描述

Medium size FOG bonding machine FOG bonder OL-FOG156

This device is a manual bonding that performs alignment bonding for connecting FPC on a display screen with a conductive film (ACF) attached. The placement and alignment of the display screen and FPC are manually completed, while bonding is automatically completed by the device.

This device is suitable for medium sized FOG and OGS product bonding.

LCD SIZE： 7~15.6inch
Capacity: 200~350 segments/H
Maximum number of segments ≤10
Bonding accuracy: X±0.08mm,Y±0.08mm;
Heating method: Constant temperature control;
Temperature range: RT-400℃;
Working air pressure: 0.4~0.6Mpa;
Power Supply: 220V，50HZ，3500W;
Total weight: About740Kg;
Dimensions: L1850*W950*H1610;

Medium size FOB bonding machine  OL-F0B156

This device is a manual bonding that performs alignment bonding for connecting FPC on a PCB with a conductive film (ACF) attached. The placement and alignment of the PCB and FPC (with or without display glass) are manually completed, while bonding is automatically completed by the device.

This device is suitable for medium-sized FOB and OGS product bonding

LCD SIZE： 7~15.6inch
PCB Length: ≤370mm
Capacity: 200~350 segments/H
Maximum number of segments ≤10
Bonding accuracy: X±0.08mm,Y±0.08mm;
Heating method: Constant temperature control;
Temperature range: RT-400℃;
Working air pressure: 0.4~0.6Mpa;
Power Supply: 220V，50HZ，3500W;
Total weight: About745Kg;
Dimensions: L1780*W950*H1610;