描述

Fully automatic small size COG/COF/COP bonding machine OL-CB1000

Overview: This device is a small-scale fully automatic COG (chip on glass), compatible with COF and COP bonding machines, achieving the full process of ACF attachment, IC pre bonding, and IC main bonding processes. The LCD adopts visual correction, and the robotic arm adopts a linear motor transportation design. The equipment automatically transports the LCD, and the left and right sides are used for platform feeding and discharging. The single side and single IC bonding process is completed throughout the entire process.

Glass size range 1 ”~ 7”（16:9）
IC size Min.5.0×0.8,Max.35×4
Attaching accuracy X±0.15mm,Y±0.15mm
Process cycle 4.5S（Single side one pc, 5.2 inches）
Number of bonding heads ACF attaching 1pc+pre bonding 1pc+main bonding 3pcs
ACF attaching head SUS 440C, 4.0×60mm,1pc,cylinder
Main bonding head Ceramic/Tungsten Steel,5.0×40mm,3pcs
ACF fabric style Width 1-5mm，Length 1-40mm
Pre alignment method Visual alignment
Working power supply/power 220V（±10%）/50HZ/12.5KW
Equipment dimensions 2500(L)*1440(W)x1800(H)(not include FFU）
Glass thickness range Min 0.2mm, Max 1.1mm
IC Bonding Number Single piece
Total bonding accuracy ±5μm
Image processing system Beijing Boshi
Number of IC boards 2/3/4inch,Place 12 discs/16 discs/12 discs separately
IC pre bonding head SUS 440C,3×30mm,1pc,Servo+cylinder
Main bonding method Servo+cylinder
Mark spacing Min 5.0mm MAX60mm
ACF detection and detection vision inspection
Main gas source/consumption 0.5~0.7Mpa / 300L/min
Equipment weight ≈3000Kg