描述

Medium size dual head servo Main Bonding machine-OL-CB156

Description:

This device is a manual Main Bonding machine that performs Main Bonding on glass or flexible displays that have been pre bonded with IC, ribbon, or COF. The product is manually picked and placed, and the device automatically bonding completed.

Usage：

This device is suitable for hard glass (TFT or OLED) Main Bonding IC, hard glass Main Bonding COF, flexible display Main Bonding IC, and flexible display Main Bonding COF.

Technical Parameters:
LCD SIZE： 7~17.3inch
Capacity: 400~700 pieces／hour;
IC bonding range: MIN:6*0.6mm,MAX38*5mm;
Main bonding accuracy: ±0.005mm;
Heating method: Constant temperature control;
Bonding headTemperature range: RT-400℃;
Back pressureTemperature range: RT-150℃;
Working air pressure: 0.4~0.6Mpa;
Power Supply: 220V，50HZ，2000W;
Total weight: 580Kg;
Dimensions: L1380*W1100*H1520;