This is a TFOF (Thin Film On Flex) bonder machine used in the bonding process. It is designed for OLED TP (Touch Panel) bonding and integrates multiple functions such as pre-pressing, alignment, and main pressing. The machine is equipped with advanced CCD vision systems for precise alignment and bonding.
1. Technical Parameters
1.1 Product Specifications
Product Size Range: 1 inch to 7 inches
Applicable Product Types: OLED TP bonding and main FPC (Flexible Printed Circuit) integration
1.2 Production Cycle
Production Cycle: 3.5 seconds
1.3 Equipment Precision
Equipment Alignment Precision: ±0.01 mm
1.4 Positioning and Alignment
Positioning Method: Visual alignment
Mark Points: Additional mark points can be added as required for alignment
CCD Vision Alignment: CCD vision system for precise alignment
1.5 Changeover Time
New Model Changeover Time: 50 minutes
Old Model Changeover Time: 30 minutes
1.6 Power Supply
Working Power Supply / Power: 220V / 50 Hz / 8 kW
1.7 Vacuum Supply
Vacuum Supply: Vacuum pump
1.8 Air Supply
Main Air Supply / Air Consumption: 0.5 to 0.7 MPa / 150 L/min
1.9 Device Dimensions and Weight
Device Dimensions: 2400 mm (L) × 1230 mm (W) × 1850 mm (H) (excluding the three-color light)
Device Weight: Approximately 1800 kg
1.10 Working Height
Working Height: 1000 ± 20 mm
2. Product Introduction
The TFOF Bonder Machine is a highly advanced and precise machine designed for the bonding process in OLED TP manufacturing. It integrates multiple functions, including pre-pressing, alignment, and main pressing, to ensure high-quality bonding.
Key Features:
High Precision: The machine achieves an alignment precision of ±0.01 mm, ensuring accurate and reliable bonding.
Advanced CCD Vision System: Equipped with multiple CCD cameras for precise alignment and bonding, including cameras for material feeding, COF (Chip On Flex) bonding, and alignment.
Efficient Production: With a production cycle of 3.5 seconds, the machine is highly efficient, making it ideal for high-volume production.
Versatility: It supports a wide range of product sizes from 1 inch to 7 inches and is suitable for OLED TP bonding and main FPC integration.
Durable Construction: Built with high-quality materials and components, the machine ensures long-term reliability and performance.
Applications:
Ideal for OLED TP manufacturing facilities requiring high-precision and efficient bonding processes. The machine is designed to handle various product types and sizes, providing a comprehensive solution for TP bonding.
After-Sales Support:
Training: Comprehensive training on equipment installation, operation, maintenance, and troubleshooting.
Service: One year of free service (excluding human damage) and lifelong technical support.
The TFOF Bonder Machine is a cost-effective and efficient solution for modern OLED TP production, offering advanced technology and reliable performance.
