描述

Medium size dual heads movable multipoint servo Main Bonding machine-OL-CBY156

Description:

This device is a manual dual head servo Main Bonding machine. It is a device that uses a Main Bonding IC (or COF) on a Panel (or flexible screen) that has already been attached with a conductive film (ACF) and pre bonded with an IC or COF. The removal and placement of the Panel are manually completed, and the bonding, timing, and tape routing are automatically completed by the device.

Usage：

This device is suitable for hard glass (TFT, OLED, or flexible screen) Main Bonding IC or COF.

Technical Parameters:
LCD SIZE： 7~17.3inch
Capacity: 400~900pcs IC／hour;
Maximum number of segments ≤10
IC bonding range: MIN:6*0.6mm,MAX38*5mm;
Main bonding accuracy: ±0.005mm;
Heating method: Constant temperature control;
Bonding head Temperature range: RT-400℃;
Back pressure Temperature range: RT-150℃;
Working air pressure: 0.4~0.6Mpa;
Power Supply: 220V，50HZ，1200W;
Total weight: 824Kg;
Dimensions: L1350*W900*H1540;