Fully Automatic FOB Bonder for 5-17inch Displays provides a manufacturing, precision, speed, and reliability platform for FPC-PCB bonding.
Overview
The Fully Automatic FOB (FPC on Board) Bonder is a sophisticated solution designed for the high-precision bonding of multiple FPCs (Flexible Printed Circuits) onto PCBs (Printed Circuit Boards) for mid-size Liquid Crystal Module (LCM) displays ranging from 5 to 17.3 inches. This solution integrates advanced technologies such as automated ACF (Anisotropic Conductive Film) application, high-precision imaging systems, and robotic handling to ensure superior product quality and production efficiency.
Key Features
- High-Precision Bonding: Achieves bonding accuracy of X±20um and Y±40um.
- Automated ACF Application: Ensures precise ACF application with X±0.20mm and Y±0.10mm accuracy.
- Multiple FPC Support: Capable of bonding up to 6 FPCs of 2 different types.
- Fast Production Rate: Achieves a cycle time of ≤7.5 seconds for 5-11″ displays and ≤9.8 seconds for 11-17.3″ displays.
- Robust Construction: Features a high-rigidity structure for stability and durability.
- Advanced Imaging System: Utilizes high-resolution cameras and Japanese-imported image processors for precise alignment.
- Temperature Control: Equipped with a high-precision constant temperature heating system.
Equipment Composition
- FOB Host Machine: Core unit for ACF application, alignment, and bonding.
- PCB Auto-Loader: Provides continuous PCB supply with non-stop loading capability.
- LCD Handling System: Manages LCD movement with precision and care.
- ACF Application Unit: Applies ACF material accurately and efficiently.
- Pre-bonding and Main bonding Units: Ensures reliable bonding through precise pressure application.
- AOI+ART Inspection System: Detects defects and ensures quality.
Technical Specifications
- LCD Dimensions: 5″ to 17.3″ (MIN: 100×80mm, MAX: 403×293mm).
- FPC Dimensions: MIN: 10×10mm, MAX: 85×50mm.
- PCB Dimensions: MIN: 75×10mm, MAX: 400×100mm.
- ACF Parameters: Supports SONY/HITACHI ACF, with widths of 0.6mm to 2.0mm and lengths of 5-157mm.
- Environmental Requirements: Operates in Class 1000 cleanroom conditions.
- Power Requirements: Three-phase AC380V (±5%), 18KW.
Process Flow
- PCB Loading: PCBs are loaded automatically with vision alignment.
- ACF Application: ACF is applied precisely onto the PCB.
- FPC & PCB Alignment: High-precision imaging systems align FPCs with PCBs.
- Pre-bodning: pre-bonding is applied to position components accurately.
- Main bonding: Final bonding is performed with controlled pressure and temperature.
- AOI+ART Inspection: Products are inspected for quality and defects.
Safety and Reliability
- ESD Protection: Equipped with ionizers and anti-static materials.
- Emergency Stop: Quick-response emergency stop functionality.
- Over-Temperature Protection: Prevents equipment damage from overheating.
- Dust Control: FFU (Fan Filter Unit) systems maintain cleanroom conditions.
After-Sales Support
- Comprehensive Training: Covers equipment operation, parameter settings, and maintenance.
- Technical Support: One-year free warranty (excluding人为 damage) with lifetime technical support.
- Documentation: Detailed operation manuals and troubleshooting guides.
Conclusion
The Fully Automatic FOB Bonder for 5-17inch Displays is a cutting-edge solution for mid-size display manufacturing, combining precision, speed, and reliability. It is designed to meet the demands of modern display production, ensuring high yield and product quality. Whether for consumer electronics or industrial displays, this solution provides a robust platform for efficient FPC-PCB bonding.
