2025 - 第7页共19页 - ACF COF COG COP FOG FOP FOF FOB FOF TFOG TFOF OLB TAB bonder/bonding machines manufacturer

Semi-Automatic 12-Inch ACF Laminating Machine OL-A003

OL-A003 Semi-Automatic 12-Inch ACF Laminating Machine – Precision Thermal Bonding for LCD, FPC, and Display Module Assembly。

The OL-A003 semi-automatic ACF laminating machine by Olian Automation is a compact, high-accuracy bonding system engineered for reliable application of anisotropic conductive film (ACF) onto LCD panels, flexible printed circuits (FPCs), and printed circuit boards (PCBs). Designed for R&D labs, pilot production lines, and small-to-medium batch manufacturing, this manual ACF bonding machine supports panel sizes from 1 inch up to 12 inches, making it ideal for applications in consumer electronics, automotive displays, medical devices, and industrial HMIs.

Unlike fully automated systems that require complex integration, the OL-A003 desktop ACF bonder strikes the perfect balance between operator control and process automation. Users manually load and unload the panel, while the machine automatically handles ACF feeding, thermal compression bonding, carrier film peeling, and precision cutting—ensuring consistent results with minimal training.

Key Features & Capabilities

High Bonding Accuracy: Achieves ±0.2 mm alignment precision in both X and Y axes.
with ACF feed and cut accuracy of ±0.1 mm—critical for fine-pitch COG and FOG processes.
Intuitive Touchscreen Interface: Operators can easily set and monitor key parameters. including bonding temperature, press time, ACF length, and peel speed via a user-friendly HMI.
Comprehensive Safety Design: Equipped with dual-hand start buttons to prevent accidental activation and an emergency stop switch for immediate shutdown. All motion sequences are interlocked to ensure safe operation.
Rapid Product Changeover: Universal fixtures made from anti-static, scratch-resistant materials allow quick adaptation to different panel types. Typical changeover time is just 20 minutes.
Smart Diagnostics & Alarms: In the event of errors—such as incomplete actuator movement, platform misalignment. or temperature deviation—the system triggers a visual and audible alarm and displays clear troubleshooting guidance on-screen.
ESD-Safe Operation: Includes a dedicated anti-static grounding terminal (separate from power ground) to protect electrostatic-sensitive components during handling.

Robust Industrial Construction

The OL-A003 is built with reliability in mind. It features:

Panasonic PLC for stable logic control
SMC, CKD, or Airtac pneumatic components (valves, cylinders, pressure regulators)
Taiwan-made motors for smooth motion control
IDEC push-button switches for durability and safety compliance
Full wire and tubing labeling per industrial standards for easy maintenance

Ideal Applications

This semi-auto ACF laminator is widely used in:

LCD module assembly (including TFT-LCD and OLED)
FPC-to-glass bonding for touch panels and sensors
COG (Chip-on-Glass) and FOG (Film-on-Glass) pre-bonding preparation
Display repair and rework centers
University labs and prototyping facilities

Why Choose the OL-A003?

For engineers and procurement teams searching for a cost-effective 12-inch ACF bonding machine, a benchtop ACF laminating system, or a manual ACF bonder with high positional accuracy, the OL-A003 delivers exceptional value. It eliminates the complexity and cost of full automation while maintaining the precision required for modern micro-electronics assembly.

Backed by Olian Automatic—a certified national high-tech enterprise specializing in LCM automation solutions—the OL-A003 combines proven engineering, robust component selection, and user-centric design into one dependable platform.

Model: OL-A003
Type: Semi-Automatic ACF Laminating Machine
Panel Size Range: 1″ to 12″
Bonding Accuracy: ±0.2 mm (X/Y)
Operation Mode: Manual loading/unloading, automatic bonding cycle
Target Industries: Display manufacturing, electronics assembly, R&D, repair

SEO Keywords Integrated:
ACF laminating machine, ACF bonding machine, manual ACF bonder, semi-automatic ACF laminator, 12-inch ACF bonding equipment, LCD ACF bonding machine, FPC to LCD laminator, anisotropic conductive film bonder, desktop ACF bonding system, benchtop ACF laminator, COG pre-bonding machine, FOG bonding equipment, Olian OL-A003, thermal compression ACF machine, small panel ACF applicator, high-precision ACF bonder, ESD-safe ACF laminator.

Green-Light Nanosecond Glass Laser Drilling Machine

Green-Light Nanosecond Glass Laser Drilling Machine,

Process Application

Drilling, slotting, film removal and frosting of all hard-brittle sheets
Ordinary glass, optical glass, quartz, sapphire, strengthened glass, optical filters, mirrors
Shaped holes and inner cut-outs produced in a single pass

Green-Light Nanosecond Glass Laser Drilling Machine Main Parameters

Laser type: Green-light nanosecond
Model: OL-GND-6090
Platform size: 600 mm × 900 mm (customisable)
Max. thickness: 20 mm
Drilling speed: 0 – 5 000 mm/s
Edge chipping: < 0.1 mm

Processing Advantages

Table size tailored to product, small-footprint or large-panel versions available
Any outline drilled in one step, no template or mask
Smooth, flat hole walls, breakout below 0.1 mm
Instant product change-over through software; operator simply loads new file
Dry process: no consumables, coolant or abrasive, zero surface scratches
Low running cost, high yield, no waste liquids or sludge

Infrared Nanosecond Glass Laser Drilling Machine

Infrared Nanosecond Glass Laser Drilling Machine

Process Application

Drilling, slotting, de-coating and frosting of brittle sheet materials,
Shower-door holes and cut-outs,
Appliance glass ventilation slots,
Solar-panel via holes,
Switch-cover openings,
Mirror de-coating plus drilling,
Shallow pockets or frost zones for hinges or sensors,

Main Parameters

Laser type: Infrared nanosecond
Model: OL-IND-5070/OL-IND-120200
Platform sizes: 500 mm × 700 mm / 1200 mm × 2000 mm (customisable)
Max. glass thickness: 20 mm
Drilling speed: 0 – 5 000 mm s⁻¹
Edge chipping: < 0.5 mm

Processing Advantages

Large table accepts any industry part size
Single-pass drilling, no template needed
Smooth hole walls, minimal breakout
Dry process—no abrasive, coolant or consumables
Zero surface scratching
Instant product change-over via software
Low running cost, high yield

Infrared Picosecond Dual-Platform Glass Laser Cutting Machine

Process Application

Cuts all hard-brittle sheet materials: ordinary glass, optical glass, quartz, sapphire, reinforced glass, optical filters, mirrors, etc. The same system also produces internal cut-outs and holes to specified dimensions.

Main Specifications

Laser type: Infrared picosecond
Model: OL-IPC70120-D/OL-IPC90140-D
Standard platform sizes: 700 mm × 1 200 mm and 900 mm × 1 400 mm (custom sizes on request)
Thickness range: 0.03 – 8 mm
Maximum cutting speed: 1 000 mm/s
Edge chipping: ≤ 10 µm

Processing Advantages

Dual-platform layout integrates cutting and cleaving in one compact footprint
High-speed shaping of irregular outlines shortens process transfer time
Cut edges are straight (no taper), micro-chipping is below 10 µm and edges are safe to touch
Instant change-over between different product sizes through simple software settings; operator training is minimal
Low running cost: no consumables, no waste liquids, slurry or sludge, no surface scratching, high yield

Single-Platform Laser Processing Equipment

Process Application：

Engineered for cutting and drilling every kind of brittle, hard sheet: common glass, optical glass, quartz, sapphire, strengthened glass, optical filters, ceramics, etc.

Single-Platform Laser Processing Equipment Main Specifications：

Cutting Configuration – Infrared Picosecond
Model series: OL-IPC4050-S，

Table size: 400 mm × 500 mm (custom sizes available).
Thickness range: 0.03 – 8 mm.
Cutting speed: 0 – 1 000 mm/s.
Edge chipping: ≤ 10 µm.

Drilling Configuration – Green Nanosecond.
Model series: OL-GND4050-S.
Table size: 400 mm × 500 mm (custom sizes available).
Thickness range: 0.03 – 2 mm.
Drilling speed: 0 – 5 000 mm/s.
Edge chipping: ≤ 100 µm.

Processing Advantages
The machine merges modular architecture with high-density integration, re-engineers the conventional optical path and support structure, and enables on-the-fly switching between cutting and drilling on the same platform. An adaptive process controller guarantees micron-level precision across multiple materials.

Single-Platform Green Picosecond Laser Glass Cutting Machine

Single-Platform Green Picosecond Laser Glass Cutting Machine
Model: OL-GP4050S

R&D Background：

Consumer demand for pristine mobile screens, camera cover glass and other brittle components forces suppliers to achieve higher cutting strength, minimal chipping, excellent edge verticality, high throughput and low cost. Traditional CNC machining consumes cutting fluids, delivers limited accuracy, suffers rapid tool wear and demands large floorspace and labour. The OL-GP4050S was therefore developed to give optical workshops a cleaner, faster and more economical alternative.

Equipment Overview：

Product name: OL-GP4050S single-platform green picosecond laser glass cutting machine.
The system performs dry, dust-free laser ablation of flat glass at several times the speed of conventional methods. A high-precision XY linear motor stage and granite base secure micron-level accuracy and long-term stability.
Effective processing area: 300 mm × 300 mm.
Single-pass cutting depth for K9 glass: up to 3 mm.

Power supply: AC 220 V ± 5 %, single-phase with earth, total load < 4 kW.
Ambient temperature: 24 – 26 °C.
Relative humidity: 10 – 70 %, non-condensing, clean room recommended.
Overall dimensions: length 1 400 mm, width 1 050 mm, height 1 950 mm (without beacon).
Approximate weight: 1 000 kg.
Floor loading: at least 500 kg m⁻².

Applications ：

include optical glass, coated glass, soda-lime glass, sapphire and quartz. High-temperature cleaving is not advised for heat-sensitive coatings.

Technical Specifications：

Processing principle: a 532 nm green picosecond beam creates equally spaced filamentary holes inside the material. A linear motor moves the workpiece so the filaments form a controlled micro-crack line, enabling clean separation. Pulse width < 10 ps confines energy to a tiny volume, so the process is virtually athermal and produces no melt or large HAZ.

Laser source: 50 W green picosecond laser, 50 kHz, 1 mJ pulse energy, water-cooled.
Cutting head: 3 mm depth-of-focus Bessel type for long filament and small spot.
Motion platform: X-Y-Z stages. X and Y driven by linear motors on granite; travel 300 mm × 300 mm; maximum speed 1 000 mm s⁻¹ with 1 g acceleration; positioning accuracy ≤ ±2 µm, repeatability ≤ ±1 µm. Z axis servo-driven, 50 mm travel, focus step resolution 10 µm.

Vision system: 5 MP MindVision CCD, point plus ring illuminator, automatic Mark capture, alignment accuracy ≤ ±3 µm.

Control software: proprietary Windows-based package reads DXF and DWG files; integrates high-precision motion card with PSO (position-synchronized output) for on-the-fly laser triggering. Industrial PC with Taiwan-imported motherboard, LCD monitor, wireless keyboard and mouse.

Hardware: Grade 00 granite base, vacuum chuck for workpiece fixation. Low-voltage elements by Schneider, switch-mode power supplies by Mean Well.

Operation & Maintenance：

Use the machine only on transparent brittle materials. Do not process metals or temperature-sensitive coated products. Install the unit in a clean, well-ventilated room free of corrosive or acidic vapours.

Daily: remove dust and processing debris.
Weekly: inspect and clean protective lenses.
Monthly: replace chilled-water coolant (distilled or de-ionised water only).
Quarterly: replace coolant filter cartridge.

Sample Results：

Photographs in the original file show typical cuts on strengthened glass, sapphire wafers and quartz substrates: edges are smooth, chips < 5 µm, no micro-cracks or discoloration.

ACF bonding Keywords Explanation

ACF bonding Keywords Categorization and Explanation:

1. Bonding Machines

FOB Bonder: A machine used for bonding FOB (Flexible On Board) components.

COG Bonder: Used for bonding COG (Chip On Glass) components.

COF Bonder: Used for bonding COF (Chip On Film) components.

COP Bonder: Used for bonding COP (Chip On Plastic) components.

FOG Bonder: Used for bonding FOG (Flexible On Glass) components.

FOF Bonder: Used for bonding FOF (Flexible On Flexible) components.

FPC Bonder: Used for bonding FPC (Flexible Printed Circuit) components.

TAB Bonder: Used for bonding TAB (Tape Automated Bonding) components.

OLB Bonder: Used for bonding OLB (Outer Lead Bonding) components.

IC Bonder: Used for bonding IC (Integrated Circuit) components.

Glass Bonder: Used for bonding glass components.

LCD Panel Bonder: Used for bonding LCD (Liquid Crystal Display) panels.

LED Panel Bonder: Used for bonding LED (Light Emitting Diode) panels.

Mini LED Bonder: Used for bonding mini LED components.

Micro LED Bonder: Used for bonding micro LED components.

Zebra Paper Bonder: Used for bonding zebra paper components.

Touch Panel FPC Bonder: Used for bonding FPC components in touch panels.

Mobilephone Bonding Machine: Used for bonding components in mobile phones.

Smart Watch LCD Bonder: Used for bonding LCD components in smart watches.

Wearable Equipment Bonder: Used for bonding components in wearable devices.

TV Panel Bonder: Used for bonding components in TV panels.

LCD Module Bonder: Used for bonding LCD modules.

Flat Panel Display Bonder: Used for bonding flat panel displays.

2. Bonding Processes and Materials

ACF (Anisotropic Conductive Film): A film used in bonding processes to connect different layers.

COG (Chip On Glass): A process where chips are directly mounted on glass substrates.

COF (Chip On Film): A process where chips are mounted on flexible substrates.

COP (Chip On Plastic): A process where chips are mounted on plastic substrates.

FOG (Flexible On Glass): A process where flexible circuits are mounted on glass substrates.

FOB (Flexible On Board): A process where flexible circuits are mounted on boards.

FOF (Flexible On Flexible): A process where flexible circuits are mounted on other flexible circuits.

TAB (Tape Automated Bonding): A process where tape is used to bond components.

OLB (Outer Lead Bonding): A process where the outer leads of components are bonded.

IC (Integrated Circuit): A small chip that contains a complex electronic circuit.

FPC (Flexible Printed Circuit): A flexible circuit board used in various electronic devices.

Zebra Paper: A type of conductive paper used in bonding processes.

3. Repair and Maintenance Equipment

LCD Repair Machine: Used for repairing LCD screens.

LED Repair Machine: Used for repairing LED screens.

OLED Repair Machine: Used for repairing OLED screens.

Amoled Repair Machine: Used for repairing Amoled screens.

Mini LED Repair Machine: Used for repairing mini LED screens.

Micro LED Repair Machine: Used for repairing micro LED screens.

TFT Glass Repair Machine: Used for repairing TFT (Thin Film Transistor) glass screens.

LCD Panel Repair Machine: Used for repairing LCD panels.

LED Panel Repair Machine: Used for repairing LED panels.

OLED Panel Repair Machine: Used for repairing OLED panels.

Amoled Panel Repair Machine: Used for repairing Amoled panels.

Flex Cable Repair Machine: Used for repairing flex cables.

IC Remover: A tool used to remove ICs from circuits.

IC Remove Machine: A machine used to remove ICs from circuits.

Differential Interference Microscope: A microscope used to inspect bonding processes.

Metallurgical Microscope: A microscope used to inspect metal surfaces.

Industrial Tool Microscope: A microscope used for industrial inspections.

Large Size Upright Microscope: A large microscope used for detailed inspections.

Second Hand Differential Interference Microscope: A used microscope for inspecting bonding processes.

4. Specific Applications and Solutions

Whole Line Solution for Intelligent Wearable Products: A comprehensive solution for producing intelligent wearable products.

Whole Line Solution for Intelligent Watches: A comprehensive solution for producing intelligent watches.

Mobile Product Line Solutions: Solutions for producing mobile products.

PAD Display Product Line Solutions: Solutions for producing PAD displays.

Tablet Product Line Solutions: Solutions for producing tablet displays.

Notebook Product Line Solutions: Solutions for producing notebook displays.

Industrial Control Display Product Line Solutions: Solutions for producing industrial control displays.

High-Level Flexible Screen Glue Field Production Solutions: Solutions for producing high-level flexible screens.

Intelligent Locomotive, Notebook Product Line Solutions: Solutions for producing intelligent locomotives and notebooks.

Display Product Line Solution: A comprehensive solution for producing displays.

Commercial Display Screen – Flexible Bonding Production Line Solution: A solution for producing commercial display screens.

Electronic Paper Line Solutions: Solutions for producing electronic paper.

Electronic Paper Laminating, Bonding, Dispensing Field Line Solutions: Solutions for producing electronic paper laminating, bonding, and dispensing.

Backlight Leading, Laminated Film, Shading, Wrapping Line Equipment Solutions: Solutions for producing backlight leading, laminated film, shading, and wrapping.

Fingerprint Module Under the Screen Bond Spot Glue and AOI Intelligent Detection Field Solutions: Solutions for producing fingerprint modules under the screen.

Automatic OCA, OCR Fit Field Production Solutions: Solutions for producing automatic OCA (Optically Clear Adhesive) and OCR (Optical Character Recognition) fits.

FPC Covering Film, EMI Automatic Laminating, FPC Exposure Special Equipment Field Solutions: Solutions for producing FPC covering film, EMI (Electromagnetic Interference) automatic laminating, and FPC exposure.

3C Product Inspection Packaging Production Line Solution: Solutions for producing 3C product inspection and packaging.

5. Accessories and Parts

Bonding Machine Head: A part of the bonding machine used for bonding.

Bonding Machine Press Head: A part of the bonding machine used for pressing.

Bonding Machine Spare Parts: Various spare parts for bonding machines.

Bonding Machine Parts: Various parts for bonding machines.

ACF Tape: A tape used in bonding processes.

ACF Bonding Tape: A tape used in bonding processes.

ACF Glue: A glue used in bonding processes.

ACF Adhesive: An adhesive used in bonding processes.

ACF Bonding Machine Head: A part of the ACF bonding machine.

ACF Bonding Machine Price: The cost of an ACF bonding machine.

ACF Bonding Machine Manufacturer: A company that manufactures ACF bonding machines.

ACF Bonding Machine Manual: A manual for operating an ACF bonding machine.

ACF Bonding Machine PDF: A PDF document related to ACF bonding machines.

ACF Bonding Machine Spare Parts: Spare parts for ACF bonding machines.

ACF Bonding Machine Working: The working principle of an ACF bonding machine.

ACF Bonding Machine Cost: The cost of an ACF bonding machine.

Accessoire ACF Bonding Machine: Accessories for ACF bonding machines.

Low Cost ACF Bonding Machine: An affordable ACF bonding machine.

ACF Bonding Machine Demon for Replacing IC: A demonstration of using an ACF bonding machine for replacing ICs.

ACF Pulse Heat Bonding Machine: A machine that uses pulse heat for bonding.

How to Make ACF Bonding Machine: Instructions for making an ACF bonding machine.

Homemade ACF Bonding Machine: A self-made ACF bonding machine.

ACF Bonding Machine eBay: ACF bonding machines available on eBay.

ACF Bonding Machine for Mobile: An ACF bonding machine for mobile devices.

ACF Bonding Machine Head Price: The cost of an ACF bonding machine head.

ACF Bonding Machine Manual: A manual for operating an ACF bonding machine.

ACF Bonding Machine New: A new ACF bonding machine.

ACF Bonding Machine Homemade: A self-made ACF bonding machine.