描述

Medium size COG/COF Pre-Bonding machine 7-17inch OL-C0156

This device is a semi-automatic Pre Bonding machine, which is a device for aligning and Pre Bonding IC on a panel that has already been attached with a conductive film (ACF). The removal and placement of the panel are manually completed, while the alignment and Pre Bonding are automatically completed by the device.

This device is suitable for medium sized COG and COF products.

LCD SIZE： 7~17.3inch
Capacity: About400~600pcs IC／hour;
Maximum number of segments ≤10
IC specification range: MIN:6*0.6mm,MAX38*5mm;
Pre bonding accuracy: ±0.003mm
Heating method: Constant temperature control;
Temperature range: RT-150℃;
Working air pressure: 0.4~0.6Mpa;
Power Supply: 220V，50HZ，1000W;
Total weight: 488Kg;
Dimensions: L1010*W1060*H1500;