描述

Double stations up and down posioning plate form forward and backward FOB bonding machine OL-F0712

This equip is manuel heating pressing machine.The equipment is positioning and bonding CPF on ACF well attached panel. Panel taken and positioning is manuel, bonding is automatic. Applied for PCB bonding, T-COM, more FPC bonding.

This equipment could meet high accuracyFPC TO TFT-LCD、OLED-LCD、ON-CELL、IN-CELL and Flexiable OLED positioning and pre-bonding, mainbonding, applied for PCB bonding, T-COM, more FPC bonding.

1. Powerful functions, one machine could prebond and mainbond all the FPC. All the FPC in the market is available.
2. Forward and backward plateform makes press head and press position seperate, prevent new workers iron hand when working;
3. Up and down video could be switched by TP.
4. Max size of plateform 12″

LCD Size：： 2~12″ STN/CSTN/TFT-LCD(Plate form could be12″);
Capability： About350Pcs/h
PanelThickness： 0.3~1.1mm;
FPC Press Area： 6~80mm;
Actual Accuracy: X±0.05mm,Y±0.05mm;
Press Head size： 180*2.0mm,Customerized
Flatness of heat press heat : ±5μm;
Heating Model： Constant temperature
Temperature Ranges： RT-400℃;
Temperature Accuracy： ±3℃;
Fix model： Vac-sorb;
Gas Consumption： 0.2 CBM/min
Working Voltage： 0.4~0.6Mpa;
Power Supply： 220V，50HZ，1500W;
G.W.： 300Kg;
Outer Size： L800*W840*H1310(720);