描述
OL-ECB1500A Fully Automatic EC+COG/COF Bonding Machine
The OL-ECB1500A Fully Automatic EC+COG/COF Bonding Machine is a cutting-edge fully automatic EC+COG/COF bonding machine designed to meet the precise manufacturing requirements of modern electronics production. This advanced equipment is specifically tailored for the automatic wiping, ACF (Anisotropic Conductive Film) application, pre-bonding, and main bonding processes of single-sided, single-component LCD products ranging from 1″ to 10.1″ in size. Its innovative design and high-precision features make it an essential tool for manufacturers seeking efficiency, accuracy, and reliability in their production lines.
Equipment Information
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Equipment Name: Fully Automatic EC+COG/COF Bonding Machine
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Model: ECB-1500A
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Application: Suitable for LCD products with sizes from 1″ to 10.1″, designed for automatic wiping, ACF application, pre-bonding, and main bonding of single-sided, single-component products.
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Compatibility: Can be integrated with other machines in a production line for seamless operation.
Working Principle
The OL-ECB1500A Fully Automatic EC+COG/COF Bonding Machine operates through a series of coordinated mechanical and automated processes. The workflow begins with the loading of the product onto the conveyor belt or platform, either manually or via an automated upstream machine. Mechanical arm 1# picks up the product, corrects its position using the CCD (Charge-Coupled Device) system, and places it on the wiping platform. The wiping platform advances, and the wiping and plasma cleaning processes are completed across the entire wiping area.
Next, mechanical arm 2# transfers the LCD to the ACF platform. The ACF platform advances, and the bonding head descends to apply the ACF. After the ACF application, the platform retracts to the unloading position. Mechanical arm 3# then picks up the LCD, checks the ACF adhesion, and places it on the pre-bonding stage. Meanwhile, the IC/COF is loaded, and the automatic feeding system visually corrects the IC/COF position. After pre-alignment, the IC/COF is moved to the bonding head position, and the bonding head picks it up for pre-bonding. Mechanical arm 4# moves the product to one of the three main bonding platforms for final bonding. Finally, mechanical arm 5# transfers the bonded LCD to the downstream conveyor or production line.
Product Specifications
LCD Specifications
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Size Range: Minimum 20mm x 20mm, Maximum 230mm x 120mm, Thickness 0.15mm to 1.1mm.
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Alignment Marks: Pitch ≥ 5mm between any two points on the glass, Mark size 200µm to 800µm.
Cleaning Cloth Specifications
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Type: Roll-based (number of rolls: 2).
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Width: ≤ 10mm.
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Maximum Roll Diameter: ≤ 300mm.
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Roll Inner Hole Diameter: ≥ 24.5mm.
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Feed Length: Adjustable from 0.1mm to 99.9mm.
Cleaning Solvent
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Type: Alcohol or acetone.
IC/COF Specifications
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Terminal Pitch: ≥ 30µm.
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Alignment Marks: Pitch 5mm to 70mm.
ACF Specifications
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Types: Roll-based, 2-layer or 3-layer.
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Application Length: 5mm to 80mm (adjustable based on bonding head length and customer requirements).
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Application Width: 0.5mm to 5.0mm.
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Reel Specifications: Inner diameter options of 18mm and 25mm, Maximum reel diameter 200mm.
Buffer Material Specifications
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ACF Section: Single-piece buffer material, manually clamped.
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Main Bonding Section: Roll-based, automatic front-to-back rotation.
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Reel Dimensions: Outer diameter ≤ 100mm, Inner hole diameter 32mm.
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Width: Adjustable from 5mm to 20mm.
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Feed Frequency: Adjustable from 1 to 999 cycles for automatic tape rotation.
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Feed Length: Single-step length adjustable from 1mm to 99mm.
Machine Performance
Water Drop Angle
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Water Drop Angle: ≤ 25 degrees, depending on actual conditions.
Production Accuracy
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ACF Application Accuracy: ±0.2mm in X-axis, ±0.15mm in Y-axis.
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IC/COF Pre-bonding Accuracy: ±3µm in X-axis, ±3µm in Y-axis.
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IC/COF Main Bonding Accuracy: ±5µm in X-axis, ±5µm in Y-axis (related to COF material expansion coefficient).
Production Cycle
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Cycle Time: ≤ 4.5-5 seconds per piece.
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ACF Application Time: ≤ 0.5 seconds.
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Pre-bonding Time: ≤ 0.5 seconds.
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Main Bonding Time: ≤ 12 seconds.
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Variation based on product size.
Product Type
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Supported Type: Single-sided, single IC/COF.
Model Changeover
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New Model Setup: ≤ 60 minutes.
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Existing Model Recall: ≤ 30 minutes, depending on the operator’s proficiency.
Equipment Yield
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Yield: ≥99.5% (excluding material issues).
Process Parameter Specifications
Temperature Control
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Setting Range:
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ACF-bonding: Room Temperature (RT) to 150°C.
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Pre-bonding: RT to 150°C.
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Main-bonding: RT to 400°C.
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Heating Method: Constant heat.
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Control Method: Touchscreen setting with 0.1°C increments, PID control.
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Temperature Uniformity: ±5°C.
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Thermocouple Type: K type.
Time Setting
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Setting Range:
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ACF-bonding: 0.1 to 9.9 seconds.
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Pre-bonding: 0.1 to 9.9 seconds.
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Main-bonding: 0.1 to 99.9 seconds.
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Setting Method: Configured via touchscreen interface with 0.1-second increments.
Pressure Control
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Adjustment Range:
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ACF-bonding: 10 to 150N.
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Pre-bonding: 10 to 150N.
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Main-bonding: 20 to 400N.
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Control Method:
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ACF and pre-bonding: Precision pressure regulator.
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Main-bonding: Proportional valve with analog control, adjustable via touchscreen with 0.002Mpa increments.
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General Machine Specifications
Dimensions and Weight
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Machine Length: Approximately 3210mm (including 620mm conveyor extension).
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Machine Width: Approximately 1400mm.
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Machine Height: Approximately 1800mm (excluding FFU and tri-color light).
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Working Height: 1000mm.
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Machine Weight: Approximately 3500kg.
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Color: White, with customization options available.
Environmental and Power Requirements
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Operating Environment: Class 1000 or lower cleanroom.
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Power Supply: Single-phase, AC 220V±10%, 50 Hz, with a 2-meter external power cord for connection to factory power (other interfaces available upon request).
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Power Consumption: Maximum 10KW.
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Air Supply:
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Clean compressed air: Minimum pressure ≥ 0.5-0.7MPa.
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Air consumption: Approximately 150L/min.
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Air hose connection: 2-meter white hose with a 12mm diameter and quick connector for factory air supply.
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Vacuum Supply:
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Built-in vacuum pump (200L/min) and storage tank.
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Optional external vacuum source with a 12mm diameter hose connection.
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Vacuum level: ≥ -70Kpa (≥ 525mm Hg).
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Vacuum flow: Approximately 150L/min.
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Recommendation: Use the factory vacuum system if available.
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Exhaust: Centralized exhaust system.
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Safety Features:
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Emergency stop buttons with anti-misoperation covers.
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Interlocked machine design for safety.
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Audible and visual alarms on the touchscreen for error indication and operator alerts.
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Safety labels (electric shock, mechanical injury, etc.) and hazard area warnings.
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Equipment Unit Specifications
Feeding and Discharging
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Feeding: Conveyor belt or platform loading.
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Discharging: Conveyor belt unloading, with direct handover to downstream machines or production lines.
Solvent Supply Unit
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Solvent Control: Dosed by peristaltic dispensing equipment.
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Solvent Drop Volume: Adjustable per drop.
Cleaning Cloth Supply Unit
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Cleaning Cloth Movement: Stepper motor + polyurethane roller.
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Cleaning Cloth Tensioning: Magnetic damping, adjustable force.
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Cleaning Cloth Recycling: Torque motor + magnetic damping, roll-based recycling.
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Cleaning Cloth Length Control: Stepper motor, adjustable length via operation interface.
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End-of-Tape Detection: Sensor detects when the cleaning cloth roll is finished.
Cleaning Air Claw Unit
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Air Claw Gap Height: Adjustable via micrometer, travel 5mm.
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Air Claw Flatness: Adjustable relative flatness of upper and lower clamping surfaces.
PLAMA Unit
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Plasma Cleaning: Low-temperature plasma, measured around 100°C.
Robotic Arms
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Mechanical Arm 1# (from Feeding Conveyor to Wiping Platform):
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Vacuum nozzles with adjustable numbers and configurations based on product size.
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Digital vacuum gauge for real-time monitoring.
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X-axis: Servo motor + ball screw rail.
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θ-axis: Stepper motor.
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Z-axis: Sliding table cylinder with manually adjustable position.
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Completes product correction and transfer to the next process.
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Mechanical Arm 2# (from Wiping Stage to ACF Stage):
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Vacuum nozzles with adjustable numbers and configurations based on product size.
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Digital vacuum gauge for real-time monitoring.
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X-axis: Servo motor + ball screw rail.
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θ-axis: Stepper motor for next-process angle adjustment.
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Mechanical Arm 3# (from ACF Stage to Pre-bonding Stage):
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Vacuum nozzles with adjustable numbers and configurations based on product size.
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Digital vacuum gauge for real-time monitoring.
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X-axis: Linear motor + rail.
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θ-axis: Stepper motor for next-process angle adjustment.
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Mechanical Arm 4# (from Pre-bonding Stage to Main Bonding Platform):
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Vacuum nozzles with adjustable numbers and configurations based on product size.
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Digital vacuum gauge for real-time monitoring.
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X-axis: Linear motor + rail.
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θ-axis: Stepper motor for next-process angle adjustment.
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Mechanical Arm 5# (from Main Bonding Stage to Discharge Conveyor):
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Vacuum nozzles with adjustable numbers and configurations based on product size.
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Digital vacuum gauge for real-time monitoring.
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X-axis: Linear motor + rail.
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θ-axis: Stepper motor for next-process angle adjustment.
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ACF Unit
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ACF Cutter:
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Cutting Method: Automatic semi-cutting.
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Depth Adjustment: Micrometer fine adjustment.
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Blade Movement: Cylinder-driven up and down, with adjustable X-axis position.
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ACF Head:
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Number of Bonding Heads: 1.
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Drive Method: Cylinder + rail.
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Pressure Control: Cylinder control with precision pressure regulator.
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Material: SUS440C (customizable).
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Dimensions: W 2mm × L 70mm (customizable).
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Surface Flatness: ≤ 5µm.
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ACF Stage:
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X-axis Movement: Servo motor + ball screw + rail.
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Y-axis Movement: Servo motor + ball screw + rail.
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Z-axis Movement: Servo motor + ball screw + rail.
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Vacuum: 1mm hole diameter, 2mm vacuum slot width.
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Material: Aluminum with anodized hard oxidation treatment.
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Flatness: ±0.02mm.
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ACF Backup:
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Material: Quartz.
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Dimensions: L100mm × W10mm × H18mm.
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Surface Flatness: ≤ 5µm.
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ACF Inspection: CCD inspection system.
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ACF Supply:
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Operation Method: Torque motor (or gravity hammer tensioning).
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Reel Tensioning: Belt tensioning structure.
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Protective Film Recovery: Vacuum move to waste bin.
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Separation Rod Movement: Cylinder-driven rod.
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IC/COF Pre-bonding Unit
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Pre-bonding Head:
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Number of Bonding Heads: 1.
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Z-axis Drive: Servo motor + ball screw + rail.
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Y-axis Transmission: Servo motor + ball screw + rail.
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θ-axis Movement: DD motor.
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Pressure Control: Cylinder control with precision pressure regulator.
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Material: SUS 440C.
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Dimensions: W 1.2mm × L 80mm (customizable).
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Surface Flatness: ≤ ±3µm.
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Vacuum: Segmentable vacuum selection with vacuum detection.
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Pre-bonding Stage:
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X-axis Movement: Servo motor + ball screw + rail.
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Y-axis Movement: Servo motor + ball screw + rail.
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Z-axis Movement: Servo motor + ball screw + rail.
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Vacuum: 1mm hole diameter, 2mm vacuum slot width.
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Material: Aluminum with anodized hard oxidation treatment.
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Flatness: ±0.02mm.
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Pre-bonding Backup:
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Material: Quartz strip.
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Dimensions: L136mm × W10mm × H12mm.
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Surface Flatness: ≤ ±5µm.
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IC/COF Main Bonding Unit
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Main Bonding Head:
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Number of Bonding Heads: 3.
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Drive Method: Servo motor + cylinder + rail.
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Pressure Control: Cylinder control with proportional valve analog control, adjustable via touchscreen.
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Material: SUS440C.
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Dimensions: W 5.0mm × L 60mm (customizable).
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Surface Flatness: ≤ ±3µm.
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Main Bonding Stage:
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Y-axis Movement: Servo motor + ball screw + rail.
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Z-axis Movement: Servo motor + ball screw + rail.
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Vacuum: 1mm hole diameter, 2mm vacuum slot width.
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Material: Aluminum with anodized hard oxidation treatment.
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Flatness: ±0.02mm.
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Main Bonding Backup:
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Material: Quartz.
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Dimensions: L80mm × W12mm × H18mm.
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Surface Flatness: ≤ ±2µm.
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Buffer Material Supply:
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Rotation Method: Stepper motor drive.
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Rotation Direction: Automatic front-to-back rotation.
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Width Adjustment: Manual width adjustment with limit wheel.
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Sensor detection for tape end monitoring.
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Image Processing Unit
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LCD Feeding Correction:
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System: Boss image processing system.
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CCD: 1.
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Coaxial Light Barrel: 1.
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Magnification: 1x.
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Field of View: 4.8mm × 3.6mm.
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Light Source: Coaxial light LED.
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Z-axis Adjustable Travel: 10mm.
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ACF Pre-correction:
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System: Bos视 image processing system.
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CCD: 1.
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Coaxial Light Barrel: 1.
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Magnification: 1x.
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Field of View: 4.8mm × 3.6mm.
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Light Source: Coaxial light LED.
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Z-axis Adjustable Travel: 10mm.
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ACF Inspection:
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System: Bosch image processing system.
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CCD Camera: 1.
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Coaxial Light Barrel: 1.
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Magnification: 0.5x.
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Field of View: 9.6mm × 7.2mm.
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Light Source: Coaxial light LED.
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IC Feeding Correction:
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System: Bosch image processing system.
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CCD Camera: 1.
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Coaxial Light Barrel: 1.
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Magnification: 1x.
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Field of View: 4.8mm × 3.6mm.
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Light Source: Coaxial light LED.
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Pre-bonding Alignment:
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System: Boss image processing system.
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CCD Cameras: 2.
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Coaxial Light Barrels: 2.
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Magnification: 4x.
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Field of View: 1.2mm × 0.9mm.
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Light Source: Coaxial light LED.
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Alignment Method: Mark coincidence.
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Main Bonding Alignment:
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System: Bos视 image processing system.
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CCD Camera: 1.
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Coaxial Light Barrel: 1.
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Magnification: 1x.
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Field of View: 4.8mm × 3.6mm.
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Light Source: Coaxial light LED.
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Z-axis Adjustable Travel: 10mm.
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X-axis: Servo motor + ball screw + rail.
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Control Unit
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Control Method: PLC control.
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Touchscreen:
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Interface: Chinese, touch-enabled.
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Modes: Manual and automatic.
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Functions: Parameter display.
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Manual Control Buttons:
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Emergency Stop Buttons: 3.
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Main Power Switch: 1.
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Lighting Power Switch: 1.
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Access Control: Door opening function, machine pauses during operation.
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Operation Indicator Lights: Tri-color lights.
Documentation and After-sales Service
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Documentation: Machine operation manual included.
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Training: Covers installation, operation, calibration, maintenance, troubleshooting, and safety precautions.
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After-sales Service: One year of free service for non-human-induced faults, with lifelong technical support.
Main Component Brands
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Servo Motors: Rite (China) / Yaskawa (Japan).
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Ball Screws: Hiwin (China) / THK (Japan).
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DD Motors: NSK (Japan).
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Guideways: Hiwin (China) / THK (Japan).
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Pneumatic Components: SMC (Japan) / Fujikura (Japan) / Airtac (China).
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PLC: Keyence (Japan).
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Touchscreen: Proface (Japan).
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Sensors: Panasonic (Japan) / HUAN (China).
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Power Supply: Mean Well (Taiwan).
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Circuit Breakers and Contactors: Schneider (France) / Shihlin (Taiwan).
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Drag Chains: Igus (Germany).
Equipment 2D Drawing
A detailed 2D drawing of the equipment is available, providing a clear visual representation of the machine’s layout and components. This drawing serves as a valuable reference for installation, maintenance, and integration into production lines.
In summary, the OL-ECB1500A Fully Automatic EC+COG/COF Bonding Machine represents a significant advancement in the field of LCD manufacturing equipment. Its precise engineering, user-friendly design, and comprehensive support make it an ideal choice for manufacturers seeking to enhance productivity and product quality in the competitive electronics market.
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