COP bonder归档 - ACF COF COG COP FOG FOP FOF FOB FOF TFOG TFOF OLB TAB bonder/bonding machines manufacturer

OL-CBY156 – 15.6-Inch Dual-Head IC Servo Main Bonding Machine

High-Efficiency Thermal Compression System for IC Bonding on 7-17.3inch LCD Panels

The OL-CBY156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-head main bonding machine engineered for the final thermal compression of bare driver IC chips onto ACF-pre-laminated edge terminals of large-format rigid LCD panels up to 15.6 inches. Featuring two independent servo-controlled bonding heads, this system enables either simultaneous bonding of two ICs or sequential multi-zone processing along a single panel edge—significantly boosting throughput while maintaining high bond consistency.

As the critical final step in the COG (Chip-on-Glass) process, the OL-CBY156 fully cures the anisotropic conductive film (ACF), creating permanent, low-resistance electrical interconnects essential for display reliability in automotive, industrial, and consumer applications.

⚠️ Note: This machine assumes that ACF has already been applied and ICs have been pre-aligned (e.g., via a pre-bonder). It does not include ACF application, vision alignment, or double-side bonding capability.

🔧 Key Technical Specifications

Substrate & Component Compatibility

Panel Size:
- Max: 350 mm × 250 mm (~15.6″ diagonal)
- Min: 150 mm × 80 mm (~7″)
- Thickness: 0.2 – 2.2 mm
IC Dimensions:
- Length: 5 – 40 mm
- Width: 0.5 – 3 mm
- Thickness: 0.08 – 0.5 mm
Bonding Configuration:
- Single-side only
- Supports up to 10 bonding segments per edge
- Dual-head operation: Parallel or sequential bonding

Bonding Performance

Heating System:
- Heater Type: Cartridge-style Φ9.5 mm × 70 mm heating rods (per head)
- Temperature Range: Room temperature to 400°C
- Surface Uniformity: ≤ ±3°C across each press head
Pressure Control:
- Servo-driven actuators (independent for each head)
- Adjustable Force: 20 N to 120 N
- Repeatability: ≤ ±3 N
Bonding Time: 0.1 – 99.9 seconds (programmable per head)

Control & Operation

Control Unit:
- PLC-based logic controller
- Color touchscreen HMI (Chinese interface) for parameter setup and monitoring
- Real-time display of temperature, time, pressure, and system status
Operating Modes:
- Manual Mode: Full operator control over each head
- Auto Mode: One-button cycle with coordinated dual-head action
Physical Controls:
- Start Button (Φ24 mm)
- Vacuum Button (Φ24 mm)
- Emergency Stop (Φ22 mm, red mushroom type)
- Main Power Switch

Process Workflow

Operator loads ACF-pre-laminated LCD panel onto vacuum platform.
Vacuum secures panel flatness during bonding.
Pre-placed ICs are positioned at designated bonding zones.
Operator initiates cycle:
- Both heads descend simultaneously (or in sequence)
- Apply precise heat and servo-controlled force for preset duration
Upon completion, heads retract automatically.
Operator unloads the fully bonded panel.

This dual-head architecture reduces cycle time by up to 40–50% compared to single-head machines in multi-IC applications (e.g., dual-driver displays).

📏 Machine Physical Data

Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
Weight: ~780 kg
Work Height: Platform at 890 ± 30 mm from floor—ergonomic for standing operation
Operating Environment:
- Cleanroom required (ISO Class 8 or better)
- Temperature: 22–27°C
- Humidity: 40–70% RH

🛡️ Quality Assurance & Support

Documentation: Includes 1 Chinese-language operation manual
Training: 1-day on-site session covering:
- Machine installation, leveling, and calibration
- Dual-head synchronization and parameter tuning
- Troubleshooting (e.g., pressure imbalance, heater faults)
- Replacement of wear parts (heaters, thermocouples, buttons)
Warranty: 12 months on mechanical and electrical systems under normal use
- Exclusions: Consumables, damage from misuse, or force majeure
After-Sales Service:
- Lifetime technical support via phone/email
- On-site engineer dispatch within 72 hours if remote resolution fails during warranty

✅ Included Standard Components

Two custom IC bonding heads (tooling per customer drawing)
Φ9.5 × 70 mm cartridge heaters (×2)
K-type thermocouples for closed-loop temperature control (×2)
Φ24 mm start and vacuum buttons
Φ22 mm emergency stop switch
National-standard (GB) maintenance toolkit

🔖 Model Summary

Model: OL-CBY156
Function: Single-station, dual-head IC main bonder for COG process
Panel Size: Up to 15.6 inches
Core Advantage: Higher throughput via dual servo heads with ±3 N repeatability
Target Applications:
- Automotive center-stack displays
- Industrial HMIs with redundant drivers
- Medical monitors requiring dual ICs
- High-mix display module production

🔎 SEO Keywords (for Global Visibility)

15.6 inch dual-head IC main bonding machine, OL-CBY156 Olian, double hot bar COG bonder for LCD, servo-controlled dual IC bonding machine, high-throughput IC bonding equipment for display panels, multi-zone dual-head bonding machine, 400°C dual press head main bonder, simultaneous IC bonding machine for automotive displays, dual servo IC main bonding machine with PLC control, OL-CBY156 technical specifications. COG Bonder, COP bonder, COF bonder, Main bonding machine, Final bonding machine, final main bonding machine,main bonder,Final bonder.

OL-CBD156 – 15.6-Inch Single-Station IC Servo Main Bonding Machine

OL-CBD156 – 15.6-Inch Single-Station IC Servo Main Bonding Machine,

High-Precision Thermal Compression System for Final IC Bonding on LCD Panels

The OL-CBD156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic main bonding machine designed for the final thermal compression of bare driver IC chips onto ACF-pre-laminated edge terminals of large-format rigid LCD panels up to 15.6 inches. As the critical last step in the COG (Chip-on-Glass) process, this system delivers consistent, high-reliability interconnects through precise servo-controlled pressure, uniform heating, and stable mechanical alignment—ensuring low contact resistance and long-term display performance.

Unlike pre-bonders or ACF applicators, the OL-CBD156 performs full-strength main bonding, fully curing the anisotropic conductive film to create permanent electrical and mechanical connections between the IC and glass substrate.

⚠️ Note: This machine assumes that ACF has already been applied and the IC has been pre-aligned (e.g., via a pre-bonder). It does not include ACF application, vision alignment, or double-side capability.

🔧 Key Technical Specifications

Substrate & Component Compatibility

Panel Size:
- Max: 350 mm × 250 mm (~15.6″ diagonal)
- Min: 150 mm × 80 mm (~7″)
- Thickness: 0.2 – 2.2 mm
IC Dimensions:
- Length: 5 – 40 mm
- Width: 0.5 – 3 mm
- Thickness: 0.08 – 0.5 mm
Bonding Zones: Supports up to 10 segments along a single edge (multi-zone sequential bonding)

Bonding Performance

Heating System:
- Heater Type: Cartridge-style Φ9.5 mm × 70 mm heating rods
- Temperature Range: Room temperature to 400°C
- Surface Uniformity: ≤ ±3°C across press head
Pressure Control:
- Servo-driven actuator for ultra-stable force output
- Adjustable range: 20 N to 120 N
- Repeatability: ≤ ±3 N
Bonding Time: 0.1 – 99.9 seconds (user-programmable)

Control & Operation

Control Unit:
- PLC-based logic controller
- Color touchscreen HMI (Chinese interface) for parameter setup
- Real-time display of temperature, time, pressure, and status
Operating Modes:
- Manual Mode: Full control over head movement and functions
- Auto Mode: One-button cycle after panel loading
Physical Controls:
- Start Button (Φ24 mm)
- Vacuum Button (Φ24 mm)
- Emergency Stop (Φ22 mm, red mushroom type)
- Power Switch

Process Workflow

Operator places ACF-pre-laminated LCD panel onto vacuum platform.
Vacuum is activated to secure the panel flat.
Pre-placed IC (from pre-bond station) is positioned over the bonding zone.
Operator initiates cycle via start button.
Servo press head descends with precise force, applies heat for preset duration.
Upon completion, head retracts; operator unloads the fully bonded panel.
For multi-segment panels, the process repeats at each IC location.

💡 Smart Feature: The machine includes a “tape not feeding” alarm—if the carrier tape (e.g., from IC feeder) fails to advance, the system halts and alerts the operator to prevent missed bonds.

📏 Machine Physical Data

Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
Weight: ~780 kg
Work Height: Platform at 890 ± 30 mm from floor—ergonomic for standing operation
Operating Environment:
- Cleanroom required (ISO Class 8 or better)
- Temperature: 22–27°C
- Humidity: 40–70% RH

🛡️ Quality Assurance & Support

Documentation: Includes 1 Chinese-language operation manual
Training: 1-day on-site session covering:
- Machine installation and calibration
- Parameter optimization for different IC types
- Troubleshooting common faults (e.g., poor adhesion, pressure deviation)
- Replacement of wear parts (heaters, thermocouples, buttons)
Warranty: 12 months on mechanical and electrical systems under normal use
- Exclusions: Consumables (seals, buttons), damage from misuse, or force majeure
After-Sales Service:
- Lifetime technical support
- On-site engineer within 72 hours if remote assistance fails during warranty

✅ Included Standard Components

Custom IC bonding head (tooling per customer drawing)
Φ9.5 × 70 mm cartridge heaters
K-type thermocouples for temperature feedback
Φ24 mm start and vacuum buttons
Φ22 mm emergency stop switch
National-standard (GB) maintenance toolkit

🔖 Model Summary

Model: OL-CBD156
Function: Single-station, single-head IC main bonder for COG process
Panel Size: Up to 15.6 inches
Core Technology: Servo-controlled pressure + high-uniformity heating
Key Advantage: High repeatability (±3 N) for reliable mass production
Target Industries: Display module assembly, automotive displays, industrial HMIs, medical monitors

🔎 SEO Keywords (for Global Search Visibility)

IC Bonder,ACF IC bonder,IC bonding machine, COF bonding machine, COG bonding machine, IC final main bonding machine, IC main bonder,IC final bonder,COG ,COF,COP bonding machine, COP bonder, 15.6 inch IC main bonding machine, OL-CBD156 Olian, single-head COG bonder for LCD, servo-controlled thermal compression machine, multi-zone IC bonding equipment for display panels, high-precision IC main bonding machine with ±3N repeatability, 400°C hot bar main bonder for driver ICs, single-station COG bonding system, IC main bonding machine for automotive and industrial displays, servo IC final bonder with PLC and touchscreen.

ACF bonding Keywords Explanation

ACF bonding Keywords Categorization and Explanation:

1. Bonding Machines

FOB Bonder: A machine used for bonding FOB (Flexible On Board) components.

COG Bonder: Used for bonding COG (Chip On Glass) components.

COF Bonder: Used for bonding COF (Chip On Film) components.

COP Bonder: Used for bonding COP (Chip On Plastic) components.

FOG Bonder: Used for bonding FOG (Flexible On Glass) components.

FOF Bonder: Used for bonding FOF (Flexible On Flexible) components.

FPC Bonder: Used for bonding FPC (Flexible Printed Circuit) components.

TAB Bonder: Used for bonding TAB (Tape Automated Bonding) components.

OLB Bonder: Used for bonding OLB (Outer Lead Bonding) components.

IC Bonder: Used for bonding IC (Integrated Circuit) components.

Glass Bonder: Used for bonding glass components.

LCD Panel Bonder: Used for bonding LCD (Liquid Crystal Display) panels.

LED Panel Bonder: Used for bonding LED (Light Emitting Diode) panels.

Mini LED Bonder: Used for bonding mini LED components.

Micro LED Bonder: Used for bonding micro LED components.

Zebra Paper Bonder: Used for bonding zebra paper components.

Touch Panel FPC Bonder: Used for bonding FPC components in touch panels.

Mobilephone Bonding Machine: Used for bonding components in mobile phones.

Smart Watch LCD Bonder: Used for bonding LCD components in smart watches.

Wearable Equipment Bonder: Used for bonding components in wearable devices.

TV Panel Bonder: Used for bonding components in TV panels.

LCD Module Bonder: Used for bonding LCD modules.

Flat Panel Display Bonder: Used for bonding flat panel displays.

2. Bonding Processes and Materials

ACF (Anisotropic Conductive Film): A film used in bonding processes to connect different layers.

COG (Chip On Glass): A process where chips are directly mounted on glass substrates.

COF (Chip On Film): A process where chips are mounted on flexible substrates.

COP (Chip On Plastic): A process where chips are mounted on plastic substrates.

FOG (Flexible On Glass): A process where flexible circuits are mounted on glass substrates.

FOB (Flexible On Board): A process where flexible circuits are mounted on boards.

FOF (Flexible On Flexible): A process where flexible circuits are mounted on other flexible circuits.

TAB (Tape Automated Bonding): A process where tape is used to bond components.

OLB (Outer Lead Bonding): A process where the outer leads of components are bonded.

IC (Integrated Circuit): A small chip that contains a complex electronic circuit.

FPC (Flexible Printed Circuit): A flexible circuit board used in various electronic devices.

Zebra Paper: A type of conductive paper used in bonding processes.

3. Repair and Maintenance Equipment

LCD Repair Machine: Used for repairing LCD screens.

LED Repair Machine: Used for repairing LED screens.

OLED Repair Machine: Used for repairing OLED screens.

Amoled Repair Machine: Used for repairing Amoled screens.

Mini LED Repair Machine: Used for repairing mini LED screens.

Micro LED Repair Machine: Used for repairing micro LED screens.

TFT Glass Repair Machine: Used for repairing TFT (Thin Film Transistor) glass screens.

LCD Panel Repair Machine: Used for repairing LCD panels.

LED Panel Repair Machine: Used for repairing LED panels.

OLED Panel Repair Machine: Used for repairing OLED panels.

Amoled Panel Repair Machine: Used for repairing Amoled panels.

Flex Cable Repair Machine: Used for repairing flex cables.

IC Remover: A tool used to remove ICs from circuits.

IC Remove Machine: A machine used to remove ICs from circuits.

Differential Interference Microscope: A microscope used to inspect bonding processes.

Metallurgical Microscope: A microscope used to inspect metal surfaces.

Industrial Tool Microscope: A microscope used for industrial inspections.

Large Size Upright Microscope: A large microscope used for detailed inspections.

Second Hand Differential Interference Microscope: A used microscope for inspecting bonding processes.

4. Specific Applications and Solutions

Whole Line Solution for Intelligent Wearable Products: A comprehensive solution for producing intelligent wearable products.

Whole Line Solution for Intelligent Watches: A comprehensive solution for producing intelligent watches.

Mobile Product Line Solutions: Solutions for producing mobile products.

PAD Display Product Line Solutions: Solutions for producing PAD displays.

Tablet Product Line Solutions: Solutions for producing tablet displays.

Notebook Product Line Solutions: Solutions for producing notebook displays.

Industrial Control Display Product Line Solutions: Solutions for producing industrial control displays.

High-Level Flexible Screen Glue Field Production Solutions: Solutions for producing high-level flexible screens.

Intelligent Locomotive, Notebook Product Line Solutions: Solutions for producing intelligent locomotives and notebooks.

Display Product Line Solution: A comprehensive solution for producing displays.

Commercial Display Screen – Flexible Bonding Production Line Solution: A solution for producing commercial display screens.

Electronic Paper Line Solutions: Solutions for producing electronic paper.

Electronic Paper Laminating, Bonding, Dispensing Field Line Solutions: Solutions for producing electronic paper laminating, bonding, and dispensing.

Backlight Leading, Laminated Film, Shading, Wrapping Line Equipment Solutions: Solutions for producing backlight leading, laminated film, shading, and wrapping.

Fingerprint Module Under the Screen Bond Spot Glue and AOI Intelligent Detection Field Solutions: Solutions for producing fingerprint modules under the screen.

Automatic OCA, OCR Fit Field Production Solutions: Solutions for producing automatic OCA (Optically Clear Adhesive) and OCR (Optical Character Recognition) fits.

FPC Covering Film, EMI Automatic Laminating, FPC Exposure Special Equipment Field Solutions: Solutions for producing FPC covering film, EMI (Electromagnetic Interference) automatic laminating, and FPC exposure.

3C Product Inspection Packaging Production Line Solution: Solutions for producing 3C product inspection and packaging.

5. Accessories and Parts

Bonding Machine Head: A part of the bonding machine used for bonding.

Bonding Machine Press Head: A part of the bonding machine used for pressing.

Bonding Machine Spare Parts: Various spare parts for bonding machines.

Bonding Machine Parts: Various parts for bonding machines.

ACF Tape: A tape used in bonding processes.

ACF Bonding Tape: A tape used in bonding processes.

ACF Glue: A glue used in bonding processes.

ACF Adhesive: An adhesive used in bonding processes.

ACF Bonding Machine Head: A part of the ACF bonding machine.

ACF Bonding Machine Price: The cost of an ACF bonding machine.

ACF Bonding Machine Manufacturer: A company that manufactures ACF bonding machines.

ACF Bonding Machine Manual: A manual for operating an ACF bonding machine.

ACF Bonding Machine PDF: A PDF document related to ACF bonding machines.

ACF Bonding Machine Spare Parts: Spare parts for ACF bonding machines.

ACF Bonding Machine Working: The working principle of an ACF bonding machine.

ACF Bonding Machine Cost: The cost of an ACF bonding machine.

Accessoire ACF Bonding Machine: Accessories for ACF bonding machines.

Low Cost ACF Bonding Machine: An affordable ACF bonding machine.

ACF Bonding Machine Demon for Replacing IC: A demonstration of using an ACF bonding machine for replacing ICs.

ACF Pulse Heat Bonding Machine: A machine that uses pulse heat for bonding.

How to Make ACF Bonding Machine: Instructions for making an ACF bonding machine.

Homemade ACF Bonding Machine: A self-made ACF bonding machine.

ACF Bonding Machine eBay: ACF bonding machines available on eBay.

ACF Bonding Machine for Mobile: An ACF bonding machine for mobile devices.

ACF Bonding Machine Head Price: The cost of an ACF bonding machine head.

ACF Bonding Machine Manual: A manual for operating an ACF bonding machine.

ACF Bonding Machine New: A new ACF bonding machine.

ACF Bonding Machine Homemade: A self-made ACF bonding machine.