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Tag Archive manual thermocompression bonder

OL-OLB120-T Single-Side Multi-Section OLB Bonder

OL-OLB120-T Single-Side Multi-Section OLB Bonder

OL-OLB120-T Single-Side Multi-Section OLB Bonder

High-Efficiency Semi-Automatic Heat Press for Large-Format Displays


Engineered by Olian Automaic

  • Developed by Olian Automaic, a Shenzhen-based leader in automation equipment.
  • Designed for semi-automatic thermocompression bonding of chip-on-film (COF) to LCD panels with pre-attached anisotropic conductive film (ACF).
  • Supports display sizes from 25 inches (550×320 mm) to 120 inches (2700×1500 mm) with material thicknesses of 0.1–1 mm.

Core Functionality

  • Manual Loading/Alignment: Operators place LCD panels and COF manually, aligning via Mark points using a dual-camera imaging system.
  • Automated Bonding: The system executes precision thermocompression after alignment.
  • Single-Side Multi-Section Design: Allows sequential bonding of up to 10 COF units per LCD panel on one side.

Key Specifications

  • Platform Size: 2700 mm (W) × 1500 mm (D).
  • Display Compatibility:
    • Max: 120″ (2700×1500 mm).
    • Min: 25″ (550×320 mm).
    • Thickness: 0.1–1 mm.
  • COF Dimensions: 12–60 mm (L×W); Thickness: 0.1–1 mm.
  • Production Capacity: 70–120 COF units/hour (excluding manual alignment time).
  • Bonding Time: ≤10 seconds per unit.

Technical Features

  1. Precision Bonding System:
    • Main Press Head:
      • Material: Tungsten steel.
      • Surface Flatness: ±5 μm/100 mm.
      • Temperature Range: RT–400°C (constant-temperature heating).
      • Pressure Control: 35–400 N (±5 N precision).
    • Backup Plate: Quartz strip (standard: 120×7×20 mm; customizable).
  2. Adjustable Platforms:
    • LCD Platform:
      • X/Y-axis driven by servo motors + linear guides.
      • Z-axis adjustment: ±3 mm via servo motor.
      • Vacuum fixation (1 mm holes, 1.5 mm grooves).
    • COF Platform:
      • Manual X/Y/Q/Z-axis adjustment (±5 mm for X/Y/Q; ±2 mm for Z).
      • Hard-anodized aluminum material.
  3. Imaging System:
    • 2× 300K-pixel CCD cameras with coaxial LED lighting.
    • Field of View: 3.2×2.4 mm.
    • Lens Spacing: 5–90 mm (adjustable).

Performance Metrics

  • Alignment Accuracy: ±55 μm (X/Y-axis; excludes human/material errors).
    • Minimum Pitch Support: ≥80 μm.
  • Platform Repeatability: ≤0.01 mm.
  • Model Changeover Time: ≤60 minutes (new product); ≤30 minutes (existing product).

Operational Environment

  • Power Supply: Single-phase AC 220V, 50/60 Hz, 3500W.
  • Air Supply: 0.5–0.7 MPa, 480 L/min (φ8 mm tubing).
  • Vacuum: Self-generated; ≥-60 kPa.
  • Conditions: Cleanroom (22–27°C, 40–70% humidity).

After-Sales Support

  • Warranty: 1 year (excludes wear parts and human-induced damage).
  • Training: 1-day on-site program covering operation, calibration, and troubleshooting.
  • Service: 72-hour on-site response for warranty-period issues.

Target Applications

Ideal for manufacturers of ultra-large LCD/OLED panels, including:

  • Television displays (85–120 inches).
  • Digital signage and industrial monitors.
  • Automotive infotainment systems.

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OL-FP85T Dual-Station Manual Pulse Bonder

OL-FP85T Dual-Station Manual Pulse Bonder

OL-FP85T Dual-Station Manual Pulse Bonder

High-Precision FOG and Flip-Chip Bonding Solution for 85-Inch Displays


Engineered by Olian Automaic

  • The OL-FP85T Dual-Station Manual Pulse Bonder is developed by Olian Automaic.
  • It is designed for flexible printed circuits (FPC), chip-on-film (COF), and film-on-glass (FOG) applications.
  • Supports display sizes from 10 inches (200×110 mm) to 85 inches (1890×1060 mm).
  • Compatible with material thicknesses between 0.1 mm and 1 mm.

Dual Independent Workstations for Enhanced Productivity

  • Left station dedicated to outer lead bonding (OLB).
  • Right station dedicated to film-on-board (FOB).
  • Each station operates independently to improve workflow efficiency.
  • Operators manually position glass/film and align FPCs/PCBs using Mark points.
  • System automatically executes thermocompression bonding after alignment.

Advanced Imaging for Precision Alignment

  • Equipped with dual imaging systems.
  • OLB station features coaxial LED lighting.
  • PCB station uses spot LED lighting.
  • Both stations use 300K-pixel CCD cameras.
  • Field of view: 1.9×1.4 mm for accurate alignment.

Superior Temperature and Pressure Control

  • Temperature range: room temperature to 450°C.
  • Pulse heating technology ensures consistent thermal performance.
  • Surface temperature uniformity: ±8°C.
  • Pressure control range: 25 N to 400 N.
  • Pressure accuracy: ±5 N for reliable and repeatable bonds.

High Accuracy and Yield Performance

  • Positional accuracy: ±0.050 mm (X-axis), ±0.055 mm (Y-axis).
  • Product pass rate: ≥98% (excluding human or material factors).
  • Failure rate: ≤2% under normal operating conditions.

Adjustable Platforms and Durable Design

  • Glass platform with ±2 mm Z-axis adjustment via micrometer.
  • Aluminum platform with ±2 mm lifting stage adjustment.
  • Vacuum fixation using 1 mm holes and 1.5 mm grooves.
  • Titanium alloy hot press head ensures durability.
  • Surface flatness: ≤3 μm.
  • Parallelism adjustable via precision screws.

Flexible Production and Secure Access

  • Model changeover time: ~20 minutes.
  • Dual access levels: operator mode (no password) and engineer mode (password-protected).
  • Ensures secure parameter management and reduces operational errors.

Optimized for Cleanroom Environments

  • Designed for cleanroom use.
  • Operating temperature: 22–27°C.
  • Humidity range: 40–70%.
  • Power supply: single-phase AC 220V, 50/60 Hz, 1500W.
  • Air supply: 0.4–0.7 MPa, 250 L/min (transparent 8 mm tubing).
  • Vacuum: 36 L/min (yellow tubing).
  • Standardized tubing for easy maintenance and integration.

Comprehensive After-Sales Support

  • One-year warranty (excludes wear parts and human-induced damage).
  • On-site training provided.
  • 72-hour on-site response for warranty-period issues.
  • Minimizes production downtime and ensures continuous operation.

Target Applications

  • Ideal for large LCD and OLED panel assembly.
  • Suitable for television displays, industrial control screens, digital signage, and automotive infotainment systems.
  • Manual operation with automated bonding precision.
  • Fits well in prototyping and medium-volume production environments.

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