描述

Medium size Single head servo moving multi-point Main Bonding machine COG Main bonder,OL-CBD156

This device is a manual single head servo Main Bonding machine. It is a device that uses a Main Bonding IC (or COF) on a panel (or flexible screen) that has already been attached with a conductive film (ACF) and pre bonded with an IC or COF. The removal and placement of the panel are manually completed, and the bonding, timing, and tape routing are automatically completed by the device.

This device is suitable for hard glass (TFT, OLED, or flexible screen) Main Bonding IC or COF

LCD SIZE： 7~17.3inch
Capacity: 400~700 pieces／hour;
Maximum number of segments ≤10
IC bonding range: MIN:6*0.6mm,MAX38*5mm;
Main bonding accuracy: ±0.005mm;
Heating method: Constant temperature control;
Bonding headTemperature range: RT-400℃;
Back pressureTemperature range: RT-150℃;
Working air pressure: 0.4~0.6Mpa;
Power Supply: 220V，50HZ，1200W;
Total weight: 441Kg;
Dimensions: L1050*W1150*H1510;