optical Inspection) or curing modules.
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