描述

7-17inch Medium size FOG FOB Pre-and Main-Bonding Repair machine-OL-F173

Description:

This equipment is a manual bonding that performs alignment bonding for repairing FPC on a PCB or glass that has already been attached with a conductive film (ACF). The removal, placement, and alignment of PCB and FPC are manually completed, while bonding is automatically completed by the equipment.

Usage：

This equipment is suitable for the repair of defective products in medium size FOG and FOB.

Technical Parameters:
LCD SIZE： 7~17.3inch
Capacity: 200~350 segments/H
Maximum number of segments ≤10
Bonding accuracy: X±0.08mm,Y±0.08mm;
Heating method: Constant temperature control;
Temperature range: RT-400℃;
Working air pressure: 0.4~0.6Mpa;
Power Supply: 220V，50HZ，3500W;
Total weight: About700Kg;
Dimensions: L1580*W1020*H1610;