描述

Semi automatic COG/COF/COP Pre Bonding machine,COG Bonder,COP Bonder,COF bonder,OL-COF003

This device is a semi-automatic Pre Bonding machine, which is a device for aligning and Pre Bonding COF/IC on a panel that has already been attached with a conductive film (ACF). The removal and placement of the panel are manually completed, while aligning and Pre Bonding are automatically completed by the device.

This device meets the requirements of fully automatic alignment and Pre Bonding for high accuracy IC TO STN-LCD, COLOR STN-LCD, TFT-LCD, OLED-LCD, and flexible OLED. It is mainly used for IC repair and small batch production.

1. Adopting high-precision visual control systems and positioning systems (optional for Panasonic and FAST);
2. Adopting a more user-friendly interface design, making it easier for learners to get started;
3. Adopting modular design and variety functions, greatly reducing product switching time and new product debugging time.

LCD SIZE： 3~7inch
Capacity: About 600pcs IC／and about 300 for COF /hour;
COF range: MIN:6*8mm,MAX65*45mm;
IC specification range: MIN:6*0.6mm,MAX38*5mm;
Pre bonding accuracy: ±0.003mm
Heating method: Constant temperature control;
Temperature range: RT-150℃;
Working air pressure: 0.4~0.6Mpa;
Power Supply: 220V，50HZ，1000W;
Total weight: 350Kg;
Dimensions: L940*W900*H1450;