描述

55″ OLB PCB ACF attaching COF bonding PCB bonding semi automatic production line

55″ OLB ACF attaching machine, COF pre-bonding machine, COF main-bonding machine ,PCB ACF attaching machine PCB prebonding main bonding machine

 

55″ OLB ACF attaching machine:

This equipment is multi segments ACF attaching machine, could attach ACF on PCB. PCB taken and put was manuel, heat press, cut and length control is automatic.

This equipment is mainly used for pasting ACF or double-sided equipment on glass. This equipment starts pasting multiple positions on multiple sides of a product each time, suitable for mass production.

1. The equipment is controlled by PLC and steps with high precision
Motor control strip length;
2. The equipment adopts semi-shear (only cutting off ACF but not cutting off centrifugation)
Film, shear depth and position can be adjusted freely;
4. The number of edges attached to a product and the number of segments on each side
And the attachment position of each section can be set according to the requirements;
5. Adopt general template design, making product switching easier;
6. The longest ACF attached to each section can be as long as 90mm;

LCD Size：： 15~55″ STN/CSTN/TFT-LCD;
Capability： About600 segments ／h;
PanelThickness： 0.3~1.1mm;
COFPressing Area： 6~80mm;
Actual Accuracy: X±0.2mm,Y±0.1mm;
Press Head size： 90*5mm,Customerized
Flatness of heat press heat : ±5μm;
Heating Model： Constant temperature
Temperature Ranges： RT-200℃;
Temperature Accuracy： ±3℃;
Fix model： Vac-sorb;
Gas Consumption： 0.3 CBM/min
Working Voltage： 0.4~0.6Mpa;
Power Supply： 220V，50HZ，1200W;
G.W.： 350Kg;
Outer Size： L800*W840*H1310(720);

COF pre-bonding machine:

The left station of the equipment meets the requirements of high-precision COF TO tft-lcd, oled-lcd, on-cell, in-cell alignment and pre bonding. The equipment is mainly suitable for mass production.

1. High-precision imaging unit is adopted to lift the magnification number
Nearly 100 times higher;
2. Automatic absorption and correction of COF and automatic completion of alignment;
3. The rotating mechanism design can produce 2K,4K and 8K
Screen.
4. Adopt constant temperature heating method, suitable for all kinds of products.
5, PLC control action and high precision temperature control module control temperature, improve the stability of the whole machine.
5. Panasonic alignment system is adopted for higher alignment accuracy;
6. The equipment is controlled by PLC, with high precision servo
Motor control position;

LCD Size：： 15~55″ STN/CSTN/TFT-LCD;
Capability： About600 segments ／h;
PanelThickness： 0.3~1.1mm;
COFPressing Area： 6~80mm;
Actual Accuracy: ±0.003mm;
Press Head size： 80*5mm,Customerized
Flatness of heat press heat : ±5μm;
Heating Model： Constant temperature
Temperature Ranges： RT-200℃;
Temperature Accuracy： ±3℃;
Fix model： Vac-sorb;
Gas Consumption： 0.5 CBM/min
Working Voltage： 0.4~0.6Mpa;
Power Supply： 220V，50HZ，1500W;
G.W.： 550Kg;
Outer Size： L800*W840*H1310(720);

 

COF main-bonding machine:

This equipment can meet the high precision COF TO tft-lcd, oled-lcd, on-cell, in-cell and flexible OLED. It is mainly used for the mass production of COF.

1. Panasonic control system is adopted to control the equipment action;
2. SMC precision pressure regulating control system is adopted for pressure regulation
Accurate;
3. Adopt thermostatic heating method and AUTONICS temperature in Korea
The controller realizes accurate temperature control.
4. The upper and lower pressure heads are made of high density tungsten steel, which is better
Ensure the flatness of the pressed surface.
5. The pressure head adopts the design of 8 groups of pressure heads, with each position of pressure head
It can move, it can move;
6. Each product can realize four times of cost pressure after starting at one time.
1~8 headers can be enabled for each local pressure, so 1
Secondary pressure can be used for up to 32 COF;
7, the product up and down material can be set freely, take and put the material can
You can be on the same side or you can be on different sides;

LCD Size：： 15~55″ STN/CSTN/TFT-LCD;
Capability： About800 pcs COF／h;
PanelThickness： 0.3~1.1mm;
COFPressing Area： 6~80mm;
Actual Accuracy: ±0.003mm;
Press Head size： 80*1mm,Customerized
Flatness of heat press heat : ±5μm;
Heating Model： Constant temperature
Temperature Ranges： RT-400℃;
Temperature Accuracy： ±3℃;
Fix model： Vac-sorb;
Gas Consumption： 0.2 CBM/min
Working Voltage： 0.4~0.6Mpa;
Power Supply： 220V，50HZ，3500W;
G.W.： 550Kg;
Outer Size： L800*W840*H1310(720);

 

PCB ACF attaching machine:

This equipment is mainly used for pasting ACF or double-sided equipment on PCB. This equipment starts pasting multiple positions on multiple sides of a product each time, suitable for mass production.

1. The equipment is controlled by PLC and steps with high precision
Motor control strip length;
2. The equipment adopts semi-shear (only cutting off ACF but not cutting off centrifugation)
Film, shear depth and position can be adjusted freely;
4. The number of edges attached to a product and the number of segments on each side
And the attachment position of each section can be set according to the requirements;
5. Adopt general template design, making product switching easier;
6. The longest ACF attached to each section can be as long as 90mm;
7. Adopt multi-section design to save ACF tape;

PCB size”： 30mm~600mm;
Capability： About600 segments ／h;
mmThickness： 0.3~3mm;
ACF length： 1~90mm;
Actual Accuracy: X±0.2mm,Y±0.1mm;
Press Head size： 90*5mm,Customerized
Flatness of heat press heat : ±5μm;
Heating Model： Constant temperature
Temperature Ranges： RT-200℃;
Temperature Accuracy： ±3℃;
Fix model： Vac-sorb;
Gas Consumption： 0.2 CBM/min
Working Voltage： 0.4~0.6Mpa;
Power Supply： 220V，50HZ，1000W;
G.W.： 250Kg;
Outer Size： L800*W840*H1310(720);

 

55″ PCB pre bonding and main bonding machine:

This equipment meets the high precision PCB TO COF/FPC alignment and pre-cost pressure, mainly used for the mass production of COF.

1. Panasonic control system is adopted to control the equipment action;
2. SMC precision pressure regulating control system is adopted for pressure regulation
Accurate;
3. Adopt thermostatic heating method and AUTONICS temperature in Korea
The controller realizes accurate temperature control.
4. The upper and lower pressure heads are made of high density tungsten steel, which is better
Ensure the flatness of the pressed surface.
5. The pressure head adopts the design of 8 groups of pressure heads, with each position of pressure head
It can move, it can move;
6. Each product can realize four times of cost pressure after starting at one time.
1~8 headers can be enabled for each local pressure, so 1
Secondary pressure can be used for up to 32 COF;
7. The device is designed with four sets of lenses, which can be passed
Four sets of lenses for alignment;

LCD Size：： 15~55″ STN/CSTN/TFT-LCD;
Capability： About200 times／h，Notmal 600 COF／;
PanelThickness： 0.3~1.1mm;
COFPressing Area： 6~80mm;
Actual Accuracy: ±0.01mm;
Press Head size： 80*1mm,Customerized
Flatness of heat press heat : ±5μm;
Heating Model： Constant temperature
Temperature Ranges： RT-400℃;
Temperature Accuracy： ±3℃;
Fix model： Vac-sorb;
Gas Consumption： 0.3 CBM/min
Working Voltage： 0.4~0.6Mpa;
Power Supply： 220V，50HZ，3500W;
G.W.： 450Kg;
Outer Size： L800*W840*H1310(720);