描述

COG COF COP pre bonding and main bonding 3 in 1 machine, COG Bonder,COF bonder ,COP bonder, OL-CBS003

1. Equipment name: COG COP COF Three in one manual pre bonding and main bonding machine
2. Equipment model: OL-CBS003
3. Equipment function: This equipment is a manual bonding machine, and the left workstation is a pre bonding machine. It is a device that pre presses IC or COF on a panel that has already been attached with conductive film (ACF). The picking and placing of the panel is manually completed, and the pre alignment is automatically completed by the equipment. The right workstation is the  main bonding machine: it is a device that presses IC or COF on a panel that has already been attached with conductive film (ACF) and pre pressed with IC or COF. The picking and placing of the panel is manually completed, and the main bonding, timing, and feeding are automatically completed by the equipment.
4. Equipment applicable products: This equipment is suitable for pre and main bonding IC on hard glass display screens, pre and main bonding COF on hard glass display screens, pre and main bonding IC on flexible display screens, and pre and main bonding COF on flexible display screens.

1.Platform size: pre bonding: W: 180mm (bonding length) * D: 220mm
main bonding: W: 180mm (bonding length) * D: 220mm
2 LCD size Max: 7 ”  Min：3″
The specifications of the IC tray and IC box are 2 inches, 3 inches, and 4 inches;
4 COF loading platform COF loading: universal loading unit for all specifications (only COF, without large row);
5 IC size Max： L*W:38*3 mm
Min：L*W:7*0.5 mm
The gap between IC and small glass step is ≥ 0.4mm
6 COF size Max： L*W:65*45 mm
Min：L*W:20*10 mm
COF and small glass step gap ≥ 0.4mm
7 Equipment dimensions Machine width: approximately 920mm
Machine depth: approximately 900 mm
Machine height: approximately 1590 mm
Workbench height: Pre bonding: approximately 830 ± 30 mm
main bonding: about 810 ± 30 mm
8. Use a clean workshop with a constant temperature, humidity, cleanliness, and dust-free environment
Temperature: 22-27 ℃
Humidity: 40%~70%
9. Equipment weight approximately: 430 Kg
10 machine colors: The surface color of the rack is beige, and other parts are chrome plated or oxidized
11. Use a clean room with a clean and dust-free environment
12. Equipment delivery status: The surface should be clean and dust-free. Warning signs should be affixed to areas with dangerous conditions such as bonding heads.

Product type: single-sided single piece
Equipment precision pre bonding:
IC：X：≦±0.003mm， Y：≦±0.003 mm
COF：X：≦±0.004mm， Y：≦±0.005 mm
This main bonding:
IC：X：≤±0.005mm， Y：≤±0.005 mm
COF：X：≤±0.005mm， Y：≤±0.005 mm
Equipment production capacity: Glass screen pressure IC: about 450PCS/H
Flexible screen pressure IC: approximately 250PCS/H
Glass screen COF: approximately 300PCS/H
Flexible screen pressure COF: about 200PCS/H
Suitable for PITCH IC: 18um;
COF：20um；
Equipment failure rate ≤ 2%
Product qualification rate ≥ 98%
Change time for the new model, with a calibration time of approximately 20 minutes
Switching to the original model, with a tuning time of approximately 15 minutes
The number of formulas is about 100sets