描述

Fully automatic mid size COG bonding machine CB1100

Overview: This equipment is a medium-sized fully automatic COG (chip on glass) bonding machine, which achieves the full process of ACF attachment, IC pre bonding, and IC main bonding processes. The LCD adopts visual correction, and the robotic arm adopts a linear motor transportation design. The equipment automatically transports the LCD, with platform feeding and discharging on the left and right sides. It can continuously bond multiple ICs, two different ICs on adjacent sides, and can meet the entire process of 1-6 ICs bonding.

Glass size range 7 ”~ 17”（16:9）
IC size Min.5.0×0.8,Max.35×4
Attaching accuracy X±0.15mm,Y±0.15mm
Process cycle 2+2 12S, by 12inchs.
Number of bonding heads ACF attaching 1pc+pre bonding 1pc+main bonding 2*2 pcs
ACF attaching head SUS 440C, 4.0×60mm,1pc,cylinder
Main bonding head Ceramic/Tungsten Steel, 5.0 × 40mm, 3 pieces, 2 sets (optional with 4 pieces and 2 sets)
ACF fabric style Width 1-5mm，Length 1-40mm
Pre alignment method Visual alignment
Working power supply/power 380V（±10%）/50HZ/18.5KW
Equipment dimensions 6700(L)*1650(W)x2000(H)(not include FFU）
Glass thickness range Min 0.2mm, Max 1.1mm
IC Bonding Number 1-6 pieces/2 types
Total bonding accuracy ±5μm
Image processing system Beijing Boshi
Number of IC boards 2/3/4inch,Place 12 discs/16 discs/12 discs separately
IC pre bonding head SUS 440C,3×30mm,1pc,Servo+cylinder
Main bonding method Servo+cylinder
Mark spacing Min 5.0mm MAX60mm
ACF detection and detection vision inspection
Main gas source/consumption 0.5~0.7Mpa / 160L/min
Equipment weight ≈5000Kg