描述
Product Overview: A high-precision and highly configured fully automatic production line developed specifically for small-sized single sided single chip ICs and single chip FPCs. Suitable for various types of COG/COF/COP bonding production, with supporting COF punching, EC/PLASMA cleaning, FOG/FOF/FOB bonding.
Equipment Usage: Suitable for small-sized TFT, IPS, OLED LCD and other products, achieving LCD bonding terminal cleaning and plasma cleaning, automatic ACF attachment, alignment, pre-bonding, and main-bonding of single sided single chip IC (or COF), as well as related process requirements. This device can be connected to the front and rear devices of our company or other companies for use.
Glass size range 1“ ~7“（16:9）
Process cycle 4.5S bilateral wiping with a wiping speed of 5.2 inches and 80mm/s
Correction method Visual correction
Qty of cleaning head configurations Alcohol group 1+Plasma group 1
Dust free fabric style 20mm (W)×50m (L)×0.4mm(T)
Plasma brand PT300
Plasma high voltage/frequency 2KV~7KV / 18KHz-60KHz
Plasma practical power 300W
Working power supply/power 220V/50HZ/ 2.5KW
Equipment dimensions 1500(L)×1110(W)×1800(H)(not include FFU）
Glass thickness range Min 0.2mm, Max 1.1mm
Number of wiping edges on terminals unilateral
image processing system Beijing Boshi
Alcohol supply method Peristaltic dispensing machine
Cleaning method Double sided clamping cleaning
Standard/High configuration water droplet angle 20~30°
Standard/High configuration temperature 90~100℃
Cleaning accuracy X±0.5mm, Y±0.1mm
Main gas source/consumption 0.5~0.7Mpa 300L/min
Equipment weight ≈1000Kg
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