What is ACF?
ACF Tape/ACF Film & Applications
ACF Tape is normally made up of two main components, namely Adhesive & conductive particles.
Adhesives
The adhesive composition is dependent on the materials being assembled. This means an ACF designed for use in a flex-on-glass (FOG) assembly is usually not suitable for use in a chip-on-glass (COG),chip-on-film(COF), flex-on-board(FOB),flex-on-flex(FOF) or any other configurations. It is specific to the application for which it is designed for.
ACF Conductive Particles
Conductive particles are used to conduct electricity from one side of the bond to the other. Depending on the application, conductive particles range from 3.5μm to 30μm in size, and can be made from Nickel-gold plated polymer spheres, gold plated nickel particles, or lead-free solder materials. Particles may be individually coated with a outer polymer to insulate them from other uncrushed particles, but which will crack open and allow electrical conduction if the particle is trapped and crushed between two pads during assembly.
ACF tape
ACF Anisotropic Conductive Film
ACF (Anisotropic conductive film) or ACF tape is an epoxy adhesive system used by electronics industry to make electrical and mechanical connections from drive electronics to substrates.
ACF are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).
The conductive particles are distributed far apart thus not electrically conductive in the plane direction (X&Y) of the film.
ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.
ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.
ACF special conductive particle is made from environmental friendly material (ROHs compliance). It provides good metalic bonding.
