The OL-QX156 PLASMA cleaner, developed by Shenzhen Olian, is designed for efficient surface treatment of medium-sized components in electronic and display manufacturing. It utilizes advanced PLASMA technology to remove contaminants and improve surface adhesion properties. The semi-automatic operation ensures a balance between precision and human oversight. Its multi-stage cleaning process allows for thorough and customized cleaning cycles, adapting to different material requirements. The machine’s compact design saves floor space while maintaining high cleaning efficiency, making it ideal for medium-scale production environments.
The OL-COG156 pre-bonder specializes in the preliminary bonding steps for Chip on Glass (COG) and Chip on Film (COF) applications. It features precise alignment systems to ensure accurate component placement before final bonding. The multi-stage process allows for temperature and pressure adjustments at each stage, optimizing the pre-bonding quality. Its user-friendly interface simplifies parameter settings, enabling quick adaptation to different product requirements. The machine’s robust construction ensures reliability during high-volume production runs.
Designed for the application of Anisotropic Conductive Film (ACF), the OL-A00156 ensures precise and consistent attachment of this critical material in electronic assemblies. The multi-stage process allows for accurate film positioning and application of optimal pressure and temperature. The machine’s ability to handle various ACF materials makes it versatile for different manufacturing needs. Its automated feeding system improves material handling efficiency, reducing waste and enhancing overall productivity.
single head COG bonding machineCOG COF main bonder
The OL-CBD156 is a versatile bonder featuring a single moving head that can perform multiple bonding stages with high precision. Its servo-controlled mechanism ensures accurate control of pressure, temperature, and positioning. The moving head design allows for flexible adaptation to different product sizes and configurations. The machine’s advanced control system enables customizable bonding profiles, making it suitable for complex bonding requirements in medium-sized production settings.
5. Dual-head Servo final-Bonder (OL-CB156)
COG main bonder
Offering increased productivity through its dual-head design, the OL-CB156 allows for simultaneous bonding operations. Each head operates independently with precise servo control, ensuring consistent bonding quality across multiple channels. The machine’s efficient material handling system minimizes downtime between cycles. Its compact footprint and high-speed operation make it an excellent choice for manufacturers seeking to maximize output in limited production spaces.
Combining the benefits of dual heads with multi-stage processing, the OL-CBY156 provides exceptional flexibility and efficiency. The moving heads can perform sequential bonding operations at different positions, reducing the need for manual intervention. Its advanced thermal management system ensures consistent bonding temperatures across all stages. The machine’s modular design allows for easy maintenance and upgrades, extending its useful life in demanding manufacturing environments.
7. Medium-sized FOG Thermal Bonder (OL-FOG156)
FOG bonderFOG bonder
Specialized for Film on Glass (FOG) applications, the OL-FOG156 offers optimized thermal bonding capabilities for medium-sized components. Its precise temperature control ensures reliable adhesion while preventing thermal damage to sensitive materials. The machine’s adjustable pressure system accommodates different film and glass combinations. Its automated operation improves processing speed and consistency, making it a valuable asset in display and touch panel manufacturing.
Designed for Film on Board (FOB) bonding processes, the OL-FOB156 provides efficient and reliable thermal attachment of film components to circuit boards. It features accurate alignment systems to ensure proper film positioning on the board. The machine’s thermal profiling capabilities allow for customization based on specific material properties and bonding requirements. Its robust construction and automated features enhance productivity while maintaining high-quality standards in medium-sized production settings.
FOG bonderFOG bonderFOB BonderFOG FOB bonderFOG bonderACF attacher FOG bonderACF attacher COG bonder150mm press head bonding machineCOG pre-bonding and main bonding 2 in 1 machine
In summary, Shenzhen Olian’s range of manufacturing equipment is tailored to address the specific needs of modern electronic and display production. Each machine incorporates advanced technologies and user-friendly designs to enhance precision, efficiency, and reliability. Whether for cleaning, pre-bonding, material attachment, or final bonding processes, our solutions help manufacturers achieve optimal production outcomes in competitive market environments.
Semi Automatic Mid Size Displays Bonding Equipments. EC Cleaner，ACF Attacher， COG pre bonder，COG mian bonder，FOG bonder ，FOB bonder. Welcome you visit us for more details.
