描述

Semi automatic Dual station Down alignment platform Fixed FOG bonding machine FOG Bonder OL-F003

This device is a manual bonding machine, which is a device for aligning and bonding FPC on a panel that has already been attached with a conductive film (ACF).The product is manually picked and placed, and the device automatically bonding.

This equipment is mainly used for LCD and FPC, TAB, PCB and FPC, TAB processing technology. Widely used for FOG bonding on mobile screens such as Apple and Samsung.

1. Adopting Panasonic control system to control equipment actions;
2. Adopting SMC precision pressure regulation control system for more precise pressure regulation;
3. Accurate temperature control is achieved using the Constant temperature heating method and the South Korean AUTONICS temperature controller.
4. The upper and down videos can be switched through the touch screen

LCD SIZE： 3~7inch
Capacity: About350 pieces／hour;
FPC Bonding range: 11~80mm;
Bonding accuracy: X±0.08mm,Y±0.08mm;
Heating method: Constant temperature control;
Temperature range: RT-400℃;
Working air pressure: 0.4~0.6Mpa;
Power Supply: 220V，50HZ，1600W;
Total weight: about 250Kg;
Dimensions: L800*W840*H1310;