T-FOG Bonding Machine is a specialized device used in the electronics manufacturing industry to bond flexible printed circuits (FPCs) onto glass substrates using tape. This process is essential for creating reliable electrical connections while maintaining the integrity and flexibility of the components involved. The “T” in T-FOG can also represent the application of this technology in Touch Panel manufacturing, where it is used to connect flexible circuits to glass substrates in touchscreens.
Working Principle
The T-FOG bonding process typically involves several key steps:
ACF Application: Anisotropic Conductive Film (ACF) is precisely applied to the glass substrate. This film facilitates the electrical connection between the FPC and the substrate.
Tape Attachment: A tape is attached to the FPC to facilitate handling and alignment during the bonding process.
Precision Alignment: Advanced vision systems are used to align the FPC with the glass substrate at a high-precision level, typically within ±3µm.
Bonding Process: Heat and pressure are applied to the assembly, activating the ACF to form a stable electrical and mechanical connection between the FPC and the glass substrate.
Applications
T-FOG Bonding Machines are widely used in various applications where flexible circuits need to be connected to glass substrates. These include:
LCD and OLED Displays: Essential for manufacturing high-resolution displays for smartphones, tablets, and TVs.
Automotive Displays: Used in vehicle instrument clusters and infotainment systems where reliability and durability are critical.
Industrial and Medical Displays: For creating high-performance displays used in industrial machinery and medical equipment.
Touch Panels: Specifically for bonding flexible circuits to glass substrates in touchscreens, ensuring responsive and durable touch interfaces.
Shenzhen Olian’s T-FOG Bonding Machine
Shenzhen Olian Automatic Equipment Co., Ltd. offers advanced T-FOG Bonding Machines designed for high-precision and high-speed production. Their machines are capable of handling various types of FPCs and glass substrates, ensuring reliable and efficient bonding processes. For example, their fully automatic T-FOG bonding machine integrates multiple processes, including ACF application, FPC loading, precise alignment, and main bonding, all within a single machine. This integration streamlines the manufacturing process and improves overall efficiency.
Advantages of Shenzhen Olian’s T-FOG Bonding Machine
High Precision: Ensures accurate alignment and bonding of components, typically within ±3µm for all panel sizes.
High-Speed Automation: Reduces the time required for each bonding process, allowing for higher production rates and increased throughput.
Customizable Solutions: Machines can be tailored to meet specific needs, such as different substrate sizes and bonding requirements.
Enhanced Reliability: The consistent bonding process ensures that each product meets high-quality standards, reducing the likelihood of defects and improving overall yield.
Conclusion
The T-FOG Bonding Machine is a critical component in modern electronics manufacturing, particularly for applications requiring flexible-to-glass connections in displays and touch panels. Shenzhen Olian’s T-FOG Bonding Machines stand out for their precision, automation, and adaptability, making them ideal for a wide range of applications in consumer electronics, automotive, and industrial fields.
Equipment Name: Full – automatic T-FOG Bonding Machine
Equipment Model: OL-FB2100A
Application: Suitable for bonding flexible printed circuits (FPCs) onto glass substrates for 1″-7″LCD products.
Compatibility: Can be used in conjunction with other devices from the same company.
2. Working Principle
The process involves several key steps:
ACF Application: Anisotropic Conductive Film (ACF) is precisely applied to the glass substrate.
Tape Attachment: A tape is attached to the FPC to facilitate handling and alignment.
Precision Alignment: Advanced vision systems align the FPC with the glass substrate at a high – precision level.
Bonding Process: Heat and pressure are applied to activate the ACF, forming a stable connection.
3. Product Specifications
LCD Specifications: Size ranges from L 20mm * W 20mm to L 230mm * W 120mm, thickness between 0.15mm and 1.1mm.
FPC Specifications: Size from L 20mm * W 10mm to L 150mm * W 122mm, thickness between 0.1mm and 0.5mm.
ACF Specifications: Available in reel – to – reel, 2 – layer or 3 – layer types, with specific application dimensions and material properties.
4. Machine Performance
Production Accuracy: High – precision alignment and bonding with specified tolerances for ACF application and FPC bonding.
Production Beat: Efficient production rates with specified time limits for each process step.
5. Process Parameters
Temperature Control: Wide temperature range for different bonding stages, with precise control methods.
Time Setting: Adjustable time ranges for each bonding stage.
Pressure Control: Variable pressure ranges for ACF application, pre-bonding, and main bonding.
6. Overall Machine Specifications
Dimensions: Machine length around 2600mm, width around 1150mm, height around 2000mm.
Weight: Approximately 2000KG.
Color: White, with customization options.
Operating Environment: Requires a cleanroom environment of 1000 – class or below.
Power Supply: Single – phase 220VAC with specific power requirements.
Pneumatic and Vacuum Requirements: Detailed specifications for air pressure, consumption, and vacuum levels.
7. Unit Specifications
Detailed specifications for each unit involved in the bonding process, including material handling, alignment, bonding, and quality control.
8. Control System
Control Method: PLC control with a touch screen interface for easy operation and parameter adjustment.
Safety Features: Emergency stop buttons, interlock design, and alarm systems for safe operation.
9. Documentation and After-sales Service
Comprehensive documentation and training provided, along with after – sales service details.
10. Main Components
Information on the brands and origins of key components used in the machine, ensuring quality and reliability.
This T-FOG Bonding Machine is designed for high – precision and efficient bonding processes in the electronics manufacturing industry, particularly for LCD products. It integrates multiple processes into a single machine, offering customizable solutions to meet specific production needs.
